KR20090018096A - 압전 물질을 폴리싱하는 방법 - Google Patents

압전 물질을 폴리싱하는 방법 Download PDF

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Publication number
KR20090018096A
KR20090018096A KR1020087029801A KR20087029801A KR20090018096A KR 20090018096 A KR20090018096 A KR 20090018096A KR 1020087029801 A KR1020087029801 A KR 1020087029801A KR 20087029801 A KR20087029801 A KR 20087029801A KR 20090018096 A KR20090018096 A KR 20090018096A
Authority
KR
South Korea
Prior art keywords
piezoelectric material
forming
assembly
oxide layer
fluid discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087029801A
Other languages
English (en)
Korean (ko)
Inventor
젠팡 첸
제프리 비르크마이어
안드레아스 빌
Original Assignee
후지필름 디마틱스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 디마틱스, 인크. filed Critical 후지필름 디마틱스, 인크.
Publication of KR20090018096A publication Critical patent/KR20090018096A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Micromachines (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020087029801A 2006-05-05 2007-05-04 압전 물질을 폴리싱하는 방법 Ceased KR20090018096A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US74655606P 2006-05-05 2006-05-05
US60/746,556 2006-05-05
US11/744,105 US20070257580A1 (en) 2006-05-05 2007-05-03 Polishing Piezoelectric Material
US11/744,105 2007-05-03

Publications (1)

Publication Number Publication Date
KR20090018096A true KR20090018096A (ko) 2009-02-19

Family

ID=38660583

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087029801A Ceased KR20090018096A (ko) 2006-05-05 2007-05-04 압전 물질을 폴리싱하는 방법

Country Status (5)

Country Link
US (1) US20070257580A1 (enExample)
EP (1) EP2021298A4 (enExample)
JP (1) JP2009536465A (enExample)
KR (1) KR20090018096A (enExample)
WO (1) WO2007131198A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072113A (ja) * 2003-08-21 2005-03-17 Ngk Insulators Ltd 圧電／電歪デバイス
US8053951B2 (en) * 2008-11-04 2011-11-08 Fujifilm Corporation Thin film piezoelectric actuators
KR101024013B1 (ko) * 2008-12-03 2011-03-29 삼성전기주식회사 잉크젯 헤드 제조방법
JP2010238856A (ja) * 2009-03-31 2010-10-21 Tdk Corp 圧電体素子及びジャイロセンサ
WO2010148398A2 (en) * 2009-06-19 2010-12-23 The Regents Of The University Of Michigan A thin-film device and method of fabricating the same
US9266326B2 (en) 2012-07-25 2016-02-23 Hewlett-Packard Development Company, L.P. Piezoelectric actuator and method of making a piezoelectric actuator
DE112014001537B4 (de) 2013-03-21 2018-06-28 Ngk Insulators, Ltd. Verbundsubstrate für Akustikwellenelemente und Akustikwellenelemente
JP6166170B2 (ja) * 2013-12-16 2017-07-19 日本碍子株式会社 複合基板及びその製法
DK3130407T3 (da) * 2015-08-10 2021-02-01 Apator Miitors Aps Fremgangsmåde til binding af en piezoelektrisk ultralydstransducer
CN108028312B (zh) * 2015-09-15 2021-03-26 日本碍子株式会社 复合基板的制造方法
JP7195758B2 (ja) * 2018-04-19 2022-12-26 株式会社ディスコ Ｓａｗデバイスの製造方法
US11864465B2 (en) * 2020-05-22 2024-01-02 Wisconsin Alumni Research Foundation Integration of semiconductor membranes with piezoelectric substrates

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3151644B2 (ja) * 1993-03-08 2001-04-03 日本碍子株式会社 圧電／電歪膜型素子
JPH0818115A (ja) * 1994-07-04 1996-01-19 Matsushita Electric Ind Co Ltd 複合圧電デバイス
JP3399164B2 (ja) * 1995-06-27 2003-04-21 松下電工株式会社 加速度センサ及びその製造方法
JPH10264385A (ja) * 1997-03-27 1998-10-06 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
WO2001018857A1 (en) * 1999-09-03 2001-03-15 University Of Maryland, College Park Process for fabrication of 3-dimensional micromechanisms
FR2823012B1 (fr) * 2001-04-03 2004-05-21 Commissariat Energie Atomique Procede de transfert selectif d'au moins un element d'un support initial sur un support final
JP2003034035A (ja) * 2001-07-24 2003-02-04 Ricoh Co Ltd 液滴吐出ヘッド
JP2003309302A (ja) * 2002-04-18 2003-10-31 Canon Inc 圧電膜型素子構造体と液体噴射ヘッドおよびそれらの製造方法
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP3774782B2 (ja) * 2003-05-14 2006-05-17 富士通メディアデバイス株式会社 弾性表面波素子の製造方法
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
JP4737375B2 (ja) * 2004-03-11 2011-07-27 セイコーエプソン株式会社 アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法並びに液体噴射装置の製造方法
US20060018796A1 (en) * 2004-07-21 2006-01-26 Hans Sitte Methods and apparatus for preparing multiwell sheets
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
WO2006046494A1 (ja) * 2004-10-25 2006-05-04 Ngk Insulators, Ltd. 圧電／電歪デバイス
US7368860B2 (en) * 2005-02-11 2008-05-06 The Regents Of The University Od California High performance piezoelectric actuator

Also Published As

Publication number Publication date
JP2009536465A (ja) 2009-10-08
EP2021298A1 (en) 2009-02-11
EP2021298A4 (en) 2012-08-01
WO2007131198A1 (en) 2007-11-15
US20070257580A1 (en) 2007-11-08

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Patent event date: 20081205

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