JP2009502682A5 - - Google Patents

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Publication number
JP2009502682A5
JP2009502682A5 JP2008524939A JP2008524939A JP2009502682A5 JP 2009502682 A5 JP2009502682 A5 JP 2009502682A5 JP 2008524939 A JP2008524939 A JP 2008524939A JP 2008524939 A JP2008524939 A JP 2008524939A JP 2009502682 A5 JP2009502682 A5 JP 2009502682A5
Authority
JP
Japan
Prior art keywords
article
package
adhesive
active surface
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008524939A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009502682A (ja
JP4989647B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/SE2006/050262 external-priority patent/WO2007015673A1/en
Publication of JP2009502682A publication Critical patent/JP2009502682A/ja
Publication of JP2009502682A5 publication Critical patent/JP2009502682A5/ja
Application granted granted Critical
Publication of JP4989647B2 publication Critical patent/JP4989647B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008524939A 2005-08-01 2006-07-18 複数のパッケージと、それらに対して構成要素を一緒に保持する方法 Expired - Fee Related JP4989647B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US70430705P 2005-08-01 2005-08-01
US60/704,307 2005-08-01
US76585406P 2006-02-07 2006-02-07
US60/765,854 2006-02-07
PCT/SE2006/050262 WO2007015673A1 (en) 2005-08-01 2006-07-18 Method of holding together packages and components thereto

Publications (3)

Publication Number Publication Date
JP2009502682A JP2009502682A (ja) 2009-01-29
JP2009502682A5 true JP2009502682A5 (enExample) 2009-09-03
JP4989647B2 JP4989647B2 (ja) 2012-08-01

Family

ID=37708916

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008524938A Pending JP2009502681A (ja) 2005-08-01 2006-07-18 パッケージおよびパッケージを密閉し開放する方法
JP2008524941A Pending JP2009502584A (ja) 2005-08-01 2006-07-18 積層構造
JP2008524939A Expired - Fee Related JP4989647B2 (ja) 2005-08-01 2006-07-18 複数のパッケージと、それらに対して構成要素を一緒に保持する方法

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2008524938A Pending JP2009502681A (ja) 2005-08-01 2006-07-18 パッケージおよびパッケージを密閉し開放する方法
JP2008524941A Pending JP2009502584A (ja) 2005-08-01 2006-07-18 積層構造

Country Status (13)

Country Link
US (3) US7736710B2 (enExample)
EP (3) EP1912869B1 (enExample)
JP (3) JP2009502681A (enExample)
KR (2) KR20080034129A (enExample)
AR (3) AR056441A1 (enExample)
AT (2) ATE482152T1 (enExample)
AU (2) AU2006276350A1 (enExample)
CA (2) CA2617491A1 (enExample)
DE (2) DE602006017080D1 (enExample)
NO (2) NO20080197L (enExample)
RU (1) RU2008107980A (enExample)
TW (3) TW200718607A (enExample)
WO (3) WO2007015675A1 (enExample)

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CN110588125B (zh) * 2019-10-15 2024-07-30 深圳市集银科技有限公司 一种玻璃表面保护膜的撕膜、切割和贴附装置
CN113329579A (zh) * 2021-06-29 2021-08-31 维沃移动通信有限公司 电子设备
JP7717650B2 (ja) * 2022-03-18 2025-08-04 株式会社東芝 物体の接着・剥離方法、及び物体接着剥離装置
CN117002832A (zh) * 2023-09-19 2023-11-07 深圳市兴图科技有限责任公司 一种胶带撕膜机构及胶带撕膜方法

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