JP2009536465A - 圧電材料の研磨 - Google Patents

圧電材料の研磨 Download PDF

Info

Publication number
JP2009536465A
JP2009536465A JP2009510111A JP2009510111A JP2009536465A JP 2009536465 A JP2009536465 A JP 2009536465A JP 2009510111 A JP2009510111 A JP 2009510111A JP 2009510111 A JP2009510111 A JP 2009510111A JP 2009536465 A JP2009536465 A JP 2009536465A
Authority
JP
Japan
Prior art keywords
piezoelectric material
block
oxide layer
layer
fired
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009510111A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009536465A5 (enExample
Inventor
チェンファン チェン，
ジェフリー バークマイヤー，
アンドレアス ビブル，
Original Assignee
フジフィルム ディマティックス， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by フジフィルム ディマティックス， インコーポレイテッド filed Critical フジフィルム ディマティックス， インコーポレイテッド
Publication of JP2009536465A publication Critical patent/JP2009536465A/ja
Publication of JP2009536465A5 publication Critical patent/JP2009536465A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009510111A 2006-05-05 2007-05-04 圧電材料の研磨 Pending JP2009536465A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74655606P 2006-05-05 2006-05-05
US11/744,105 US20070257580A1 (en) 2006-05-05 2007-05-03 Polishing Piezoelectric Material
PCT/US2007/068289 WO2007131198A1 (en) 2006-05-05 2007-05-04 Polishing piezoelectric material

Publications (2)

Publication Number Publication Date
JP2009536465A true JP2009536465A (ja) 2009-10-08
JP2009536465A5 JP2009536465A5 (enExample) 2011-06-16

Family

ID=38660583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009510111A Pending JP2009536465A (ja) 2006-05-05 2007-05-04 圧電材料の研磨

Country Status (5)

Country Link
US (1) US20070257580A1 (enExample)
EP (1) EP2021298A4 (enExample)
JP (1) JP2009536465A (enExample)
KR (1) KR20090018096A (enExample)
WO (1) WO2007131198A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148648A1 (ja) * 2013-03-21 2014-09-25 日本碍子株式会社 弾性波素子用複合基板および弾性波素子
JP2015119219A (ja) * 2013-12-16 2015-06-25 日本碍子株式会社 複合基板及びその製法
CN108028312A (zh) * 2015-09-15 2018-05-11 日本碍子株式会社 复合基板的制造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072113A (ja) * 2003-08-21 2005-03-17 Ngk Insulators Ltd 圧電／電歪デバイス
US8053951B2 (en) * 2008-11-04 2011-11-08 Fujifilm Corporation Thin film piezoelectric actuators
KR101024013B1 (ko) * 2008-12-03 2011-03-29 삼성전기주식회사 잉크젯 헤드 제조방법
JP2010238856A (ja) * 2009-03-31 2010-10-21 Tdk Corp 圧電体素子及びジャイロセンサ
WO2010148398A2 (en) * 2009-06-19 2010-12-23 The Regents Of The University Of Michigan A thin-film device and method of fabricating the same
EP2828082B1 (en) 2012-07-25 2020-01-15 Hewlett-Packard Development Company, L.P. Piezoelectric actuator and method of making a piezoelectric actuator
EP3130407B1 (en) * 2015-08-10 2020-11-25 Apator Miitors ApS Method of bonding a piezoelectric ultrasonic transducer
JP7195758B2 (ja) * 2018-04-19 2022-12-26 株式会社ディスコ Ｓａｗデバイスの製造方法
US11864465B2 (en) * 2020-05-22 2024-01-02 Wisconsin Alumni Research Foundation Integration of semiconductor membranes with piezoelectric substrates

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818115A (ja) * 1994-07-04 1996-01-19 Matsushita Electric Ind Co Ltd 複合圧電デバイス
JPH0915257A (ja) * 1995-06-27 1997-01-17 Matsushita Electric Works Ltd 加速度センサ及びその製造方法
JPH10264385A (ja) * 1997-03-27 1998-10-06 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP2003034035A (ja) * 2001-07-24 2003-02-04 Ricoh Co Ltd 液滴吐出ヘッド
JP2003309302A (ja) * 2002-04-18 2003-10-31 Canon Inc 圧電膜型素子構造体と液体噴射ヘッドおよびそれらの製造方法
JP2004343359A (ja) * 2003-05-14 2004-12-02 Fujitsu Media Device Kk 弾性表面波素子の製造方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3151644B2 (ja) * 1993-03-08 2001-04-03 日本碍子株式会社 圧電／電歪膜型素子
AU1430001A (en) * 1999-09-03 2001-04-10 University Of Maryland At College Park, The Process for fabrication of 3-dimensional micromechanisms
FR2823012B1 (fr) * 2001-04-03 2004-05-21 Commissariat Energie Atomique Procede de transfert selectif d'au moins un element d'un support initial sur un support final
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP4737375B2 (ja) * 2004-03-11 2011-07-27 セイコーエプソン株式会社 アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法
US20060018796A1 (en) * 2004-07-21 2006-01-26 Hans Sitte Methods and apparatus for preparing multiwell sheets
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JPWO2006046494A1 (ja) * 2004-10-25 2008-05-22 日本碍子株式会社 圧電／電歪デバイス
US7368860B2 (en) * 2005-02-11 2008-05-06 The Regents Of The University Od California High performance piezoelectric actuator

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818115A (ja) * 1994-07-04 1996-01-19 Matsushita Electric Ind Co Ltd 複合圧電デバイス
JPH0915257A (ja) * 1995-06-27 1997-01-17 Matsushita Electric Works Ltd 加速度センサ及びその製造方法
JPH10264385A (ja) * 1997-03-27 1998-10-06 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP2003034035A (ja) * 2001-07-24 2003-02-04 Ricoh Co Ltd 液滴吐出ヘッド
JP2003309302A (ja) * 2002-04-18 2003-10-31 Canon Inc 圧電膜型素子構造体と液体噴射ヘッドおよびそれらの製造方法
JP2004343359A (ja) * 2003-05-14 2004-12-02 Fujitsu Media Device Kk 弾性表面波素子の製造方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
JP2007508163A (ja) * 2003-10-10 2007-04-05 ディマティクス インコーポレーテッド 薄膜を有するプリントヘッド

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148648A1 (ja) * 2013-03-21 2014-09-25 日本碍子株式会社 弾性波素子用複合基板および弾性波素子
JP5668179B1 (ja) * 2013-03-21 2015-02-12 日本碍子株式会社 弾性波素子用複合基板および弾性波素子
KR101615081B1 (ko) 2013-03-21 2016-04-22 엔지케이 인슐레이터 엘티디 탄성파 소자용 복합 기판 및 탄성파 소자
US9438201B2 (en) 2013-03-21 2016-09-06 Ngk Insulators, Ltd. Composite substrates for acoustic wave elements, and acoustic wave elements
JP2015119219A (ja) * 2013-12-16 2015-06-25 日本碍子株式会社 複合基板及びその製法
CN108028312A (zh) * 2015-09-15 2018-05-11 日本碍子株式会社 复合基板的制造方法

Also Published As

Publication number Publication date
EP2021298A1 (en) 2009-02-11
EP2021298A4 (en) 2012-08-01
WO2007131198A1 (en) 2007-11-15
KR20090018096A (ko) 2009-02-19
US20070257580A1 (en) 2007-11-08

Similar Documents

Publication Publication Date Title
JP2009536465A (ja) 圧電材料の研磨
US7420317B2 (en) Forming piezoelectric actuators
US7779522B2 (en) Method for forming a MEMS
US7388319B2 (en) Forming piezoelectric actuators
JP2009536465A5 (enExample)
CN101484399A (zh) 压电材料的抛光
HK1126180B (en) Processing piezoelectric material
HK1208213B (en) Processing of a piezoelectric material
CN110341312B (zh) 一种压电喷头结构及其制造方法
HK1107873B (en) Method of forming a device with a piezoelectric transducer
HK1107872B (en) Method of fabricating a microelectromechanical device having piezoelectric blocks
HK1163345B (en) Method of forming a device with a piezoelectric transducer

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100430

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110419

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121001

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130304