JP2009518872A5 - - Google Patents

Download PDF

Info

Publication number
JP2009518872A5
JP2009518872A5 JP2008544516A JP2008544516A JP2009518872A5 JP 2009518872 A5 JP2009518872 A5 JP 2009518872A5 JP 2008544516 A JP2008544516 A JP 2008544516A JP 2008544516 A JP2008544516 A JP 2008544516A JP 2009518872 A5 JP2009518872 A5 JP 2009518872A5
Authority
JP
Japan
Prior art keywords
substrate
polishing film
flexible polishing
edge
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008544516A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009518872A (ja
Filing date
Publication date
Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Application filed filed Critical
Priority claimed from PCT/US2006/046765 external-priority patent/WO2007070353A2/en
Publication of JP2009518872A publication Critical patent/JP2009518872A/ja
Publication of JP2009518872A5 publication Critical patent/JP2009518872A5/ja
Pending legal-status Critical Current

Links

JP2008544516A 2005-12-09 2006-12-07 基板を処理する方法及び装置 Pending JP2009518872A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/299,295 US7993485B2 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/298,555 US20070131653A1 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
PCT/US2006/046765 WO2007070353A2 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012100094A Division JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Publications (2)

Publication Number Publication Date
JP2009518872A JP2009518872A (ja) 2009-05-07
JP2009518872A5 true JP2009518872A5 (es) 2011-10-20

Family

ID=38163413

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008544516A Pending JP2009518872A (ja) 2005-12-09 2006-12-07 基板を処理する方法及び装置
JP2012100094A Pending JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012100094A Pending JP2012183637A (ja) 2005-12-09 2012-04-25 基板を処理する方法及び装置

Country Status (5)

Country Link
EP (1) EP1976806A4 (es)
JP (2) JP2009518872A (es)
KR (1) KR101236855B1 (es)
TW (1) TWI362697B (es)
WO (1) WO2007070353A2 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993485B2 (en) 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US7976361B2 (en) 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP5274993B2 (ja) * 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP2014083647A (ja) * 2012-10-25 2014-05-12 Avanstrate Inc ガラス基板研磨用磁性流動体
US9711381B2 (en) * 2013-01-31 2017-07-18 Applied Materials, Inc. Methods and apparatus for post-chemical mechanical planarization substrate cleaning
CN105722641B (zh) 2013-10-25 2019-05-28 应用材料公司 用于化学机械平坦化后的基板抛光预清洁的系统、方法和装置
DE102015008814A1 (de) * 2015-07-10 2017-01-12 Thielenhaus Technologies Gmbh Andrückschuh mit Expansionskammer
JP2017087305A (ja) * 2015-11-02 2017-05-25 日本電気硝子株式会社 円板状ワークの研磨加工方法及び研磨加工装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6414353B1 (ja) * 2018-03-27 2018-10-31 株式会社不二越 フィルムラップ加工装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JP2924890B2 (ja) * 1998-04-20 1999-07-26 トヨタ自動車株式会社 研摩方法
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
JP2002154041A (ja) * 2000-11-17 2002-05-28 I M T Kk 研磨装置
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
JP2005186176A (ja) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd ウエハ端面研磨装置
US7682225B2 (en) * 2004-02-25 2010-03-23 Ebara Corporation Polishing apparatus and substrate processing apparatus

Similar Documents

Publication Publication Date Title
JP2009518872A5 (es)
US7993485B2 (en) Methods and apparatus for processing a substrate
US20090036042A1 (en) Methods and apparatus for polishing an edge of a substrate
JP6100002B2 (ja) 基板裏面の研磨方法および基板処理装置
US20070131653A1 (en) Methods and apparatus for processing a substrate
US20080293331A1 (en) Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in seminconductor manufacturing
US20080293335A1 (en) Methods and apparatus for substrate edge polishing using a polishing arm
TWI362697B (en) Methods and apparatus for processing a substrate
JPH0639708A (ja) 半導体ウエハを平面化する装置及び方法、及び研磨パッド
JP2008288599A (ja) 研磨パッドを使用して基板のノッチを研磨する方法及び装置
JP2006303112A5 (es)
JP2009119537A (ja) 基板処理方法及び基板処理装置
US8579679B2 (en) Conditioning method and conditioning apparatus for polishing pad for use in double side polishing device
TW200908123A (en) Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP2010155338A5 (es)
JP2019077003A5 (es)
JP2006261681A5 (es)
US6419559B1 (en) Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
JP5464497B2 (ja) 基板研磨方法及びその装置
US20150306727A1 (en) Polishing method and holder
US6520841B2 (en) Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
JPH0766160A (ja) 半導体基板の研磨方法及び研磨装置
JP2010172975A5 (es)
TW201302381A (zh) 板狀體之研磨裝置
JP2013235635A (ja) 貼付装置および貼付方法