JP2009522779A - 複合物カプセル材のレンズを有するｌｅｄ - Google Patents

複合物カプセル材のレンズを有するｌｅｄ Download PDF

Info

Publication number
JP2009522779A
JP2009522779A JP2008548617A JP2008548617A JP2009522779A JP 2009522779 A JP2009522779 A JP 2009522779A JP 2008548617 A JP2008548617 A JP 2008548617A JP 2008548617 A JP2008548617 A JP 2008548617A JP 2009522779 A JP2009522779 A JP 2009522779A
Authority
JP
Japan
Prior art keywords
lens
light source
light
led
emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008548617A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009522779A5 (enExample
Inventor
パトリック・アール・デステイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009522779A publication Critical patent/JP2009522779A/ja
Publication of JP2009522779A5 publication Critical patent/JP2009522779A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode
JP2008548617A 2005-12-30 2006-12-20 複合物カプセル材のレンズを有するｌｅｄ Withdrawn JP2009522779A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/322,801 US7798678B2 (en) 2005-12-30 2005-12-30 LED with compound encapsulant lens
PCT/US2006/048692 WO2007078971A2 (en) 2005-12-30 2006-12-20 Led with compound encapsulant lens

Publications (2)

Publication Number Publication Date
JP2009522779A true JP2009522779A (ja) 2009-06-11
JP2009522779A5 JP2009522779A5 (enExample) 2010-02-12

Family

ID=38223464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008548617A Withdrawn JP2009522779A (ja) 2005-12-30 2006-12-20 複合物カプセル材のレンズを有するｌｅｄ

Country Status (7)

Country Link
US (1) US7798678B2 (enExample)
EP (1) EP1974398A2 (enExample)
JP (1) JP2009522779A (enExample)
KR (1) KR20080081085A (enExample)
CN (1) CN101371371B (enExample)
TW (1) TW200735422A (enExample)
WO (1) WO2007078971A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012529185A (ja) * 2009-06-02 2012-11-15 ブリッジラックス インコーポレイテッド 屈折要素を有する光源
JP2014123014A (ja) * 2012-12-21 2014-07-03 Casio Comput Co Ltd 光源装置、プロジェクタ
JP2021015910A (ja) * 2019-07-12 2021-02-12 Ｄｏｗａエレクトロニクス株式会社 発光素子ランプ及びその製造方法

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10361075A1 (de) * 2003-12-22 2005-07-28 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten
JP4996101B2 (ja) * 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
US8174032B2 (en) * 2006-03-16 2012-05-08 Light Engines Corporation Semiconductor white light sources
WO2008016905A1 (en) 2006-07-31 2008-02-07 3M Innovative Properties Company Optical projection subsystem
TW200819899A (en) * 2006-07-31 2008-05-01 3M Innovative Properties Co Combination camera/projector system
US20080036972A1 (en) * 2006-07-31 2008-02-14 3M Innovative Properties Company Led mosaic
TW200815709A (en) * 2006-07-31 2008-04-01 3M Innovative Properties Co Integrating light source module
US8075140B2 (en) * 2006-07-31 2011-12-13 3M Innovative Properties Company LED illumination system with polarization recycling
WO2008016908A2 (en) * 2006-07-31 2008-02-07 3M Innovative Properties Company Led source with hollow collection lens
JP4979299B2 (ja) * 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
US20090121250A1 (en) * 2006-11-15 2009-05-14 Denbaars Steven P High light extraction efficiency light emitting diode (led) using glass packaging
JP2008166782A (ja) * 2006-12-26 2008-07-17 Seoul Semiconductor Co Ltd 発光素子
WO2009073336A1 (en) 2007-11-30 2009-06-11 3M Innovative Properties Company Optical element having a toric surface and method of making
DE102008025756B4 (de) * 2008-05-29 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung
TWI357164B (en) * 2008-06-30 2012-01-21 E Pin Optical Industry Co Ltd Aspherical led angular lens for narrow distributio
TWI395908B (zh) * 2008-06-30 2013-05-11 E Pin Optical Industry Co Ltd 非球面正照角發光二極體光學鏡片及其所構成的發光二極體組件
TWI361261B (en) * 2008-06-30 2012-04-01 E Pin Optical Industry Co Ltd Aspherical led angular lens for wide distribution patterns and led assembly using the same
TWI395979B (zh) * 2008-07-04 2013-05-11 A microlens and a mold manufacturing method thereof, and a light emitting device
US7800125B2 (en) * 2008-07-09 2010-09-21 Himax Display, Inc. Light-emitting diode package
US7843654B2 (en) * 2008-09-29 2010-11-30 Texas Instruments Incorporated Collecting lens
CN102210033A (zh) 2008-11-07 2011-10-05 Idd航空宇宙公司 照明系统
US7869145B2 (en) * 2008-11-10 2011-01-11 Texas Instruments Incorporated System and method for illuminating a target
US11476626B2 (en) * 2008-11-12 2022-10-18 Aaron Chien DC powered remote control LED light-bar assembly
US10509304B2 (en) * 2008-11-12 2019-12-17 Tseng-Lu Chien LED projection light has features
FR2939866B1 (fr) * 2008-12-16 2011-01-14 Jacques Sabater Dispositif d'eclairage a diodes electroluminescentes
FR2950670B1 (fr) * 2009-09-25 2011-10-28 Effilux Dispositif d'eclairage indirect d'une surface a diodes electroluminescentes
KR101146458B1 (ko) * 2009-10-29 2012-05-21 폭스세미콘 인티그리티드 테크놀로지, 인코포레이티드 광학 렌즈
CN102062347A (zh) * 2009-11-12 2011-05-18 富准精密工业(深圳)有限公司 发光二极管模组及其透镜
CN102080807A (zh) * 2009-11-30 2011-06-01 富准精密工业(深圳)有限公司 发光二极管模组及其透镜
TWD144346S (zh) * 2009-12-22 2011-12-21 松下電器產業股份有限公司 發光二極體
USD636742S1 (en) * 2009-12-22 2011-04-26 Panasonic Corporation Light-emitting diode
USD636743S1 (en) * 2009-12-22 2011-04-26 Panasonic Corporation Light-emitting diode
USD636741S1 (en) * 2009-12-22 2011-04-26 Panasonic Corporation Light-emitting diode
TWI407597B (zh) * 2010-02-05 2013-09-01 Shinyoptics Corp 發光二極體照明裝置
CN101858558B (zh) * 2010-06-12 2013-03-06 北京航空航天大学 一种led路灯二次光学透镜
USD646235S1 (en) * 2010-06-22 2011-10-04 Panasonic Corporation Light emitting diode
USD645419S1 (en) * 2010-06-22 2011-09-20 Panasonic Corporation Light emitting diode
USD650341S1 (en) * 2010-06-22 2011-12-13 Panasonic Corporation Light emitting diode
USD642141S1 (en) * 2010-06-22 2011-07-26 Panasonic Corporation Light emitting diode
USD645420S1 (en) * 2010-06-22 2011-09-20 Panasonic Corporation Light emitting diode
USD650342S1 (en) * 2010-06-22 2011-12-13 Panasonic Corporation Light emitting diode
USD642143S1 (en) * 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
USD642142S1 (en) * 2010-07-07 2011-07-26 Panasonic Corporation Light emitting diode
USD649943S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
USD649944S1 (en) * 2010-07-07 2011-12-06 Panasonic Corporation Light emitting diode
CN104487768B (zh) * 2010-09-23 2019-02-01 光处方革新有限公司 壳积分器
US9709242B2 (en) 2010-09-23 2017-07-18 Light Prescriptions Innovators, Llc Shell integrator
JP5554680B2 (ja) * 2010-10-15 2014-07-23 スタンレー電気株式会社 発光素子搭載用基板、発光装置およびこれらの製造方法
JP6109076B2 (ja) 2010-12-29 2017-04-05 スリーエム イノベイティブ プロパティズ カンパニー Ｌｅｄ色結合器
US10147853B2 (en) 2011-03-18 2018-12-04 Cree, Inc. Encapsulant with index matched thixotropic agent
US8759854B2 (en) * 2011-05-24 2014-06-24 Tsmc Solid State Lighting Ltd. Bat-wing lens design with multi-die
EP2788798A1 (en) 2011-12-05 2014-10-15 Cooledge Lighting, Inc. Control of luminous intensity distribution from an array of point light sources
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
WO2013112435A1 (en) 2012-01-24 2013-08-01 Cooledge Lighting Inc. Light - emitting devices having discrete phosphor chips and fabrication methods
KR20130110997A (ko) * 2012-03-30 2013-10-10 서울반도체 주식회사 Ｌｅｄ용 렌즈 및 그 제조방법
CN103375708B (zh) * 2012-04-26 2015-10-28 展晶科技(深圳)有限公司 发光二极管灯源装置
US9818919B2 (en) 2012-06-11 2017-11-14 Cree, Inc. LED package with multiple element light source and encapsulant having planar surfaces
US10424702B2 (en) * 2012-06-11 2019-09-24 Cree, Inc. Compact LED package with reflectivity layer
US10468565B2 (en) 2012-06-11 2019-11-05 Cree, Inc. LED package with multiple element light source and encapsulant having curved and/or planar surfaces
US9887327B2 (en) * 2012-06-11 2018-02-06 Cree, Inc. LED package with encapsulant having curved and planar surfaces
WO2014017262A1 (ja) 2012-07-27 2014-01-30 シャープ株式会社 照明装置
JP2015535951A (ja) * 2012-09-19 2015-12-17 ヴェンティス テクノロジーズ エルエルシー 光を散乱させる装置
TWI503507B (zh) * 2012-10-12 2015-10-11 玉晶光電股份有限公司 An optical lens for a lighting device
CN110085578B (zh) * 2013-03-13 2023-05-05 亮锐控股有限公司 具有底部反射体的封装led透镜
US9080746B2 (en) 2013-03-15 2015-07-14 Abl Ip Holding Llc LED assembly having a refractor that provides improved light control
JP2015041437A (ja) * 2013-08-20 2015-03-02 船井電機株式会社 照明装置及び表示装置
TW201508217A (zh) * 2013-08-27 2015-03-01 鴻海精密工業股份有限公司 光源模組
CN105723530B (zh) 2013-09-12 2019-07-16 夸克星有限责任公司 光发射装置和集成所述光发射装置的照明设备
US9343443B2 (en) 2014-02-05 2016-05-17 Cooledge Lighting, Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
US10935211B2 (en) * 2014-05-30 2021-03-02 Ideal Industries Lighting Llc LED luminaire with a smooth outer dome and a cavity with a ridged inner surface
US12372219B2 (en) * 2014-05-30 2025-07-29 Cree Lighting Usa Llc LED luminaire with a cavity, finned interior, and a curved outer wall extending from a surface on which the light source is mounted
WO2015187388A1 (en) * 2014-06-02 2015-12-10 3M Innovative Properties Company Led with remote phosphor and shell reflector
US9971134B2 (en) * 2014-07-21 2018-05-15 Philips Lighting Holding B.V. Lighting device with virtual light source
CN113419398A (zh) 2014-12-31 2021-09-21 3M创新有限公司 紧凑型投影系统和相关部件
US10197245B1 (en) 2015-11-09 2019-02-05 Abl Ip Holding Llc Asymmetric vision enhancement optics, luminaires providing asymmetric light distributions and associated methods
US20230161127A1 (en) * 2020-04-15 2023-05-25 CommScope Connectivity Belgium BV Device and method for sealing cables in telecommunications enclosures
CN112864298A (zh) * 2021-01-08 2021-05-28 厦门市信达光电科技有限公司 一种小角度led封装结构及其制备方法
US11656497B2 (en) 2021-05-25 2023-05-23 Lextar Electronics Corporation Light emitting module and optical lens thereof
CN118330970B (zh) * 2024-06-12 2024-09-06 杭州海康威视数字技术股份有限公司 补光灯及摄像设备

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3510732A (en) 1968-04-22 1970-05-05 Gen Electric Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein
US3596136A (en) 1969-05-13 1971-07-27 Rca Corp Optical semiconductor device with glass dome
US3897486A (en) * 1974-06-28 1975-07-29 Amchem Prod Purification of aliphatic phosphonic acids
US4337759A (en) 1979-10-10 1982-07-06 John M. Popovich Radiant energy concentration by optical total internal reflection
US4712163A (en) * 1980-08-30 1987-12-08 Oxley Robert F Indicator lamps
US5404869A (en) 1992-04-16 1995-04-11 Tir Technologies, Inc. Faceted totally internally reflecting lens with individually curved faces on facets
JPH0629577A (ja) 1992-07-10 1994-02-04 Sumitomo Electric Ind Ltd 半導体発光素子の製造方法
US5882774A (en) 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
US5785404A (en) 1995-06-29 1998-07-28 Siemens Microelectronics, Inc. Localized illumination device
US5796487A (en) 1996-06-28 1998-08-18 Polaroid Corporation Dark field, photon tunneling imaging systems and methods for optical recording and retrieval
US5777433A (en) 1996-07-11 1998-07-07 Hewlett-Packard Company High refractive index package material and a light emitting device encapsulated with such material
US5898524A (en) 1996-12-04 1999-04-27 Nikon Corporation Microscope objective with ball lens and protection plate
US5813753A (en) 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6155699A (en) 1999-03-15 2000-12-05 Agilent Technologies, Inc. Efficient phosphor-conversion led structure
WO2001003161A2 (en) 1999-07-02 2001-01-11 Fusion Lighting, Inc. Lamp, oscillator and lighting apparatus
CA2380356C (en) * 1999-07-26 2011-01-18 Labosphere Institute Bulk-shaped lens, light-emitting unit, lighting equipment and optical information system
AU1244601A (en) 1999-10-29 2001-05-14 Trustees Of Princeton University, The Organic light emitting diode having spherical shaped patterns
KR100700993B1 (ko) 1999-12-03 2007-03-30 크리, 인코포레이티드 향상된 광 적출 구조체를 갖는 발광 다이오드 및 그 제조 방법
US6483196B1 (en) 2000-04-03 2002-11-19 General Electric Company Flip chip led apparatus
GB0017659D0 (en) 2000-07-19 2000-09-06 Secr Defence Light emitting diode with lens
US6635363B1 (en) 2000-08-21 2003-10-21 General Electric Company Phosphor coating with self-adjusting distance from LED chip
IE20020300A1 (en) * 2001-04-23 2003-03-19 Plasma Ireland Ltd An Illuminator
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US6916440B2 (en) 2001-05-31 2005-07-12 3M Innovative Properties Company Processes and apparatus for making transversely drawn films with substantially uniaxial character
US6895145B2 (en) 2001-08-02 2005-05-17 Edward Ho Apparatus and method for collecting light
JP2005505441A (ja) * 2001-10-08 2005-02-24 カリフォルニア インスティテュート オブ テクノロジー 微小加工レンズ、その製造の方法および応用
US6717045B2 (en) 2001-10-23 2004-04-06 Leon L. C. Chen Photovoltaic array module design for solar electric power generation systems
US6560038B1 (en) 2001-12-10 2003-05-06 Teledyne Lighting And Display Products, Inc. Light extraction from LEDs with light pipes
GB0203588D0 (en) 2002-02-14 2002-04-03 Enfis Ltd A light system
US6896381B2 (en) 2002-10-11 2005-05-24 Light Prescriptions Innovators, Llc Compact folded-optics illumination lens
US6717362B1 (en) 2002-11-14 2004-04-06 Agilent Technologies, Inc. Light emitting diode with gradient index layering
JP2004172806A (ja) 2002-11-19 2004-06-17 Canon Inc 画像読取り装置
US6936209B2 (en) 2002-11-27 2005-08-30 3M Innovative Properties Company Methods and devices for processing polymer films
US6949212B2 (en) 2002-11-27 2005-09-27 3M Innovative Properties Company Methods and devices for stretching polymer films
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US6871982B2 (en) 2003-01-24 2005-03-29 Digital Optics International Corporation High-density illumination system
WO2004068218A2 (en) 2003-01-24 2004-08-12 University Of Washington Optical beam scanning system for compact image display or image acquisition
US7157839B2 (en) 2003-01-27 2007-01-02 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
US7210977B2 (en) 2003-01-27 2007-05-01 3M Innovative Properties Comapny Phosphor based light source component and method of making
WO2005027576A2 (en) 2003-09-08 2005-03-24 Nanocrystal Lighting Corporation Light efficient packaging configurations for led lamps using high refractive index encapsulants
KR100555174B1 (ko) 2003-09-29 2006-03-03 바이오닉스(주) 고출력 엘이디패키지 제작방법 및 이를 이용한 고출력엘이디패키지
JP4042687B2 (ja) * 2003-12-15 2008-02-06 ソニー株式会社 照明装置及びバックライト装置
US7427146B2 (en) 2004-02-11 2008-09-23 3M Innovative Properties Company Light-collecting illumination system
US20050179041A1 (en) 2004-02-18 2005-08-18 Lumileds Lighting U.S., Llc Illumination system with LEDs
JP4436704B2 (ja) * 2004-03-12 2010-03-24 オリンパス株式会社 光学部材及び複合光学部材並びに照明装置
KR101080355B1 (ko) 2004-10-18 2011-11-04 삼성전자주식회사 발광다이오드와 그 렌즈
FR2891607B1 (fr) 2005-10-05 2007-12-28 Degre K Sa Dispositif d'eclairage a diode.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012529185A (ja) * 2009-06-02 2012-11-15 ブリッジラックス インコーポレイテッド 屈折要素を有する光源
JP2014123014A (ja) * 2012-12-21 2014-07-03 Casio Comput Co Ltd 光源装置、プロジェクタ
JP2021015910A (ja) * 2019-07-12 2021-02-12 Ｄｏｗａエレクトロニクス株式会社 発光素子ランプ及びその製造方法
JP7165629B2 (ja) 2019-07-12 2022-11-04 Ｄｏｗａエレクトロニクス株式会社 発光素子ランプ及びその製造方法

Also Published As

Publication number Publication date
CN101371371A (zh) 2009-02-18
EP1974398A2 (en) 2008-10-01
KR20080081085A (ko) 2008-09-05
US20070152231A1 (en) 2007-07-05
CN101371371B (zh) 2010-12-15
US7798678B2 (en) 2010-09-21
WO2007078971A3 (en) 2007-08-30
WO2007078971A2 (en) 2007-07-12
TW200735422A (en) 2007-09-16

Similar Documents

Publication Publication Date Title
JP2009522779A (ja) 複合物カプセル材のレンズを有するｌｅｄ
TWI465147B (zh) 具有中空集光透鏡之ｌｅｄ源
US7458703B2 (en) Light emitting diode package having dual lens structure for lateral light emission
JP4182783B2 (ja) Ｌｅｄパッケージ
JP4799341B2 (ja) 照明装置
US7473937B2 (en) Side-emission type LED package
US20090045421A1 (en) Surface mount type light emitting diode package device
JP6732848B2 (ja) 非対称な形状の発光装置、当該発光装置を用いたバックライトモジュール、当該発光装置の製造方法
JP2004235337A (ja) 発光ダイオード
TWI671924B (zh) 發光裝置及其製造方法
KR101031279B1 (ko) 반도체 발광장치
TW202131070A (zh) 直下式背光裝置
US20090135605A1 (en) Led unit
US20070258241A1 (en) Led package with non-bonded converging optical element
WO2008083188A2 (en) Led light source with converging extractor in an optical element
TW202129381A (zh) 直下式背光裝置
JP2019050326A (ja) プロジェクター用等の指向性を有するｌｅｄ光源装置
TWI557947B (zh) 發光二極體組合
US20220190213A1 (en) Material stack for leds with a dome
CN205863218U (zh) 发光二极管组件
KR20140077683A (ko) 발광 소자, 발광 소자 제조방법 및 조명 장치
KR20050090707A (ko) 칩형 발광다이오드

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091218

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091218

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20110128