JP2009518874A - 高効率発光ダイオード(led) - Google Patents
高効率発光ダイオード(led) Download PDFInfo
- Publication number
- JP2009518874A JP2009518874A JP2008544546A JP2008544546A JP2009518874A JP 2009518874 A JP2009518874 A JP 2009518874A JP 2008544546 A JP2008544546 A JP 2008544546A JP 2008544546 A JP2008544546 A JP 2008544546A JP 2009518874 A JP2009518874 A JP 2009518874A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- optical element
- led
- phosphor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0018—Redirecting means on the surface of the light guide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74848005P | 2005-12-08 | 2005-12-08 | |
| US76497506P | 2006-02-03 | 2006-02-03 | |
| PCT/US2006/047008 WO2007067758A2 (en) | 2005-12-08 | 2006-12-08 | High efficiency light emitting diode (led) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009518874A true JP2009518874A (ja) | 2009-05-07 |
| JP2009518874A5 JP2009518874A5 (enExample) | 2010-12-16 |
Family
ID=38123537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008544546A Pending JP2009518874A (ja) | 2005-12-08 | 2006-12-08 | 高効率発光ダイオード(led) |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7956371B2 (enExample) |
| EP (1) | EP1969647A4 (enExample) |
| JP (1) | JP2009518874A (enExample) |
| KR (1) | KR20080077259A (enExample) |
| WO (1) | WO2007067758A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100132149A (ko) * | 2009-06-09 | 2010-12-17 | 서울반도체 주식회사 | 편광 광원 및 형광체 필터를 채택한 액정 디스플레이 |
| JP2011151311A (ja) * | 2010-01-25 | 2011-08-04 | Panasonic Electric Works Co Ltd | 発光装置 |
| WO2021070910A1 (ja) * | 2019-10-09 | 2021-04-15 | パナソニックIpマネジメント株式会社 | 窒化物半導体構造体、窒化物半導体デバイス及びその製造方法 |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7719020B2 (en) | 2005-06-17 | 2010-05-18 | The Regents Of The University Of California | (Al,Ga,In)N and ZnO direct wafer bonded structure for optoelectronic applications, and its fabrication method |
| US7781789B2 (en) * | 2006-11-15 | 2010-08-24 | The Regents Of The University Of California | Transparent mirrorless light emitting diode |
| US20070258241A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with non-bonded converging optical element |
| US20070257271A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with encapsulated converging optical element |
| US7525126B2 (en) * | 2006-05-02 | 2009-04-28 | 3M Innovative Properties Company | LED package with converging optical element |
| US20070257270A1 (en) * | 2006-05-02 | 2007-11-08 | 3M Innovative Properties Company | Led package with wedge-shaped optical element |
| WO2008011377A2 (en) * | 2006-07-17 | 2008-01-24 | 3M Innovative Properties Company | Led package with converging extractor |
| WO2008060586A2 (en) | 2006-11-15 | 2008-05-22 | The Regents Of The University Of California | Textured phosphor conversion layer light emitting diode |
| JP5372766B2 (ja) * | 2006-11-15 | 2013-12-18 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 光取り出し効率の高い球形led |
| US20090121250A1 (en) * | 2006-11-15 | 2009-05-14 | Denbaars Steven P | High light extraction efficiency light emitting diode (led) using glass packaging |
| TWI460881B (zh) | 2006-12-11 | 2014-11-11 | 美國加利福尼亞大學董事會 | 透明發光二極體 |
| JP2010512661A (ja) * | 2006-12-11 | 2010-04-22 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 高特性無極性iii族窒化物光デバイスの有機金属化学気相成長法(mocvd)による成長 |
| JP2010512660A (ja) * | 2006-12-11 | 2010-04-22 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 無極性および半極性の発光デバイス |
| US20080192458A1 (en) * | 2007-02-12 | 2008-08-14 | Intematix Corporation | Light emitting diode lighting system |
| JP2010534943A (ja) | 2007-07-26 | 2010-11-11 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | P型表面を有する発光ダイオード |
| CN101861660B (zh) * | 2007-11-19 | 2012-12-26 | 皇家飞利浦电子股份有限公司 | 具有预定外观的光源和照明系统 |
| EP2218114A4 (en) | 2007-11-30 | 2014-12-24 | Univ California | HIGH-PERFORMANCE LIGHT-EMITTING NITRIDE-BASED LIGHT-EMITTING DIODE BY SURFACE RUGOSIFICATION |
| CN101482247A (zh) * | 2008-01-11 | 2009-07-15 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
| US8567974B2 (en) * | 2008-02-27 | 2013-10-29 | Koninklijke Philips N.V. | Illumination device with LED and one or more transmissive windows |
| US7719022B2 (en) * | 2008-05-06 | 2010-05-18 | Palo Alto Research Center Incorporated | Phosphor illumination optics for LED light sources |
| US8105853B2 (en) * | 2008-06-27 | 2012-01-31 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
| US8159131B2 (en) * | 2008-06-30 | 2012-04-17 | Bridgelux, Inc. | Light emitting device having a transparent thermally conductive layer |
| US8410681B2 (en) * | 2008-06-30 | 2013-04-02 | Bridgelux, Inc. | Light emitting device having a refractory phosphor layer |
| US7839062B2 (en) * | 2008-08-29 | 2010-11-23 | Bridgelux Inc. | Optical platform to enable efficient LED emission |
| US20100059771A1 (en) * | 2008-09-10 | 2010-03-11 | Chris Lowery | Multi-layer led phosphors |
| US7825427B2 (en) * | 2008-09-12 | 2010-11-02 | Bridgelux, Inc. | Method and apparatus for generating phosphor film with textured surface |
| US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
| JP2011108588A (ja) * | 2009-11-20 | 2011-06-02 | Koito Mfg Co Ltd | 発光モジュールおよび車両用灯具 |
| US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
| US8384121B2 (en) | 2010-06-29 | 2013-02-26 | Cooledge Lighting Inc. | Electronic devices with yielding substrates |
| US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
| TWI384166B (zh) * | 2010-02-09 | 2013-02-01 | Everlight Electronics Co Ltd | 電子裝置及其發光單元 |
| US8783915B2 (en) | 2010-02-11 | 2014-07-22 | Bridgelux, Inc. | Surface-textured encapsulations for use with light emitting diodes |
| KR101655464B1 (ko) * | 2010-04-15 | 2016-09-07 | 엘지이노텍 주식회사 | 발광소자 패키지, 그 제조방법 및 조명시스템 |
| WO2011140353A2 (en) * | 2010-05-05 | 2011-11-10 | Intellilight Corp. | Remote phosphor tape for lighting units |
| US8455888B2 (en) | 2010-05-20 | 2013-06-04 | Industrial Technology Research Institute | Light emitting diode module, and light emitting diode lamp |
| US8807799B2 (en) | 2010-06-11 | 2014-08-19 | Intematix Corporation | LED-based lamps |
| KR101735670B1 (ko) * | 2010-07-13 | 2017-05-15 | 엘지이노텍 주식회사 | 발광 소자 |
| US20130221826A1 (en) * | 2010-09-21 | 2013-08-29 | Nec Corporation | Phosphor-coated light-emitting device |
| US20120138981A1 (en) * | 2010-12-02 | 2012-06-07 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Light-Emitting Diode Apparatus and Method for Making the Same |
| US8569889B1 (en) * | 2011-02-09 | 2013-10-29 | Nlight Photonics Corporation | Nano thick Pt metallization layer |
| US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
| US8911099B2 (en) * | 2011-03-31 | 2014-12-16 | Fusion Optix, Inc. | Method of developing and manufacturing optical elements and assemblies |
| JP2012248553A (ja) * | 2011-05-25 | 2012-12-13 | Panasonic Corp | 発光装置及びそれを用いた照明装置 |
| TW201306323A (zh) * | 2011-07-31 | 2013-02-01 | Walsin Lihwa Corp | 發光二極體裝置 |
| TW201327937A (zh) * | 2011-12-30 | 2013-07-01 | Radiant Opto Electronics Corp | 發光二極體元件 |
| DE102012102122A1 (de) * | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
| DE102012102119A1 (de) * | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
| US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
| US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
| US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
| US20130328074A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
| US9887327B2 (en) | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
| US9818919B2 (en) | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
| RU2528112C1 (ru) * | 2013-04-26 | 2014-09-10 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский ядерный университет "МИФИ" (НИЯУ МИФИ) | Ультрафиолетовый светодиод на нитридных гетероструктурах |
| CN105705860B (zh) * | 2013-11-05 | 2019-05-28 | 飞利浦照明控股有限公司 | 发光设备 |
| WO2017053511A1 (en) * | 2015-09-25 | 2017-03-30 | Corning Incorporated | Wide-angle lenses and optical assemblies comprising the same |
| CN111457275B (zh) * | 2019-01-18 | 2025-04-18 | 深圳市绎立锐光科技开发有限公司 | 一种照明装置 |
| JP6690845B1 (ja) | 2019-03-26 | 2020-04-28 | Necプラットフォームズ株式会社 | Led光源機構、電話機およびled光源形成方法 |
| US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
| US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
| CN113299813B (zh) * | 2021-05-13 | 2022-11-08 | Tcl华星光电技术有限公司 | Led封装结构、led封装结构制作方法及显示模组 |
| CN113654008B (zh) * | 2021-07-29 | 2024-01-30 | 广东洲明节能科技有限公司 | 白光照明装置 |
| WO2023136880A1 (en) * | 2022-01-13 | 2023-07-20 | Ohio State Innovation Foundation | Photonic materials |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003100873A1 (en) * | 2002-05-28 | 2003-12-04 | Matsushita Electric Works, Ltd. | Light emitting element, light emitting device and surface emission illuminating device using it |
| JP2005057266A (ja) * | 2003-07-31 | 2005-03-03 | Lumileds Lighting Us Llc | 光取り出し効率が改善された発光装置 |
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2006
- 2006-12-08 JP JP2008544546A patent/JP2009518874A/ja active Pending
- 2006-12-08 EP EP06845097A patent/EP1969647A4/en not_active Withdrawn
- 2006-12-08 US US11/608,439 patent/US7956371B2/en not_active Expired - Fee Related
- 2006-12-08 WO PCT/US2006/047008 patent/WO2007067758A2/en not_active Ceased
- 2006-12-08 KR KR1020087016522A patent/KR20080077259A/ko not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003100873A1 (en) * | 2002-05-28 | 2003-12-04 | Matsushita Electric Works, Ltd. | Light emitting element, light emitting device and surface emission illuminating device using it |
| JP2005057266A (ja) * | 2003-07-31 | 2005-03-03 | Lumileds Lighting Us Llc | 光取り出し効率が改善された発光装置 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100132149A (ko) * | 2009-06-09 | 2010-12-17 | 서울반도체 주식회사 | 편광 광원 및 형광체 필터를 채택한 액정 디스플레이 |
| KR101578874B1 (ko) * | 2009-06-09 | 2015-12-28 | 서울반도체 주식회사 | 편광 광원 및 형광체 필터를 채택한 액정 디스플레이 |
| JP2011151311A (ja) * | 2010-01-25 | 2011-08-04 | Panasonic Electric Works Co Ltd | 発光装置 |
| WO2021070910A1 (ja) * | 2019-10-09 | 2021-04-15 | パナソニックIpマネジメント株式会社 | 窒化物半導体構造体、窒化物半導体デバイス及びその製造方法 |
| JPWO2021070910A1 (enExample) * | 2019-10-09 | 2021-04-15 | ||
| CN114514616A (zh) * | 2019-10-09 | 2022-05-17 | 松下知识产权经营株式会社 | 氮化物半导体结构体、氮化物半导体器件以及用于制作该器件的方法 |
| JP7212173B2 (ja) | 2019-10-09 | 2023-01-24 | パナソニックIpマネジメント株式会社 | 窒化物半導体構造体、窒化物半導体デバイス及びその製造方法 |
| US12100936B2 (en) | 2019-10-09 | 2024-09-24 | Panasonic Intellectual Property Management Co., Ltd. | Nitride semiconductor structure, nitride semiconductor device, and method for fabricating the device |
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| Publication number | Publication date |
|---|---|
| WO2007067758A2 (en) | 2007-06-14 |
| US20070145397A1 (en) | 2007-06-28 |
| US7956371B2 (en) | 2011-06-07 |
| KR20080077259A (ko) | 2008-08-21 |
| EP1969647A2 (en) | 2008-09-17 |
| WO2007067758A3 (en) | 2008-01-10 |
| EP1969647A4 (en) | 2012-08-01 |
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