JP2009532213A - 微細構造工具及びレーザーアブレーションを用いてこれを作成する方法 - Google Patents
微細構造工具及びレーザーアブレーションを用いてこれを作成する方法 Download PDFInfo
- Publication number
- JP2009532213A JP2009532213A JP2009503264A JP2009503264A JP2009532213A JP 2009532213 A JP2009532213 A JP 2009532213A JP 2009503264 A JP2009503264 A JP 2009503264A JP 2009503264 A JP2009503264 A JP 2009503264A JP 2009532213 A JP2009532213 A JP 2009532213A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- tool
- microstructure
- microstructured
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00317—Production of lenses with markings or patterns
- B29D11/00326—Production of lenses with markings or patterns having particular surface properties, e.g. a micropattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3475—Displays, monitors, TV-sets, computer screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/278,290 US20070231541A1 (en) | 2006-03-31 | 2006-03-31 | Microstructured tool and method of making same using laser ablation |
| PCT/US2007/065443 WO2008063686A2 (en) | 2006-03-31 | 2007-03-29 | Microstructured tool and method of making same using laser ablation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009532213A true JP2009532213A (ja) | 2009-09-10 |
| JP2009532213A5 JP2009532213A5 (enExample) | 2010-05-20 |
Family
ID=38559406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009503264A Withdrawn JP2009532213A (ja) | 2006-03-31 | 2007-03-29 | 微細構造工具及びレーザーアブレーションを用いてこれを作成する方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070231541A1 (enExample) |
| EP (1) | EP2001667A2 (enExample) |
| JP (1) | JP2009532213A (enExample) |
| KR (1) | KR20090003278A (enExample) |
| CN (1) | CN101443189A (enExample) |
| TW (1) | TW200808534A (enExample) |
| WO (1) | WO2008063686A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011200935A (ja) * | 2010-03-15 | 2011-10-13 | Ewag Ag | 回転対称ツールを製造するレーザ加工装置及び方法 |
| JPWO2023073833A1 (enExample) * | 2021-10-27 | 2023-05-04 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7867688B2 (en) * | 2006-05-30 | 2011-01-11 | Eastman Kodak Company | Laser ablation resist |
| JP2010513973A (ja) * | 2006-12-19 | 2010-04-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | レンズ構造体及び製造方法並びに成形ポリマー品の製造 |
| US8436453B2 (en) * | 2006-12-28 | 2013-05-07 | Texas Instruments Incorporated | Micromechanical device lubrication |
| US20090061161A1 (en) * | 2007-08-27 | 2009-03-05 | Lynn Sheehan | Laser patterning of a cross-linked polymer |
| US8012329B2 (en) * | 2008-05-09 | 2011-09-06 | 3M Innovative Properties Company | Dimensional control in electroforms |
| JP5319769B2 (ja) * | 2008-06-30 | 2013-10-16 | スリーエム イノベイティブ プロパティズ カンパニー | パターン形成された基板の形成方法 |
| WO2010002679A2 (en) * | 2008-06-30 | 2010-01-07 | 3M Innovative Properties Company | Method of forming a microstructure |
| US20100129617A1 (en) * | 2008-11-21 | 2010-05-27 | Corrigan Thomas R | Laser ablation tooling via sparse patterned masks |
| US20100128351A1 (en) * | 2008-11-21 | 2010-05-27 | 3M Innovative Properties Company | Curved sided cone structures for controlling gain and viewing angle in an optical film |
| US20110070398A1 (en) * | 2009-09-18 | 2011-03-24 | 3M Innovative Properties Company | Laser ablation tooling via distributed patterned masks |
| US20130004967A1 (en) | 2009-11-23 | 2013-01-03 | Halverson Kurt J | Microwell array articles and methods of use |
| WO2011063313A1 (en) | 2009-11-23 | 2011-05-26 | 3M Innovative Properties Company | Carrier with flexible microassay device and methods of use |
| PL2512978T3 (pl) * | 2009-12-14 | 2015-12-31 | Sicpa Holding Sa | Odlana warstwa polimerowa o wysokim współczynniku proporcji |
| KR101250450B1 (ko) * | 2010-07-30 | 2013-04-08 | 광주과학기술원 | 마이크로 나노 조합구조의 제조방법 및 마이크로 나노 조합구조가 집적된 광소자의 제조방법 |
| EP2428307B1 (de) * | 2010-09-10 | 2016-03-16 | ACSYS Lasertechnik GmbH | Verfahren zur Erzeugung von rauen Oberflächenstrukturen |
| SG195142A1 (en) | 2011-05-25 | 2013-12-30 | 3M Innovative Properties Co | Light control film |
| SG195168A1 (en) * | 2011-05-31 | 2013-12-30 | 3M Innovative Properties Co | Methods for making differentially pattern cured microstructured articles |
| US10791779B2 (en) | 2014-12-10 | 2020-10-06 | The Charles Stark Draper Laboratory, Inc. | Polymer microwedges and methods of manufacturing same |
| FR3034036B1 (fr) * | 2015-03-25 | 2017-09-08 | Maped | Insert en deux parties comportant des motifs de texturation pour moulage de pieces en materiau polymerique |
| US10458448B2 (en) | 2017-04-18 | 2019-10-29 | The Charles Stark Draper Laboratory, Inc. | Surface affix-able device incorporating mechanically actuated dry adhesive |
| GB201710188D0 (en) * | 2017-06-26 | 2017-08-09 | Andritz Powerlase Ltd | A coating removal method |
| CN109517473B (zh) * | 2018-11-23 | 2020-11-03 | 汉高乐泰(深圳)新材料有限公司 | 一种高强度防水环氧树脂涂料及其制备方法 |
| FR3103492A1 (fr) * | 2019-11-26 | 2021-05-28 | Centre National De La Recherche Scientifique | Procédé de fabrication d’un subtrat dont au moins une surface est non-adhérente |
| WO2021105633A1 (fr) * | 2019-11-26 | 2021-06-03 | Structurys Biotech | Procédé de fabrication d'un subtrat dont au moins une surface est non-adhérente |
| FR3103397A1 (fr) * | 2019-11-26 | 2021-05-28 | Centre National De La Recherche Scientifique | Surface non-adhérente et utilisation dans des applications anti-biofilm |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2473163A (en) * | 1945-06-25 | 1949-06-14 | Ewald H Mccoy | Plating nickel on aluminum |
| JPS5278719A (en) * | 1975-12-26 | 1977-07-02 | Nippon Kagaku Sangyo Kk | Plating method of aluminum and aluminum alloy |
| JPS613339A (ja) * | 1984-06-18 | 1986-01-09 | Hitachi Ltd | 高密度情報記録円板複製用スタンパおよびその製造方法 |
| US4617085A (en) * | 1985-09-03 | 1986-10-14 | General Electric Company | Process for removing organic material in a patterned manner from an organic film |
| JPS62273226A (ja) * | 1986-05-20 | 1987-11-27 | Nippon Soda Co Ltd | 無電解メッキ用光硬化性レジスト樹脂組成物 |
| JPS63112675A (ja) * | 1986-10-30 | 1988-05-17 | Denki Kagaku Kogyo Kk | 接着剤 |
| US4832798A (en) * | 1987-12-16 | 1989-05-23 | Amp Incorporated | Method and apparatus for plating composite |
| EP0327398B1 (en) * | 1988-02-05 | 1994-09-21 | Raychem Limited | Laser-machining polymers |
| US4877644A (en) * | 1988-04-12 | 1989-10-31 | Amp Incorporated | Selective plating by laser ablation |
| US5028683A (en) * | 1988-04-22 | 1991-07-02 | Minnesota Mining And Manufacturing Company | Electron-beam curable polyurethane compositions; and method |
| US5053272A (en) * | 1989-01-13 | 1991-10-01 | International Business Machines Corporation | Optical storage device |
| US4904498A (en) * | 1989-05-15 | 1990-02-27 | Amp Incorporated | Method for controlling an oxide layer metallic substrates by laser |
| JP2672170B2 (ja) * | 1990-02-22 | 1997-11-05 | キヤノン株式会社 | 光情報記憶媒体用基板の成形用ロール,製造装置及び製造方法 |
| US5406906A (en) * | 1994-01-18 | 1995-04-18 | Ford Motor Company | Preparation of crystallographically aligned films of silicon carbide by laser deposition of carbon onto silicon |
| US5580694A (en) * | 1994-06-27 | 1996-12-03 | International Business Machines Corporation | Photoresist composition with androstane and process for its use |
| US5783371A (en) * | 1994-07-29 | 1998-07-21 | Trustees Of Boston University | Process for manufacturing optical data storage disk stamper |
| US5674634A (en) * | 1994-12-05 | 1997-10-07 | E. I. Du Pont De Nemours And Company | Insulator composition, green tape, and method for forming plasma display apparatus barrier-rib |
| JPH08212598A (ja) * | 1995-02-01 | 1996-08-20 | Pioneer Electron Corp | 光ディスク及び光ディスク再生装置 |
| AU5325596A (en) * | 1995-04-26 | 1996-11-18 | Minnesota Mining And Manufacturing Company | Method and apparatus for step and repeat exposures |
| US5532024A (en) * | 1995-05-01 | 1996-07-02 | International Business Machines Corporation | Method for improving the adhesion of polymeric adhesives to nickel surfaces |
| JP3638660B2 (ja) * | 1995-05-01 | 2005-04-13 | 松下電器産業株式会社 | 感光性樹脂組成物、それを用いたサンドブラスト用感光性ドライフィルム及びそれを用いた食刻方法 |
| GB9509487D0 (en) * | 1995-05-10 | 1995-07-05 | Ici Plc | Micro relief element & preparation thereof |
| US5691114A (en) * | 1996-03-12 | 1997-11-25 | Eastman Kodak Company | Method of imaging of lithographic printing plates using laser ablation |
| DE19824349C2 (de) * | 1998-05-30 | 2000-06-15 | Beiersdorf Ag | Verfahren zur Herstellung einer laserbeschriftbaren Glasscheibe oder eines Verbundglases |
| US5964911A (en) * | 1998-07-28 | 1999-10-12 | Howard J. Greenwald | Process for making an abrasive composition |
| US6247986B1 (en) * | 1998-12-23 | 2001-06-19 | 3M Innovative Properties Company | Method for precise molding and alignment of structures on a substrate using a stretchable mold |
| AU6402900A (en) * | 1999-06-08 | 2000-12-28 | Biomicro Systems, Inc. | Laser ablation of doped fluorocarbon materials and applications thereof |
| US6361923B1 (en) * | 1999-08-17 | 2002-03-26 | International Business Machines Corporation | Laser ablatable material and its use |
| US6696157B1 (en) * | 2000-03-05 | 2004-02-24 | 3M Innovative Properties Company | Diamond-like glass thin films |
| JP3886802B2 (ja) * | 2001-03-30 | 2007-02-28 | 株式会社東芝 | 磁性体のパターニング方法、磁気記録媒体、磁気ランダムアクセスメモリ |
| US7344665B2 (en) * | 2002-10-23 | 2008-03-18 | 3M Innovative Properties Company | Coating die with expansible chamber device |
| US6902866B1 (en) * | 2003-11-24 | 2005-06-07 | Gary Ganghui Teng | Thermosensitive lithographic printing plate comprising specific acrylate monomers |
-
2006
- 2006-03-31 US US11/278,290 patent/US20070231541A1/en not_active Abandoned
-
2007
- 2007-03-29 WO PCT/US2007/065443 patent/WO2008063686A2/en not_active Ceased
- 2007-03-29 JP JP2009503264A patent/JP2009532213A/ja not_active Withdrawn
- 2007-03-29 CN CNA2007800107295A patent/CN101443189A/zh active Pending
- 2007-03-29 KR KR1020087023725A patent/KR20090003278A/ko not_active Withdrawn
- 2007-03-29 EP EP07868199A patent/EP2001667A2/en not_active Withdrawn
- 2007-03-30 TW TW096111410A patent/TW200808534A/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011200935A (ja) * | 2010-03-15 | 2011-10-13 | Ewag Ag | 回転対称ツールを製造するレーザ加工装置及び方法 |
| JPWO2023073833A1 (enExample) * | 2021-10-27 | 2023-05-04 | ||
| WO2023073833A1 (ja) * | 2021-10-27 | 2023-05-04 | 株式会社ニコン | データ生成方法、クラウドシステム、加工装置、コンピュータプログラム及び記録媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008063686A3 (en) | 2008-08-07 |
| WO2008063686A2 (en) | 2008-05-29 |
| US20070231541A1 (en) | 2007-10-04 |
| CN101443189A (zh) | 2009-05-27 |
| TW200808534A (en) | 2008-02-16 |
| EP2001667A2 (en) | 2008-12-17 |
| KR20090003278A (ko) | 2009-01-09 |
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