EP2324074A1 - A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material - Google Patents

A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material

Info

Publication number
EP2324074A1
EP2324074A1 EP20080876944 EP08876944A EP2324074A1 EP 2324074 A1 EP2324074 A1 EP 2324074A1 EP 20080876944 EP20080876944 EP 20080876944 EP 08876944 A EP08876944 A EP 08876944A EP 2324074 A1 EP2324074 A1 EP 2324074A1
Authority
EP
Grant status
Application
Patent type
Prior art keywords
graphite
metal complex
aluminum
heat
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20080876944
Other languages
German (de)
French (fr)
Other versions
EP2324074A4 (en )
Inventor
Nobuyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Material Technologies Co Ltd
Applied Nanotech Inc
Original Assignee
Applied Nanotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

To provide a heat radiator that is useful for an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and falls at high temperatures. To constitute a heat radiator that is low in cost, superior in mechanical strength, and, furthermore, superior in heat radiating effect, by combining a graphite -metal complex that is good in heat diffusivity and an aluminum heat sink that is large in heat radiating surface area.

Description

A HEAT RADIATOR COMPOSED OF A COMBINATION OF A GRAPHITE- METAL CQMPLEXANDANALUMINUM EXTRUDED MATERIAL

BACKGROUND

[0001] Graphite-based metal complex materials are known wherein metal is dispersed in a graphite molding sintered from a molding by unidirectional pressure using a metal complex material, extruded molding, or cold isostatic pressure molding wherein a metal matrix and graphite particles or graphite fibers have been dispersed as a material in a graphite-metal complex incorporating a graphite material. (Japanese Patent Application Hl 1-321828, Patent Application 2001135551)

[0002] On one hand it is known that with complexes that incorporate graphite, when the thermal diffusivity of material normally used as heat transfer media such as aluminum, copper or aluminum nitride that have a high thermal diffusivity of 1.5-3 cm /sec is compared to 0 7-1.0 cm /sec, the heat spreading performance thereof is superior.

[0003] On the other hand, with complexes that incorporate graphite, such as complexes with aluminum in which a graphite extruded material has been used, the bend strength is 30-40 Mpa, the elastic coefficient thereof is low at 12 Gpa, and, in comparison to regularly used metals such as aluminum, magnesium, titanium, copper, or iron, etc. a mechanical strength of 1/10 or less is assumed. In addition, the provision of an aluminum extruded material for heat sink is low in cost as it is mass produced, while graphite-metal complexes are comparatively high in cost. BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a diagram of a graphite-metal complex and aluminum heat sink (flat board type).

Fig. 2 is a diagram of a graphite-metal complex and aluminum heat sink (column type).

Fig 3 is a diagram of a graphite-metal complex aluminum heat sink (prism type) Fig. 1 of Fig-1 is a flat board type metal complex (2) and aluminum heat sink (3). Fig. 2 and Fig 3 are respectively a column type and graphite-metal complex (2) and aluminum heat sink (3).

DETAILED DESCRIPTION

[0004] The invention relates to a heat radiator composed of a combination of a suitable graphite-iron complex and aluminum extruded material on an LED package, high-load semiconductor, high-load capacitor or an integrated circuit board composed of a combination thereof that assumes a short lifetime and fails at high temperatures.

[0005] The purpose of the invention is to take into account the aforementioned problems and provide a heat radiator that, while maintaining the properties of good thermal diffusivity of graphite metal complexes, reinforces the weak mechanical properties that are a drawback thereof, and furthermore, is lower in cost.

[0006] The inventor reached an invention summarized as follows below that positively achieves the aforementioned purpose, by devising a combination of the material used. [0007] A heat radiator wherein a graphite-metal complex obtained by pressure-impregnating aluminum, copper or an alloy thereof into a graphite molding incorporating a 50-92 volume % of graphite powder by squeeze casting is cut into board shapes or column shapes, etc., which are aligned and arrayed into the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.

[0008] A heat radiator wherein aluminum, copper or an alloy thereof is pressure-impregnated by squeeze casting into a molding incorporating a 50-92% combination of short fiber material of chopped graphite fibers and man-made graphite, and the obtained graphite-metal complex is cut and arrayed so that it properly conforms to the shape of a heat sink composed of an extruded material of aluminum or aluminum alloy.

[0009] The molding method of the molding graphite powder of copped graphite fibers incorporating graphite powder is one of molding by unidirectional pressure, using an extruded molding or cold.

[0010] The invention enables the utilization of the good heat diffusivity of a graphite-metal complex, with the weakness in mechanical strength of a graphite- metal complex reinforced by bringing it into contact with an aluminum or aluminum alloy metal extruded material. In addition, low cost is achieved by preparing everything with a graphite-metal complex.

[0011] Thus, an economically superior heat radiator is provided wherein the heat generated by an LED package, high-load semiconductor, high-load capacitor or integrated circuit board is efficiently diffused by the graphic-metal complex, and the heat is radiated by a heat sink of strong aluminum alloy from fins having a large surface area. [0012] The manufacturing method of the graphite-metal complex is pressure- impregnation by squeeze casting. The graphite used during this may be one in which man-made graphite is extruded with tar, pitch or an organic resin, one made by cold isostatic molding or one molded by unidirectional pressure with a die, which is then ultimately heat-treated at 25000C or more, and consequentially close to 100% forms a graphite system.

[0013] In addition, during this, chopped graphite fiber may be incorporated.

[0014] As described above, the obtained graphite-metal complex is superior for machining, and can be easily worked into board, column or prism shapes, etc.

[0015] On one hand, various shapes of aluminum extruded materials are prepared. These consist of fins and parts that bundle these, and, as described by Fig. 1 below, 1 is a heat radiator, 2 is a graphite-metal complex, 3 is a heat sink of aluminum extruded material, and 2 is a board in contact with 3. In Fig. 2, the 2 graphite-metal complex is column- shaped, the outer surface thereof coming into contact with the inner surface of the 3 aluminum extruded material. In Fig. 3, the 2 graphite-metal complex is prism-shaped, the four-sided surface thereof coming into contact with the inside surface of the 3 aluminum extruded material.

[0016] The connection method of the graphite-metal complex and heat sink may be a shrink-fit method, as the thermal expansion rate of the graphite-metal complex is 7 x 10"6 1/K, and that of the aluminum is 23 x 10"6 1/K in Fig. 2 and Fig. 3, for example. A set screw with silicon grease between the graphite-metal complex and heat sink, or plating and soldering, on both sides, may be used with the embodiment in Fig 1. [0017] The aluminum heat sink used in the invention is not limited to an extruded material, and a die-cast, casted or forged materials, etc. may be utilized. Thus, the substance may be an aluminum alloy, but a JIS A 1000 or JIS A 6000 series alloy is more suitable as it is both workable and high in thermal conductivity.

[0018] The types of graphite used in the invention are natural graphite and man-made graphite, and commercially-available graphite blocks are acceptable.

[0019] A 50%-95% volume fraction may be used for the graphite in the graphite-metal complex. If it is 50% or less, the heat diffusivity rate is low, and so is not suitable for the heat radiator in the invention.

[0020] 65%-95% is more preferable.

[0021] The metal used in the graphite-metal complex is aluminum, an aluminum alloy, copper or a copper alloy. The aluminum alloy used may be of a JIS wrought material series or a JIS cast metal material series, etc. However, an alloy with a low melting point is preferred. As for copper alloy, a JIS C 1000 series-7000 series wrought copper materials, etc. may be used.

[0022] A heat radiator obtained as described above achieves a more efficient heat radiator, by using a graphite-metal complex superior in heat diffusivity at the position that makes contact with a heat source, and combining an aluminum heat sink of large heat radiating surface area at the position that makes contact with the graphite-metal complex.

[0023] In addition, the aforementioned heat radiator is capable of functioning as a structure by reinforcing the weak mechanical strength of the graphite-metal complex with an aluminum heat sink. [0024] Below, we will describe an example in detail.

[0025] The size of an electrode graphite block (Tokai Carbon UHP) remains at 150 mm x 200 mm x 250 mm at 7000C in an argon atmosphere, while a JIS-AC3 A aluminum alloy melts at 7000C. These are introduced into a die for squeeze casting, and casting is completed at a pressure of 60 Mpa.

[0026] A graphite-metal complex was obtained from the casting, which was then cut into boards 2 mm thick in length and had sides 20 mm in size, and, after 4W LED had been mounted on top of these, they were brought into contact with the 30 mm x 25 mm of an aluminum (JIS A 6063 extruded material) heat sink with 10 fins that are 10 mm in length, and when they were energized 333 mA with 12 V and the temperature was measured after one hour, the LED tops were 38°C and the heat sink fins were 260C. Furthermore, the room temperature was 220C.

[0027] Instead of the graphite-metal complex 111 the aforementioned

Working Example 1, a JIS A 1050 board of the same size was used, and when the same test was performed, the LED tops were 1050C and the heat sink fins were

700C.

[0028] Instead of the graphite-metal complex in the aforementioned Working

Example 1, a JIS A 1050 board of the same size was used, in reverse, a heat sink was prepared of the same shape as the aluminum heat sink in Working Example 1 by processing a graphite-metal complex, and when the same test was performed, the LED tops were 98°C and the heat sink tins were 54°C.

[0029] A 150 mm x 200 mm board 3 mm thick was prepared from the graphite-metal complex in the above example, and then screwed onto the 2 mm thickness of the flat board section of an aluminum heat sink with the same 150 mm x 200 mm size with 30 fins that are 30 mm tall. A 120 W heat discharge integrated circuit board was disposed on a graphite-metal complex board, and when a temperature measurement was taken after two hours, the graphite-metal complex board was 450C, and the fins of the aluminum heat sink were 350C.

[0030] When a temperature measurement was taken under the same conditions of the flat board section of an aluminum heat sink as in the example above with a thickness other than 5 mm, the temperature of the flat board section was 970C and the fins were 7O0C.

[0031] The heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material, etc. in the invention combines those that have superior heat diffusivity and those in which a low-cost aluminum heat sink have a large heat radiating surface area, and therefore is effective in radiating the heat of an LED package, high-load capacitor or an integrated circuit board composed of a combination thereof, and is useful in a wide range of industrial fields.

Claims

WHAT IS CLAIMED IS;CLAIMS
1. A heat radiator wherein aluminum, copper or an alloy thereof has been pressure-impregnated by squeeze casting into a graphite molding that incorporates a 50-92 volume % graphite powder, and the obtained graphite-metal complex is cut into board shapes and brought into contact with the part of the flat or curved sections of a heat sink composed of an extruded material of aluminum or aluminum alloy.
2. A molding that incorporates a 50-92% volume% of combined chopped fibers of graphite and man-made graphite instead of the graphite powder in Claim 1.
3. A heat radiator wherein the graphite-metal complex in Claim 1 is cut into column shapes or prism shapes, which are disposed in the middle of a heat sink wherein the fins of the heat sink have been radially arrayed, and the column or prism sides touch the heat sink
4. The graphite used in Claml 1, Claim 2 and Claim 3 is derived from a molding by unidirectional pressure, using an extruded molding, a cold isostatic pressure molding and a die.
EP20080876944 2008-09-11 2008-12-29 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material Withdrawn EP2324074A4 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008233604A JP5335339B2 (en) 2008-09-11 2008-09-11 Heat radiator comprising a combination of graphite-metal composite and aluminum extrusions.
PCT/US2008/088461 WO2010030307A1 (en) 2008-09-11 2008-12-29 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material

Publications (2)

Publication Number Publication Date
EP2324074A1 true true EP2324074A1 (en) 2011-05-25
EP2324074A4 true EP2324074A4 (en) 2012-06-13

Family

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Family Applications (1)

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EP20080876944 Withdrawn EP2324074A4 (en) 2008-09-11 2008-12-29 A heat radiator composed of a combination of a graphite-metal complex and an aluminum extruded material

Country Status (5)

Country Link
US (1) US20110259570A1 (en)
EP (1) EP2324074A4 (en)
JP (1) JP5335339B2 (en)
KR (1) KR20110085978A (en)
WO (1) WO2010030307A1 (en)

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US20110147647A1 (en) * 2009-06-05 2011-06-23 Applied Nanotech, Inc. Carbon-containing matrix with additive that is not a metal
US20100310447A1 (en) * 2009-06-05 2010-12-09 Applied Nanotech, Inc. Carbon-containing matrix with functionalized pores
JP5622465B2 (en) * 2010-07-22 2014-11-12 ローム株式会社 Method of manufacturing a Led light bulb and led light bulb
CN102114495A (en) * 2010-11-25 2011-07-06 深圳市天电光电科技有限公司 Method for manufacturing LED radiator
WO2012100022A3 (en) * 2011-01-19 2012-11-01 Graftech International Holdings Inc. Thermal solution for led bulbs
DE102011081687A1 (en) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Semiconductor device with a heat sink
JP2014047127A (en) 2012-09-04 2014-03-17 Toyo Tanso Kk Metal-carbon composite material, manufacturing method of metal-carbon composite material, and sliding member
JP6164632B2 (en) * 2013-01-11 2017-07-19 株式会社アカネ The method of producing a carbon-based metal composite material
KR101301624B1 (en) * 2013-07-05 2013-08-29 (주) 동양에이.케이코리아 Manufacturing method of including carbon aluminium or aluminium alloy extrusion and using included carbon aluminium or aluminium alloy extrusion
CN105916348A (en) * 2016-03-25 2016-08-31 华为技术有限公司 Electronic device middle frame fitting and manufacturing method thereof
CN106531874A (en) * 2016-11-30 2017-03-22 南京劲峰洋光电科技有限公司 Novel heat dissipation insulating composite material and preparation method therefor
CN107022690A (en) * 2017-05-03 2017-08-08 合肥工业大学 Method for preparing aluminum/carbon-based composite material in aluminum alloy pressure permeation mode

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Also Published As

Publication number Publication date Type
WO2010030307A1 (en) 2010-03-18 application
US20110259570A1 (en) 2011-10-27 application
EP2324074A4 (en) 2012-06-13 application
KR20110085978A (en) 2011-07-27 application
JP5335339B2 (en) 2013-11-06 grant
JP2010067842A (en) 2010-03-25 application

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