JP2009516382A - 導電層をパターニングするための方法および装置ならびにそれによって製造されるデバイス - Google Patents
導電層をパターニングするための方法および装置ならびにそれによって製造されるデバイス Download PDFInfo
- Publication number
- JP2009516382A JP2009516382A JP2008540722A JP2008540722A JP2009516382A JP 2009516382 A JP2009516382 A JP 2009516382A JP 2008540722 A JP2008540722 A JP 2008540722A JP 2008540722 A JP2008540722 A JP 2008540722A JP 2009516382 A JP2009516382 A JP 2009516382A
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- Prior art keywords
- layer
- stack
- conductive layer
- compressible
- conductive
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/341—Transition metal complexes, e.g. Ru(II)polypyridine complexes
- H10K85/344—Transition metal complexes, e.g. Ru(II)polypyridine complexes comprising ruthenium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0523163.4A GB0523163D0 (en) | 2005-11-14 | 2005-11-14 | Patterning of conductive layers with underlying compressible spacer layer or spacer layer stack |
| PCT/IB2006/003995 WO2007074404A2 (en) | 2005-11-14 | 2006-11-14 | Method and apparatus for patterning a conductive layer, and a device produced thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009516382A true JP2009516382A (ja) | 2009-04-16 |
| JP2009516382A5 JP2009516382A5 (enExample) | 2010-01-07 |
Family
ID=35516877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008540722A Pending JP2009516382A (ja) | 2005-11-14 | 2006-11-14 | 導電層をパターニングするための方法および装置ならびにそれによって製造されるデバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20090038683A1 (enExample) |
| EP (1) | EP1949469A2 (enExample) |
| JP (1) | JP2009516382A (enExample) |
| KR (1) | KR20080073331A (enExample) |
| CN (2) | CN101331624A (enExample) |
| GB (1) | GB0523163D0 (enExample) |
| WO (1) | WO2007074404A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007149679A (ja) * | 2005-11-25 | 2007-06-14 | Seiko Epson Corp | 電気化学電池およびその製造方法 |
| WO2011013275A1 (ja) * | 2009-07-28 | 2011-02-03 | シャープ株式会社 | 有機素子及びそれを備えた有機デバイス |
| JP2018510389A (ja) * | 2015-01-12 | 2018-04-12 | ドルビー ラボラトリーズ ライセンシング コーポレイション | 画素タイル構造およびレイアウト |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2432723B (en) * | 2005-11-25 | 2010-12-08 | Seiko Epson Corp | Electrochemical cell and method of manufacture |
| GB2432721B (en) * | 2005-11-25 | 2011-06-22 | Seiko Epson Corp | Electrochemical cell structure and method of fabrication |
| US8343779B2 (en) * | 2007-04-19 | 2013-01-01 | Basf Se | Method for forming a pattern on a substrate and electronic device formed thereby |
| US20090283137A1 (en) * | 2008-05-15 | 2009-11-19 | Steven Thomas Croft | Solar-cell module with in-laminate diodes and external-connection mechanisms mounted to respective edge regions |
| FR2934714B1 (fr) | 2008-07-31 | 2010-12-17 | Commissariat Energie Atomique | Transistor organique et procede de fabrication d'une couche dielectrique d'un tel transistor. |
| GB2467316B (en) | 2009-01-28 | 2014-04-09 | Pragmatic Printing Ltd | Electronic devices, circuits and their manufacture |
| GB2462693B (en) * | 2008-07-31 | 2013-06-19 | Pragmatic Printing Ltd | Forming electrically insulative regions |
| WO2010017441A2 (en) * | 2008-08-07 | 2010-02-11 | Massachusetts Institute Of Technology | Method and apparatus for simultaneous lateral and vertical patterning of molecular organic films |
| US8586857B2 (en) * | 2008-11-04 | 2013-11-19 | Miasole | Combined diode, lead assembly incorporating an expansion joint |
| US9059351B2 (en) | 2008-11-04 | 2015-06-16 | Apollo Precision (Fujian) Limited | Integrated diode assemblies for photovoltaic modules |
| WO2010061035A1 (en) * | 2008-11-27 | 2010-06-03 | Upm-Kymmene Corporation | Embossing of electronic thin-film components |
| JP2010237375A (ja) * | 2009-03-31 | 2010-10-21 | Mitsui Chemicals Inc | 微細構造体およびそれを用いた光学素子 |
| US20100319765A1 (en) * | 2009-06-17 | 2010-12-23 | Korea University Research And Business Foundation | Photovoltaic devices |
| US8153528B1 (en) * | 2009-11-20 | 2012-04-10 | Integrated Photovoltaic, Inc. | Surface characteristics of graphite and graphite foils |
| US20110146778A1 (en) * | 2009-12-22 | 2011-06-23 | Miasole | Shielding of interior diode assemblies from compression forces in thin-film photovoltaic modules |
| US9139093B2 (en) * | 2010-12-02 | 2015-09-22 | Seiko Epson Corporation | Printed matter manufacturing method, printed matter manufacturing device, and printed matter |
| US20120305892A1 (en) * | 2010-12-08 | 2012-12-06 | Martin Thornton | Electronic device, method of manufacturing a device and apparatus for manufacturing a device |
| WO2012106433A2 (en) * | 2011-02-01 | 2012-08-09 | University Of South Florida | A partially-sprayed layer organic solar photovoltaic cell using a self-assembled monolayer and method of manufacture |
| EP2833427A4 (en) | 2012-05-09 | 2016-02-24 | Lg Chemical Ltd | ORGANIC ELECTROCHEMICAL DEVICE AND METHOD FOR THE PRODUCTION THEREOF |
| US9496458B2 (en) * | 2012-06-08 | 2016-11-15 | Cree, Inc. | Semiconductor light emitting diodes with crack-tolerant barrier structures and methods of fabricating the same |
| WO2014145609A1 (en) | 2013-03-15 | 2014-09-18 | University Of South Florida | Mask-stack-shift method to fabricate organic solar array by spray |
| CN104681743B (zh) * | 2013-11-29 | 2017-02-15 | 清华大学 | 有机发光二极管的制备方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP1949469A2 (en) | 2008-07-30 |
| GB0523163D0 (en) | 2005-12-21 |
| KR20080073331A (ko) | 2008-08-08 |
| WO2007074404A3 (en) | 2007-11-15 |
| US20090038683A1 (en) | 2009-02-12 |
| WO2007074404A2 (en) | 2007-07-05 |
| CN101331624A (zh) | 2008-12-24 |
| CN103199196A (zh) | 2013-07-10 |
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