JP2009545891A - ベルヌーイワンド - Google Patents

ベルヌーイワンド Download PDF

Info

Publication number
JP2009545891A
JP2009545891A JP2009522909A JP2009522909A JP2009545891A JP 2009545891 A JP2009545891 A JP 2009545891A JP 2009522909 A JP2009522909 A JP 2009522909A JP 2009522909 A JP2009522909 A JP 2009522909A JP 2009545891 A JP2009545891 A JP 2009545891A
Authority
JP
Japan
Prior art keywords
wafer
head portion
handling device
gas
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009522909A
Other languages
English (en)
Japanese (ja)
Inventor
ユハ ポウル リルエロース
Original Assignee
エーエスエム アメリカ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エーエスエム アメリカ インコーポレイテッド filed Critical エーエスエム アメリカ インコーポレイテッド
Publication of JP2009545891A publication Critical patent/JP2009545891A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009522909A 2006-07-31 2007-06-08 ベルヌーイワンド Pending JP2009545891A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/497,060 US20080025835A1 (en) 2006-07-31 2006-07-31 Bernoulli wand
PCT/US2007/070796 WO2008016748A1 (en) 2006-07-31 2007-06-08 Bernoulli wand

Publications (1)

Publication Number Publication Date
JP2009545891A true JP2009545891A (ja) 2009-12-24

Family

ID=38694925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009522909A Pending JP2009545891A (ja) 2006-07-31 2007-06-08 ベルヌーイワンド

Country Status (6)

Country Link
US (1) US20080025835A1 (ko)
JP (1) JP2009545891A (ko)
KR (1) KR20090046858A (ko)
CN (1) CN101496159A (ko)
TW (1) TW200816347A (ko)
WO (1) WO2008016748A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238927A (ja) * 2010-05-11 2011-11-24 Asml Netherlands Bv 物体の非接触ハンドリング装置および方法
WO2014016897A1 (ja) * 2012-07-24 2014-01-30 リンク・パワー株式会社 非接触保持装置
JP2015208804A (ja) * 2014-04-25 2015-11-24 トヨタ自動車株式会社 非接触型搬送ハンド
JP2019169546A (ja) * 2018-03-22 2019-10-03 株式会社東京精密 プローバのウェーハ搬送装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7908902B2 (en) * 2008-10-16 2011-03-22 Emitech, Inc Amplified sensitivity of porous chemosensors based on bernoulli effect
US8443863B2 (en) * 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
US20110148128A1 (en) * 2009-12-23 2011-06-23 Memc Electronic Materials, Inc. Semiconductor Wafer Transport System
CN101826479B (zh) * 2010-04-30 2012-01-04 沈阳富森科技有限公司 非封闭式高速气流吸附传输装置
US20180258519A1 (en) * 2015-10-25 2018-09-13 Applied Materials, Inc. Apparatus for vacuum deposition on a substrate and method for masking the substrate during vacuum deposition
TWI565569B (zh) * 2016-02-05 2017-01-11 南京瀚宇彩欣科技有限責任公司 吸著裝置、吸著系統及其應用
CN107785299A (zh) * 2016-08-30 2018-03-09 上海微电子装备（集团）股份有限公司 一种硅片拾取装置
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘
JP7084385B2 (ja) * 2017-05-11 2022-06-14 ローツェ株式会社 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット
CN211605120U (zh) * 2020-03-16 2020-09-29 上海晶盟硅材料有限公司 半导体晶圆的持取装置
KR102441994B1 (ko) * 2021-12-27 2022-09-08 주식회사 에이치피에스피 고속 냉각 고압 챔버
TWI824795B (zh) * 2022-10-26 2023-12-01 盛詮科技股份有限公司 載板懸浮手臂

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539216A (en) * 1968-01-11 1970-11-10 Sprague Electric Co Pickup device
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
JPH0758191A (ja) * 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
US6183183B1 (en) * 1997-01-16 2001-02-06 Asm America, Inc. Dual arm linear hand-off wafer transfer assembly
NL1011487C2 (nl) * 1999-03-08 2000-09-18 Koninkl Philips Electronics Nv Werkwijze en inrichting voor het roteren van een wafer.
US6322116B1 (en) * 1999-07-23 2001-11-27 Asm America, Inc. Non-contact end effector
US6242718B1 (en) * 1999-11-04 2001-06-05 Asm America, Inc. Wafer holder
KR100720415B1 (ko) * 2002-03-08 2007-05-22 엘지.필립스 엘시디 주식회사 액정표시소자 제조 공정용 반송 장치
US6883250B1 (en) * 2003-11-04 2005-04-26 Asm America, Inc. Non-contact cool-down station for wafers
US20060045668A1 (en) * 2004-07-19 2006-03-02 Grabowski Al W System for handling of wafers within a process tool

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011238927A (ja) * 2010-05-11 2011-11-24 Asml Netherlands Bv 物体の非接触ハンドリング装置および方法
WO2014016897A1 (ja) * 2012-07-24 2014-01-30 リンク・パワー株式会社 非接触保持装置
JP2015208804A (ja) * 2014-04-25 2015-11-24 トヨタ自動車株式会社 非接触型搬送ハンド
JP2019169546A (ja) * 2018-03-22 2019-10-03 株式会社東京精密 プローバのウェーハ搬送装置
JP7054862B2 (ja) 2018-03-22 2022-04-15 株式会社東京精密 プローバのウェーハ搬送装置

Also Published As

Publication number Publication date
KR20090046858A (ko) 2009-05-11
CN101496159A (zh) 2009-07-29
WO2008016748A1 (en) 2008-02-07
US20080025835A1 (en) 2008-01-31
TW200816347A (en) 2008-04-01

Similar Documents

Publication Publication Date Title
JP2009545891A (ja) ベルヌーイワンド
KR102615853B1 (ko) 기판 캐리어 시스템
KR20090095618A (ko) 베르누이 완드
US7147720B2 (en) Non-contact cool-down station for wafers
US7601224B2 (en) Method of supporting a substrate in a gas cushion susceptor system
US10074555B2 (en) Non-contact substrate processing
JP4300388B2 (ja) 基材冷却装置及び基材冷却方法
JP5133298B2 (ja) 気相成長装置及び気相成長方法
US6322116B1 (en) Non-contact end effector
JP4632551B2 (ja) ウエハおよびリングの移送方法、熱処理設備リングの組み合せ、及びウエハとリングのセット
US6183183B1 (en) Dual arm linear hand-off wafer transfer assembly
JP5886821B2 (ja) 基板処理装置及び方法
JP6190645B2 (ja) 基板搬送方法
JP2009170933A (ja) 基板ホルダ、積層ボート、半導体製造装置および半導体装置の製造方法
JP2008507153A (ja) 処理ツール内のウエハハンドリングシステム
JP2010239023A (ja) 基板搬送装置及び基板処理装置
KR20090110625A (ko) 반도체 제조에 사용되는 웨이퍼 보트
JP2000195927A (ja) 真空チャック装置
KR101461060B1 (ko) 기판 처리 장치 및 방법
JP7250785B2 (ja) 極端に反ったウェハ用の基板ハンドリング装置
US20110146578A1 (en) Substrate processing apparatus
JP2006222338A (ja) 半導体製造装置
KR20070015771A (ko) 웨이퍼 슬라이딩을 방지하기 위한 웨이퍼 이송장치

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091209