CN101371371B - 具有复式封壳透镜的led - Google Patents

具有复式封壳透镜的led Download PDF

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Publication number
CN101371371B
CN101371371B CN2006800526913A CN200680052691A CN101371371B CN 101371371 B CN101371371 B CN 101371371B CN 2006800526913 A CN2006800526913 A CN 2006800526913A CN 200680052691 A CN200680052691 A CN 200680052691A CN 101371371 B CN101371371 B CN 101371371B
Authority
CN
China
Prior art keywords
lens
light source
led
light
inner lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800526913A
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English (en)
Chinese (zh)
Other versions
CN101371371A (zh
Inventor
帕特里克·R·德斯藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101371371A publication Critical patent/CN101371371A/zh
Application granted granted Critical
Publication of CN101371371B publication Critical patent/CN101371371B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Led Device Packages (AREA)
CN2006800526913A 2005-12-30 2006-12-20 具有复式封壳透镜的led Expired - Fee Related CN101371371B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/322,801 US7798678B2 (en) 2005-12-30 2005-12-30 LED with compound encapsulant lens
US11/322,801 2005-12-30
PCT/US2006/048692 WO2007078971A2 (en) 2005-12-30 2006-12-20 Led with compound encapsulant lens

Publications (2)

Publication Number Publication Date
CN101371371A CN101371371A (zh) 2009-02-18
CN101371371B true CN101371371B (zh) 2010-12-15

Family

ID=38223464

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800526913A Expired - Fee Related CN101371371B (zh) 2005-12-30 2006-12-20 具有复式封壳透镜的led

Country Status (7)

Country Link
US (1) US7798678B2 (enExample)
EP (1) EP1974398A2 (enExample)
JP (1) JP2009522779A (enExample)
KR (1) KR20080081085A (enExample)
CN (1) CN101371371B (enExample)
TW (1) TW200735422A (enExample)
WO (1) WO2007078971A2 (enExample)

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JP4979299B2 (ja) * 2006-08-03 2012-07-18 豊田合成株式会社 光学装置及びその製造方法
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Also Published As

Publication number Publication date
JP2009522779A (ja) 2009-06-11
CN101371371A (zh) 2009-02-18
EP1974398A2 (en) 2008-10-01
KR20080081085A (ko) 2008-09-05
US20070152231A1 (en) 2007-07-05
US7798678B2 (en) 2010-09-21
WO2007078971A3 (en) 2007-08-30
WO2007078971A2 (en) 2007-07-12
TW200735422A (en) 2007-09-16

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