JP2010050288A - 樹脂封止型半導体装置およびその製造方法 - Google Patents

樹脂封止型半導体装置およびその製造方法 Download PDF

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Publication number
JP2010050288A
JP2010050288A JP2008213409A JP2008213409A JP2010050288A JP 2010050288 A JP2010050288 A JP 2010050288A JP 2008213409 A JP2008213409 A JP 2008213409A JP 2008213409 A JP2008213409 A JP 2008213409A JP 2010050288 A JP2010050288 A JP 2010050288A
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JP
Japan
Prior art keywords
resin
heat sink
semiconductor device
gnd
relay electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008213409A
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English (en)
Japanese (ja)
Other versions
JP2010050288A5 (https=
Inventor
Shigeki Sakaguchi
茂樹 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2008213409A priority Critical patent/JP2010050288A/ja
Publication of JP2010050288A publication Critical patent/JP2010050288A/ja
Publication of JP2010050288A5 publication Critical patent/JP2010050288A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Lead Frames For Integrated Circuits (AREA)
JP2008213409A 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法 Withdrawn JP2010050288A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010050288A true JP2010050288A (ja) 2010-03-04
JP2010050288A5 JP2010050288A5 (https=) 2011-08-04

Family

ID=42067137

Family Applications (1)

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JP2008213409A Withdrawn JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Country Status (1)

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JP (1) JP2010050288A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298723A (zh) * 2015-05-13 2017-01-04 无锡华润安盛科技有限公司 一种双岛引线框框架
CN109564918A (zh) * 2016-08-10 2019-04-02 三菱电机株式会社 半导体装置
CN113972142A (zh) * 2020-07-22 2022-01-25 三菱电机株式会社 半导体装置的制造方法
CN115346948A (zh) * 2022-10-14 2022-11-15 吉光半导体(绍兴)有限公司 一种半桥模块

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298723A (zh) * 2015-05-13 2017-01-04 无锡华润安盛科技有限公司 一种双岛引线框框架
CN109564918A (zh) * 2016-08-10 2019-04-02 三菱电机株式会社 半导体装置
CN109564918B (zh) * 2016-08-10 2023-09-29 三菱电机株式会社 半导体装置
CN113972142A (zh) * 2020-07-22 2022-01-25 三菱电机株式会社 半导体装置的制造方法
CN115346948A (zh) * 2022-10-14 2022-11-15 吉光半导体(绍兴)有限公司 一种半桥模块

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