KR101236855B1 - 기판 처리 방법 및 장치 - Google Patents

기판 처리 방법 및 장치 Download PDF

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Publication number
KR101236855B1
KR101236855B1 KR1020087015337A KR20087015337A KR101236855B1 KR 101236855 B1 KR101236855 B1 KR 101236855B1 KR 1020087015337 A KR1020087015337 A KR 1020087015337A KR 20087015337 A KR20087015337 A KR 20087015337A KR 101236855 B1 KR101236855 B1 KR 101236855B1
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KR
South Korea
Prior art keywords
substrate
edge
delete delete
polishing
polishing film
Prior art date
Application number
KR1020087015337A
Other languages
English (en)
Korean (ko)
Other versions
KR20080075001A (ko
Inventor
에릭 씨. 와신거
게리 씨. 에팅커
센-호우 고
웨이-융 후
리앙-유 첸
호 센 신
도날드 올가도
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/298,555 external-priority patent/US20070131653A1/en
Priority claimed from US11/299,295 external-priority patent/US7993485B2/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20080075001A publication Critical patent/KR20080075001A/ko
Application granted granted Critical
Publication of KR101236855B1 publication Critical patent/KR101236855B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020087015337A 2005-12-09 2006-12-07 기판 처리 방법 및 장치 KR101236855B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11/298,555 US20070131653A1 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/298,555 2005-12-09
US11/299,295 US7993485B2 (en) 2005-12-09 2005-12-09 Methods and apparatus for processing a substrate
US11/299,295 2005-12-09
PCT/US2006/046765 WO2007070353A2 (en) 2005-12-09 2006-12-07 Methods and apparatus for processing a substrate

Publications (2)

Publication Number Publication Date
KR20080075001A KR20080075001A (ko) 2008-08-13
KR101236855B1 true KR101236855B1 (ko) 2013-02-26

Family

ID=38163413

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087015337A KR101236855B1 (ko) 2005-12-09 2006-12-07 기판 처리 방법 및 장치

Country Status (5)

Country Link
EP (1) EP1976806A4 (es)
JP (2) JP2009518872A (es)
KR (1) KR101236855B1 (es)
TW (1) TWI362697B (es)
WO (1) WO2007070353A2 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993485B2 (en) 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US7976361B2 (en) * 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
JP5274993B2 (ja) * 2007-12-03 2013-08-28 株式会社荏原製作所 研磨装置
JP2014083647A (ja) * 2012-10-25 2014-05-12 Avanstrate Inc ガラス基板研磨用磁性流動体
TWI620240B (zh) * 2013-01-31 2018-04-01 應用材料股份有限公司 用於化學機械平坦化後的基板清潔之方法及設備
TWI662610B (zh) 2013-10-25 2019-06-11 美商應用材料股份有限公司 用於化學機械平坦化後之基板拋光預清洗的系統、方法及裝置
DE102015008814A1 (de) * 2015-07-10 2017-01-12 Thielenhaus Technologies Gmbh Andrückschuh mit Expansionskammer
JP2017087305A (ja) * 2015-11-02 2017-05-25 日本電気硝子株式会社 円板状ワークの研磨加工方法及び研磨加工装置
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6414353B1 (ja) * 2018-03-27 2018-10-31 株式会社不二越 フィルムラップ加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533399A (en) * 1983-04-12 1985-08-06 Minnesota Mining And Manufacturing Company Contact lens cleaning method
JP2924890B2 (ja) * 1998-04-20 1999-07-26 トヨタ自動車株式会社 研摩方法
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
JP2002154041A (ja) * 2000-11-17 2002-05-28 I M T Kk 研磨装置
JP4156200B2 (ja) * 2001-01-09 2008-09-24 株式会社荏原製作所 研磨装置及び研磨方法
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置
JP2005186176A (ja) * 2003-12-24 2005-07-14 Shinko Electric Ind Co Ltd ウエハ端面研磨装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
JP2012183637A (ja) 2012-09-27
KR20080075001A (ko) 2008-08-13
TWI362697B (en) 2012-04-21
WO2007070353A3 (en) 2007-11-29
WO2007070353A2 (en) 2007-06-21
EP1976806A2 (en) 2008-10-08
TW200735200A (en) 2007-09-16
EP1976806A4 (en) 2011-08-10
JP2009518872A (ja) 2009-05-07

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