JP2009540581A5 - - Google Patents

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Publication number
JP2009540581A5
JP2009540581A5 JP2009514560A JP2009514560A JP2009540581A5 JP 2009540581 A5 JP2009540581 A5 JP 2009540581A5 JP 2009514560 A JP2009514560 A JP 2009514560A JP 2009514560 A JP2009514560 A JP 2009514560A JP 2009540581 A5 JP2009540581 A5 JP 2009540581A5
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JP
Japan
Prior art keywords
dielectric layer
corrosion inhibitor
concentration
scrub
oxygen scavenger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009514560A
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English (en)
Japanese (ja)
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JP2009540581A (ja
JP5078997B2 (ja
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Publication date
Priority claimed from US11/760,722 external-priority patent/US7772128B2/en
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Publication of JP2009540581A publication Critical patent/JP2009540581A/ja
Publication of JP2009540581A5 publication Critical patent/JP2009540581A5/ja
Application granted granted Critical
Publication of JP5078997B2 publication Critical patent/JP5078997B2/ja
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JP2009514560A 2006-06-09 2007-06-09 汚染および表面分解を最小限に抑えるための層間絶縁膜の表面改質 Active JP5078997B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US80442506P 2006-06-09 2006-06-09
US60/804,425 2006-06-09
US11/760,722 2007-06-08
US11/760,722 US7772128B2 (en) 2006-06-09 2007-06-08 Semiconductor system with surface modification
PCT/US2007/070820 WO2007146848A2 (en) 2006-06-09 2007-06-09 Surface modification of interlayer dielectric for minimizing contamination and surface degradation

Publications (3)

Publication Number Publication Date
JP2009540581A JP2009540581A (ja) 2009-11-19
JP2009540581A5 true JP2009540581A5 (enExample) 2010-07-29
JP5078997B2 JP5078997B2 (ja) 2012-11-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009514560A Active JP5078997B2 (ja) 2006-06-09 2007-06-09 汚染および表面分解を最小限に抑えるための層間絶縁膜の表面改質

Country Status (6)

Country Link
US (3) US7772128B2 (enExample)
JP (1) JP5078997B2 (enExample)
KR (1) KR101480198B1 (enExample)
CN (2) CN102522368A (enExample)
TW (1) TWI360198B (enExample)
WO (1) WO2007146848A2 (enExample)

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JP6556945B2 (ja) 2015-10-04 2019-08-07 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板支持とバッフルの装置
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