TW200735422A - LED with compound encapsulant lens - Google Patents

LED with compound encapsulant lens

Info

Publication number
TW200735422A
TW200735422A TW095149979A TW95149979A TW200735422A TW 200735422 A TW200735422 A TW 200735422A TW 095149979 A TW095149979 A TW 095149979A TW 95149979 A TW95149979 A TW 95149979A TW 200735422 A TW200735422 A TW 200735422A
Authority
TW
Taiwan
Prior art keywords
lens
emitter
virtual image
led
inner lens
Prior art date
Application number
TW095149979A
Other languages
English (en)
Inventor
Patrick Rene Destain
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200735422A publication Critical patent/TW200735422A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW095149979A 2005-12-30 2006-12-29 LED with compound encapsulant lens TW200735422A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/322,801 US7798678B2 (en) 2005-12-30 2005-12-30 LED with compound encapsulant lens

Publications (1)

Publication Number Publication Date
TW200735422A true TW200735422A (en) 2007-09-16

Family

ID=38223464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149979A TW200735422A (en) 2005-12-30 2006-12-29 LED with compound encapsulant lens

Country Status (7)

Country Link
US (1) US7798678B2 (zh)
EP (1) EP1974398A2 (zh)
JP (1) JP2009522779A (zh)
KR (1) KR20080081085A (zh)
CN (1) CN101371371B (zh)
TW (1) TW200735422A (zh)
WO (1) WO2007078971A2 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI395979B (zh) * 2008-07-04 2013-05-11 A microlens and a mold manufacturing method thereof, and a light emitting device
TWI407597B (zh) * 2010-02-05 2013-09-01 Shinyoptics Corp 發光二極體照明裝置
TWI465671B (zh) * 2012-04-26 2014-12-21 Advanced Optoelectronic Tech 發光二極體燈源裝置

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395979B (zh) * 2008-07-04 2013-05-11 A microlens and a mold manufacturing method thereof, and a light emitting device
TWI407597B (zh) * 2010-02-05 2013-09-01 Shinyoptics Corp 發光二極體照明裝置
TWI465671B (zh) * 2012-04-26 2014-12-21 Advanced Optoelectronic Tech 發光二極體燈源裝置

Also Published As

Publication number Publication date
WO2007078971A3 (en) 2007-08-30
US20070152231A1 (en) 2007-07-05
US7798678B2 (en) 2010-09-21
CN101371371A (zh) 2009-02-18
KR20080081085A (ko) 2008-09-05
EP1974398A2 (en) 2008-10-01
WO2007078971A2 (en) 2007-07-12
JP2009522779A (ja) 2009-06-11
CN101371371B (zh) 2010-12-15

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