JP2010056500A - 薄型基板ピッチ測定装置及びウェハーピッチ測定装置 - Google Patents
薄型基板ピッチ測定装置及びウェハーピッチ測定装置 Download PDFInfo
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- JP2010056500A JP2010056500A JP2008250638A JP2008250638A JP2010056500A JP 2010056500 A JP2010056500 A JP 2010056500A JP 2008250638 A JP2008250638 A JP 2008250638A JP 2008250638 A JP2008250638 A JP 2008250638A JP 2010056500 A JP2010056500 A JP 2010056500A
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- Prior art keywords
- pod
- thin substrate
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- pitch
- wafer
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- 239000000758 substrate Substances 0.000 title claims abstract description 128
- 238000005259 measurement Methods 0.000 title abstract description 14
- 235000012431 wafers Nutrition 0.000 claims description 51
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 230000004907 flux Effects 0.000 abstract description 6
- 239000011295 pitch Substances 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 230000006378 damage Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
【解決手段】ポッド内の薄型基板に光束を発し、この薄型基板から反射される光束を受ける光電素子と、光電素子を薄型基板の垂直方向に沿って移動させ、ポッド内の複数の薄型基板の間の垂直ピッチを測定する走査装置と、ポッドを載せ、複数の角度に回転させて、これらの薄型基板の間の垂直ピッチを測定する回転台座とを主に含む。
【選択図】図4B
Description
11 スロット
12 前開口部
13 後開口部
20 ドア
30 光電素子
31 発光器
32 受光器
40 走査装置
50 回転台座
60 操作インターフェース
61 ステータスランプ
62 振動防止装置
70 水平移動装置
S 薄型基板
Claims (2)
- ポッド内に置かれた複数の薄型基板の間の垂直ピッチを測定する薄型基板ピッチ測定装置であって、
該ポッド内の薄型基板に光束を発し、該薄型基板から反射される光束を受ける光電素子と、
該光電素子をこれらの薄型基板の垂直方向に沿って移動させる走査装置と、
該ポッドを載せ、複数の角度に回転させて、これらの薄型基板の間の垂直ピッチを測定する回転台座と、
とを含む薄型基板ピッチ測定装置。 - ポッド内に置かれた複数のウェハーの間の垂直ピッチを測定するウェハーピッチ測定装置であって、
該ポッド内のウェハーに光束を発し、該ウェハーから反射される光束を受ける光電素子と、
該光電素子をこれらのウェハーの垂直方向に沿って移動させる走査装置と、
該ポッドを載せ、複数の角度に回転させて、これらのウェハーの間の垂直ピッチを測定する回転台座と、
を含むウェハーピッチ測定装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097132634A TWI330707B (en) | 2008-08-27 | 2008-08-27 | A system for measuring the vertical distance between the thin substrates |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012003350U Continuation JP3177757U (ja) | 2008-08-27 | 2012-06-05 | 薄型基板ピッチ測定装置及びウェハーピッチ測定装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010056500A true JP2010056500A (ja) | 2010-03-11 |
Family
ID=41665792
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008250638A Pending JP2010056500A (ja) | 2008-08-27 | 2008-09-29 | 薄型基板ピッチ測定装置及びウェハーピッチ測定装置 |
JP2012003350U Expired - Fee Related JP3177757U (ja) | 2008-08-27 | 2012-06-05 | 薄型基板ピッチ測定装置及びウェハーピッチ測定装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012003350U Expired - Fee Related JP3177757U (ja) | 2008-08-27 | 2012-06-05 | 薄型基板ピッチ測定装置及びウェハーピッチ測定装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7663129B1 (ja) |
JP (2) | JP2010056500A (ja) |
TW (1) | TWI330707B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102091892B1 (ko) * | 2012-04-16 | 2020-03-20 | 로제 가부시키가이샤 | 수납 용기, 수납 용기의 셔터 개폐 유닛 및 이들을 사용한 웨이퍼 스토커 |
CN104061870B (zh) * | 2013-03-18 | 2017-02-08 | 神讯电脑(昆山)有限公司 | 间隙量测方法 |
CN104576436B (zh) * | 2013-10-12 | 2018-05-08 | 北京北方华创微电子装备有限公司 | 片盒位置检测装置、传输系统及半导体加工设备 |
CN104637839B (zh) * | 2013-11-13 | 2017-06-09 | 沈阳新松机器人自动化股份有限公司 | 一种Loadport内晶圆状态的距离检测系统 |
US9786530B2 (en) * | 2014-10-20 | 2017-10-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transfer method and system |
US9936089B2 (en) * | 2015-12-30 | 2018-04-03 | Kodak Alaris Inc. | Mobile autonomous scalable scanner system |
US9906664B2 (en) * | 2015-12-30 | 2018-02-27 | Kodak Alaris Inc. | Mobile autonomous scalable scanner system |
CN110379735B (zh) * | 2019-06-28 | 2021-10-26 | 福建省福联集成电路有限公司 | 一种晶圆斜插检测装置 |
CN114689108A (zh) * | 2020-12-30 | 2022-07-01 | 深圳中科飞测科技股份有限公司 | 检测方法、检测装置、检测设备及计算机可读存储介质 |
US11996308B2 (en) * | 2021-03-03 | 2024-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for mapping wafers in a wafer carrier |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110745A (ja) * | 1986-10-29 | 1988-05-16 | Nissin Electric Co Ltd | ウエハ収納装置 |
JPH06104326A (ja) * | 1992-09-18 | 1994-04-15 | Tokyo Electron Ltd | 処理システム |
JP2000097886A (ja) * | 1998-09-21 | 2000-04-07 | Rigaku Industrial Co | 蛍光x線分析装置 |
JP2003282675A (ja) * | 2002-03-20 | 2003-10-03 | Tokyo Seimitsu Co Ltd | ウエハマッピング装置 |
JP2004119835A (ja) * | 2002-09-27 | 2004-04-15 | Yaskawa Electric Corp | 薄型基板検出装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5225691A (en) * | 1992-05-18 | 1993-07-06 | Avalon Engineering, Inc. | Semiconductor wafer cassette mapper with emitter and detector arrays for slot interrogation |
US5308993A (en) * | 1993-03-28 | 1994-05-03 | Avalon Engineering, Inc. | Semiconductor wafer cassette mapper having dual vertical column of light emitting apertures and a single vertical column of light receiving apertures |
US5418382A (en) * | 1993-09-23 | 1995-05-23 | Fsi International, Inc. | Substrate location and detection apparatus |
US5466945A (en) * | 1994-03-23 | 1995-11-14 | Eaton Corporation | Apparatus for detecting proper positioning of objects in a holder |
JP3058615B2 (ja) * | 1998-04-10 | 2000-07-04 | 株式会社山武 | ウエハ検出装置 |
US6188323B1 (en) * | 1998-10-15 | 2001-02-13 | Asyst Technologies, Inc. | Wafer mapping system |
TW409285B (en) * | 1999-04-13 | 2000-10-21 | United Microelectronics Corp | Wafer position mapping device |
US6514879B2 (en) * | 1999-12-17 | 2003-02-04 | Intel Corporation | Method and apparatus for dry/catalytic-wet steam oxidation of silicon |
JP3916148B2 (ja) * | 2002-11-15 | 2007-05-16 | Tdk株式会社 | ウェハーマッピング機能を備えるウェハー処理装置 |
-
2008
- 2008-08-27 TW TW097132634A patent/TWI330707B/zh not_active IP Right Cessation
- 2008-09-29 JP JP2008250638A patent/JP2010056500A/ja active Pending
- 2008-09-30 US US12/241,436 patent/US7663129B1/en active Active
-
2012
- 2012-06-05 JP JP2012003350U patent/JP3177757U/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110745A (ja) * | 1986-10-29 | 1988-05-16 | Nissin Electric Co Ltd | ウエハ収納装置 |
JPH06104326A (ja) * | 1992-09-18 | 1994-04-15 | Tokyo Electron Ltd | 処理システム |
JP2000097886A (ja) * | 1998-09-21 | 2000-04-07 | Rigaku Industrial Co | 蛍光x線分析装置 |
JP2003282675A (ja) * | 2002-03-20 | 2003-10-03 | Tokyo Seimitsu Co Ltd | ウエハマッピング装置 |
JP2004119835A (ja) * | 2002-09-27 | 2004-04-15 | Yaskawa Electric Corp | 薄型基板検出装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201009291A (en) | 2010-03-01 |
TWI330707B (en) | 2010-09-21 |
US20100051835A1 (en) | 2010-03-04 |
JP3177757U (ja) | 2012-08-16 |
US7663129B1 (en) | 2010-02-16 |
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