JP2009515435A5 - - Google Patents

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Publication number
JP2009515435A5
JP2009515435A5 JP2008539032A JP2008539032A JP2009515435A5 JP 2009515435 A5 JP2009515435 A5 JP 2009515435A5 JP 2008539032 A JP2008539032 A JP 2008539032A JP 2008539032 A JP2008539032 A JP 2008539032A JP 2009515435 A5 JP2009515435 A5 JP 2009515435A5
Authority
JP
Japan
Prior art keywords
circuit panel
sensor unit
optical
imaging
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008539032A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009515435A (ja
Filing date
Publication date
Priority claimed from US11/265,727 external-priority patent/US20060109366A1/en
Application filed filed Critical
Publication of JP2009515435A publication Critical patent/JP2009515435A/ja
Publication of JP2009515435A5 publication Critical patent/JP2009515435A5/ja
Withdrawn legal-status Critical Current

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JP2008539032A 2005-11-02 2006-11-02 小型レンズターレットアセンブリ Withdrawn JP2009515435A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/265,727 US20060109366A1 (en) 2004-05-04 2005-11-02 Compact lens turret assembly
PCT/US2006/042829 WO2007056069A1 (en) 2005-11-02 2006-11-02 Compact lens turret assembly

Publications (2)

Publication Number Publication Date
JP2009515435A JP2009515435A (ja) 2009-04-09
JP2009515435A5 true JP2009515435A5 (cg-RX-API-DMAC7.html) 2010-03-04

Family

ID=37775236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008539032A Withdrawn JP2009515435A (ja) 2005-11-02 2006-11-02 小型レンズターレットアセンブリ

Country Status (4)

Country Link
US (2) US20060109366A1 (cg-RX-API-DMAC7.html)
EP (1) EP1943677A1 (cg-RX-API-DMAC7.html)
JP (1) JP2009515435A (cg-RX-API-DMAC7.html)
WO (1) WO2007056069A1 (cg-RX-API-DMAC7.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060109366A1 (en) * 2004-05-04 2006-05-25 Tessera, Inc. Compact lens turret assembly
WO2005109861A1 (en) * 2004-05-04 2005-11-17 Tessera, Inc. Compact lens turret assembly
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
EP1789829A1 (en) 2004-09-14 2007-05-30 CDM Optics, Inc. Low height imaging system and associated methods
US20070058069A1 (en) * 2005-09-14 2007-03-15 Po-Hung Chen Packaging structure of a light sensation module
US7443597B2 (en) * 2005-12-27 2008-10-28 Tessera, Inc. Liquid lens with piezoelectric voltage converter
US7690107B2 (en) * 2007-06-15 2010-04-06 The Boeing Company Method for aligning and installing flexible circuit interconnects
US7868830B2 (en) * 2008-05-13 2011-01-11 The Boeing Company Dual beam dual selectable polarization antenna
JP5998962B2 (ja) * 2013-01-31 2016-09-28 三菱電機株式会社 半導体光装置
US9955054B2 (en) 2015-02-05 2018-04-24 Robert Bosch Gmbh Camera and method for assembling with fixed final alignment
CN107508938B (zh) * 2017-09-06 2020-06-12 Oppo广东移动通信有限公司 相机模组及电子装置
CN110505372B (zh) * 2018-05-18 2021-03-09 致伸科技股份有限公司 摄像模块的组装方法
CN111474669B (zh) * 2020-05-29 2025-02-18 深圳市明信测试设备股份有限公司 一种基于鱼眼镜头的定位组装装置

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FR2791811B1 (fr) * 1999-03-31 2002-06-14 Sofradir Composant electrique ou electronique encapsule de maniere etanche
US6117193A (en) * 1999-10-20 2000-09-12 Amkor Technology, Inc. Optical sensor array mounting and alignment
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6455774B1 (en) * 1999-12-08 2002-09-24 Amkor Technology, Inc. Molded image sensor package
JP2001203913A (ja) * 2000-01-21 2001-07-27 Sony Corp 撮像装置、カメラモジュール及びカメラシステム
US6784409B2 (en) * 2000-03-28 2004-08-31 Canon Kabushiki Kaisha Electronic device with encapsulant of photo-set resin and production process of same
JP3607160B2 (ja) * 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
US6665455B1 (en) * 2000-08-14 2003-12-16 Opcom Inc. Structure of an image-sensing module
JP2002124654A (ja) * 2000-10-13 2002-04-26 Mitsubishi Electric Corp 固体撮像装置
US7304684B2 (en) * 2000-11-14 2007-12-04 Kabushiki Kaisha Toshiba Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus
US6342406B1 (en) * 2000-11-15 2002-01-29 Amkor Technology, Inc. Flip chip on glass image sensor package fabrication method
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JP3821652B2 (ja) * 2001-02-26 2006-09-13 三菱電機株式会社 撮像装置
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KR20030040865A (ko) * 2001-11-16 2003-05-23 주식회사 하이닉스반도체 암전류를 감소시키기 위한 이미지센서의 제조 방법
JP3952897B2 (ja) * 2002-07-31 2007-08-01 日本電気株式会社 カメラモジュール及びそれを用いた携帯通信端末
JP4397819B2 (ja) * 2002-09-17 2010-01-13 アンテルヨン、ベスローテン、フェンノートシャップ カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法
JP3867785B2 (ja) * 2002-10-15 2007-01-10 セイコーエプソン株式会社 光モジュール
JP2004242166A (ja) * 2003-02-07 2004-08-26 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
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JP4710610B2 (ja) * 2003-08-22 2011-06-29 コニカミノルタオプト株式会社 固体撮像装置及び該固体撮像装置を備えた撮像装置
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KR100557140B1 (ko) * 2003-09-16 2006-03-03 삼성전자주식회사 커넥터와 그를 이용한 이미지 센서 모듈
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TWI234884B (en) * 2003-12-31 2005-06-21 Advanced Semiconductor Eng Image sensor package and method for manufacturing the same
US20060109366A1 (en) * 2004-05-04 2006-05-25 Tessera, Inc. Compact lens turret assembly

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