JP2009533853A5 - - Google Patents
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- Publication number
- JP2009533853A5 JP2009533853A5 JP2009504707A JP2009504707A JP2009533853A5 JP 2009533853 A5 JP2009533853 A5 JP 2009533853A5 JP 2009504707 A JP2009504707 A JP 2009504707A JP 2009504707 A JP2009504707 A JP 2009504707A JP 2009533853 A5 JP2009533853 A5 JP 2009533853A5
- Authority
- JP
- Japan
- Prior art keywords
- fluorine
- nitrogen
- gas mixture
- argon
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 30
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 25
- 239000011737 fluorine Substances 0.000 claims 25
- 229910052731 fluorine Inorganic materials 0.000 claims 25
- 239000000203 mixture Substances 0.000 claims 24
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 20
- 238000000034 method Methods 0.000 claims 19
- 239000011261 inert gas Substances 0.000 claims 18
- 229910052757 nitrogen Inorganic materials 0.000 claims 15
- 239000007789 gas Substances 0.000 claims 14
- 229910052786 argon Inorganic materials 0.000 claims 10
- 238000005530 etching Methods 0.000 claims 6
- 229910010272 inorganic material Inorganic materials 0.000 claims 5
- 239000011147 inorganic material Substances 0.000 claims 5
- 229910052756 noble gas Inorganic materials 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 150000002835 noble gases Chemical class 0.000 claims 4
- 238000004140 cleaning Methods 0.000 claims 3
- 239000011368 organic material Substances 0.000 claims 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 2
- 230000001143 conditioned effect Effects 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical class C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06007540 | 2006-04-10 | ||
| EP06007540.5 | 2006-04-10 | ||
| EP06008238.5 | 2006-04-21 | ||
| EP06008238 | 2006-04-21 | ||
| PCT/EP2007/053421 WO2007116033A1 (en) | 2006-04-10 | 2007-04-06 | Etching process |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009533853A JP2009533853A (ja) | 2009-09-17 |
| JP2009533853A5 true JP2009533853A5 (enExample) | 2010-05-20 |
| JP5491170B2 JP5491170B2 (ja) | 2014-05-14 |
Family
ID=38164383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009504707A Active JP5491170B2 (ja) | 2006-04-10 | 2007-04-06 | エッチング方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090068844A1 (enExample) |
| EP (2) | EP3269843A1 (enExample) |
| JP (1) | JP5491170B2 (enExample) |
| KR (3) | KR20160062181A (enExample) |
| TW (1) | TW200809008A (enExample) |
| WO (1) | WO2007116033A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2010130570A (ru) * | 2007-12-21 | 2012-01-27 | Солвей Флуор Гмбх (De) | Способ получения микроэлектромеханических систем |
| AU2008348838A1 (en) | 2008-01-23 | 2009-07-30 | Solvay Fluor Gmbh | Process for the manufacture of solar cells |
| WO2010087930A1 (en) * | 2009-01-27 | 2010-08-05 | Linde Aktiengesellschaft | Molecular fluorine etching of silicon thin films for photovoltaic and other lower-temperature chemical vapor deposition processes |
| US9627180B2 (en) * | 2009-10-01 | 2017-04-18 | Praxair Technology, Inc. | Method for ion source component cleaning |
| WO2011051251A1 (en) * | 2009-10-26 | 2011-05-05 | Solvay Fluor Gmbh | Etching process for producing a tft matrix |
| JP2013509700A (ja) | 2009-10-30 | 2013-03-14 | ソルヴェイ(ソシエテ アノニム) | F2およびcof2を使用するプラズマエッチングおよびチャンバのプラズマ洗浄の方法 |
| MY162759A (en) | 2010-03-26 | 2017-07-14 | Solvay | Method for the supply of fluorine |
| GB2486883A (en) * | 2010-12-22 | 2012-07-04 | Ultra High Vacuum Solutions Ltd | Method and apparatus for surface texture modification of silicon wafers for photovoltaic cell devices |
| CN103079992A (zh) | 2010-08-05 | 2013-05-01 | 索尔维公司 | 氟纯化的方法 |
| TWI586842B (zh) | 2010-09-15 | 2017-06-11 | 首威公司 | 氟之製造工廠及使用彼之方法 |
| WO2012035000A1 (en) | 2010-09-15 | 2012-03-22 | Solvay Sa | Method for the removal of f2 and/or of2 from a gas |
| US20130017644A1 (en) * | 2011-02-18 | 2013-01-17 | Air Products And Chemicals, Inc. | Fluorine Based Chamber Clean With Nitrogen Trifluoride Backup |
| JP2012216718A (ja) * | 2011-04-01 | 2012-11-08 | Kaneka Corp | Cvd装置のクリーニング方法 |
| WO2013024041A1 (en) | 2011-08-17 | 2013-02-21 | Solvay Sa | Electrolytic process for the manufacture of fluorine and an apparatus therefor |
| WO2013092777A1 (en) | 2011-12-22 | 2013-06-27 | Solvay Sa | Plasma chamber apparatus and a method for cleaning a chamber |
| KR102030797B1 (ko) | 2012-03-30 | 2019-11-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 제조 방법 |
| JP6138653B2 (ja) * | 2013-10-08 | 2017-05-31 | 株式会社日立ハイテクノロジーズ | ドライエッチング方法 |
| EP2860287A1 (en) | 2013-10-11 | 2015-04-15 | Solvay SA | Improved electrolytic cell |
| EP2860288A1 (en) | 2013-10-11 | 2015-04-15 | Solvay SA | Improved electrolytic cell |
| EP2944385A1 (en) | 2014-05-12 | 2015-11-18 | Solvay SA | A process for etching and chamber cleaning and a gas therefor |
| EP3095893A1 (en) * | 2015-05-22 | 2016-11-23 | Solvay SA | A process for etching and chamber cleaning and a gas therefor |
| US10161034B2 (en) | 2017-04-21 | 2018-12-25 | Lam Research Corporation | Rapid chamber clean using concurrent in-situ and remote plasma sources |
| WO2021210368A1 (ja) | 2020-04-14 | 2021-10-21 | 昭和電工株式会社 | エッチング方法及び半導体素子の製造方法 |
| US11961719B2 (en) | 2020-06-25 | 2024-04-16 | Hitachi High-Tech Corporation | Vacuum processing method |
| CN114823350A (zh) * | 2022-04-17 | 2022-07-29 | 中南大学 | 一种铌酸锂薄膜刻蚀方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3518132A (en) * | 1966-07-12 | 1970-06-30 | Us Army | Corrosive vapor etching process for semiconductors using combined vapors of hydrogen fluoride and nitrous oxide |
| JP2626913B2 (ja) * | 1988-07-29 | 1997-07-02 | 三菱電機株式会社 | シリコン表面の処理方法 |
| US5425842A (en) * | 1992-06-09 | 1995-06-20 | U.S. Philips Corporation | Method of manufacturing a semiconductor device using a chemical vapour deposition process with plasma cleaning of the reactor chamber |
| KR100230981B1 (ko) * | 1996-05-08 | 1999-11-15 | 김광호 | 반도체장치 제조공정의 플라즈마 식각 방법 |
| JPH1072672A (ja) * | 1996-07-09 | 1998-03-17 | Applied Materials Inc | 非プラズマ式チャンバクリーニング法 |
| US6274058B1 (en) * | 1997-07-11 | 2001-08-14 | Applied Materials, Inc. | Remote plasma cleaning method for processing chambers |
| US6468490B1 (en) * | 2000-06-29 | 2002-10-22 | Applied Materials, Inc. | Abatement of fluorine gas from effluent |
| JP4346741B2 (ja) * | 1999-08-05 | 2009-10-21 | キヤノンアネルバ株式会社 | 発熱体cvd装置及び付着膜の除去方法 |
| US6431182B1 (en) * | 1999-10-27 | 2002-08-13 | Advanced Micro Devices, Inc. | Plasma treatment for polymer removal after via etch |
| US20030010354A1 (en) * | 2000-03-27 | 2003-01-16 | Applied Materials, Inc. | Fluorine process for cleaning semiconductor process chamber |
| US20030056388A1 (en) | 2000-07-18 | 2003-03-27 | Hiromoto Ohno | Cleaning gas for semiconductor production equipment |
| JP2002151469A (ja) * | 2000-11-08 | 2002-05-24 | Matsushita Electric Ind Co Ltd | ドライエッチング方法 |
| US6949450B2 (en) * | 2000-12-06 | 2005-09-27 | Novellus Systems, Inc. | Method for integrated in-situ cleaning and subsequent atomic layer deposition within a single processing chamber |
| DE60237380D1 (de) * | 2001-08-30 | 2010-09-30 | Anelva Corp | Plasmareinigungsverfahren |
| US6955177B1 (en) * | 2001-12-07 | 2005-10-18 | Novellus Systems, Inc. | Methods for post polysilicon etch photoresist and polymer removal with minimal gate oxide loss |
| JP2003264186A (ja) * | 2002-03-11 | 2003-09-19 | Asm Japan Kk | Cvd装置処理室のクリーニング方法 |
| AU2003282836A1 (en) * | 2002-10-15 | 2004-05-04 | Rensselaer Polytechnic Institute | Atomic layer deposition of noble metals |
| US20040074516A1 (en) * | 2002-10-18 | 2004-04-22 | Hogle Richard A. | Sub-atmospheric supply of fluorine to semiconductor process chamber |
| US7500445B2 (en) * | 2003-01-27 | 2009-03-10 | Applied Materials, Inc. | Method and apparatus for cleaning a CVD chamber |
| JP4320389B2 (ja) * | 2003-02-28 | 2009-08-26 | 関東電化工業株式会社 | Cvdチャンバーのクリーニング方法およびそれに用いるクリーニングガス |
| US20050250347A1 (en) * | 2003-12-31 | 2005-11-10 | Bailey Christopher M | Method and apparatus for maintaining by-product volatility in deposition process |
| US20060016459A1 (en) * | 2004-05-12 | 2006-01-26 | Mcfarlane Graham | High rate etching using high pressure F2 plasma with argon dilution |
| FR2872505B1 (fr) * | 2004-06-30 | 2007-02-02 | Air Liquide | Generateur de gaz fluore |
| US20080110744A1 (en) * | 2004-06-30 | 2008-05-15 | Jean-Marc Girard | Method for the Preparation of a Gas or Mixture of Gases Containing Molecular Fluorine |
| TWI319204B (en) * | 2004-10-12 | 2010-01-01 | Hynix Semiconductor Inc | Method for fabricating semiconductor device using tungsten as sacrificial hard mask |
| US7238624B2 (en) * | 2005-03-01 | 2007-07-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for manufacturing semiconductor devices using a vacuum chamber |
-
2007
- 2007-04-06 EP EP17180963.5A patent/EP3269843A1/en not_active Withdrawn
- 2007-04-06 EP EP07727889.3A patent/EP2007923B1/en active Active
- 2007-04-06 KR KR1020167012718A patent/KR20160062181A/ko not_active Ceased
- 2007-04-06 KR KR1020087027400A patent/KR20090015054A/ko not_active Ceased
- 2007-04-06 US US12/296,139 patent/US20090068844A1/en not_active Abandoned
- 2007-04-06 KR KR1020177027546A patent/KR20170116213A/ko not_active Ceased
- 2007-04-06 JP JP2009504707A patent/JP5491170B2/ja active Active
- 2007-04-06 WO PCT/EP2007/053421 patent/WO2007116033A1/en not_active Ceased
- 2007-04-10 TW TW096112512A patent/TW200809008A/zh unknown
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