JP2010050298A5 - - Google Patents

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Publication number
JP2010050298A5
JP2010050298A5 JP2008213521A JP2008213521A JP2010050298A5 JP 2010050298 A5 JP2010050298 A5 JP 2010050298A5 JP 2008213521 A JP2008213521 A JP 2008213521A JP 2008213521 A JP2008213521 A JP 2008213521A JP 2010050298 A5 JP2010050298 A5 JP 2010050298A5
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JP
Japan
Prior art keywords
ground pattern
signal
frame ground
connection member
frame
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Application number
JP2008213521A
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English (en)
Japanese (ja)
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JP5063529B2 (ja
JP2010050298A (ja
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Priority to JP2008213521A priority Critical patent/JP5063529B2/ja
Priority claimed from JP2008213521A external-priority patent/JP5063529B2/ja
Publication of JP2010050298A publication Critical patent/JP2010050298A/ja
Publication of JP2010050298A5 publication Critical patent/JP2010050298A5/ja
Application granted granted Critical
Publication of JP5063529B2 publication Critical patent/JP5063529B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008213521A 2008-08-22 2008-08-22 プリント回路板 Expired - Fee Related JP5063529B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008213521A JP5063529B2 (ja) 2008-08-22 2008-08-22 プリント回路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213521A JP5063529B2 (ja) 2008-08-22 2008-08-22 プリント回路板

Publications (3)

Publication Number Publication Date
JP2010050298A JP2010050298A (ja) 2010-03-04
JP2010050298A5 true JP2010050298A5 (enrdf_load_stackoverflow) 2011-11-24
JP5063529B2 JP5063529B2 (ja) 2012-10-31

Family

ID=42067147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008213521A Expired - Fee Related JP5063529B2 (ja) 2008-08-22 2008-08-22 プリント回路板

Country Status (1)

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JP (1) JP5063529B2 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5609329B2 (ja) * 2010-03-12 2014-10-22 富士電機株式会社 プリント基板
JP6016376B2 (ja) * 2012-02-28 2016-10-26 三菱電機株式会社 配線板、電子ユニット及び配線板の製造方法
JP5868285B2 (ja) * 2012-08-09 2016-02-24 三菱電機株式会社 プリント基板
JP6422395B2 (ja) * 2015-05-18 2018-11-14 三菱電機株式会社 回路基板
CN109417846B (zh) 2016-06-24 2021-09-07 三菱电机株式会社 印刷基板
US10912187B2 (en) 2017-06-09 2021-02-02 Mitsubishi Electric Corporation Printed board
JP7373705B2 (ja) 2018-02-15 2023-11-06 パナソニックＩｐマネジメント株式会社 回路基板、電子機器
JP6867036B2 (ja) * 2018-03-26 2021-04-28 Ｎｅｃプラットフォームズ株式会社 無線通信装置およびノイズ抑制方法
KR102798197B1 (ko) 2019-01-14 2025-04-22 삼성전자주식회사 슬릿을 구비한 인쇄회로기판을 포함하는 전자 장치
DE112020006584B4 (de) 2020-03-25 2024-01-04 Mitsubishi Electric Corporation Platine und elektronisches Gerät
DE112021007463B4 (de) 2021-04-06 2025-02-13 Mitsubishi Electric Corporation Leiterplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11177274A (ja) * 1997-12-08 1999-07-02 Canon Inc プリント配線基板とケーブルおよび筐体との接続方法、および電子機器
JPH11317572A (ja) * 1998-05-06 1999-11-16 Hitachi Ltd 特性インピーダンス調整プリント基板
JP2000223799A (ja) * 1999-02-02 2000-08-11 Toshiba Corp 配線基板及びその製造方法
JP2001332825A (ja) * 2000-03-14 2001-11-30 Fuji Xerox Co Ltd 回路基板装置及び設計支援装置

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