JP2009500802A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009500802A5 JP2009500802A5 JP2008520015A JP2008520015A JP2009500802A5 JP 2009500802 A5 JP2009500802 A5 JP 2009500802A5 JP 2008520015 A JP2008520015 A JP 2008520015A JP 2008520015 A JP2008520015 A JP 2008520015A JP 2009500802 A5 JP2009500802 A5 JP 2009500802A5
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- metal nanoparticles
- conductive composite
- group
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 77
- 239000002082 metal nanoparticle Substances 0.000 claims description 35
- 239000010931 gold Substances 0.000 claims description 34
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 239000000725 suspension Substances 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 15
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 238000005191 phase separation Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 239000002798 polar solvent Substances 0.000 claims 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000003491 array Methods 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 230000005669 field effect Effects 0.000 claims 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N isonitrile group Chemical group N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- 125000002560 nitrile group Chemical group 0.000 claims 1
- 230000037361 pathway Effects 0.000 claims 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 239000002105 nanoparticle Substances 0.000 description 12
- -1 gold ions Chemical class 0.000 description 10
- 230000009466 transformation Effects 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000010791 quenching Methods 0.000 description 8
- 230000000171 quenching effect Effects 0.000 description 8
- 239000012071 phase Substances 0.000 description 6
- 239000012074 organic phase Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001356 alkyl thiols Chemical class 0.000 description 3
- 239000008346 aqueous phase Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000001803 electron scattering Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- GWOLZNVIRIHJHB-UHFFFAOYSA-N 11-mercaptoundecanoic acid Chemical compound OC(=O)CCCCCCCCCCS GWOLZNVIRIHJHB-UHFFFAOYSA-N 0.000 description 2
- ULGGZAVAARQJCS-UHFFFAOYSA-N 11-sulfanylundecan-1-ol Chemical compound OCCCCCCCCCCCS ULGGZAVAARQJCS-UHFFFAOYSA-N 0.000 description 2
- INOAASCWQMFJQA-UHFFFAOYSA-N 16-sulfanylhexadecanoic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCS INOAASCWQMFJQA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000000089 atomic force micrograph Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- 241000209035 Ilex Species 0.000 description 1
- 229920000557 Nafion® Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 241000220010 Rhode Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000255 optical extinction spectrum Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000447 polyanionic polymer Polymers 0.000 description 1
- 229920000867 polyelectrolyte Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- BEOOHQFXGBMRKU-UHFFFAOYSA-N sodium cyanoborohydride Chemical compound [Na+].[B-]C#N BEOOHQFXGBMRKU-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 1
- 229940071240 tetrachloroaurate Drugs 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- QBVXKDJEZKEASM-UHFFFAOYSA-M tetraoctylammonium bromide Chemical compound [Br-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC QBVXKDJEZKEASM-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- SCHZCUMIENIQMY-UHFFFAOYSA-N tris(trimethylsilyl)silicon Chemical compound C[Si](C)(C)[Si]([Si](C)(C)C)[Si](C)(C)C SCHZCUMIENIQMY-UHFFFAOYSA-N 0.000 description 1
Images
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69592905P | 2005-07-01 | 2005-07-01 | |
| US60/695,929 | 2005-07-01 | ||
| PCT/IB2006/001829 WO2007004033A2 (en) | 2005-07-01 | 2006-07-03 | An electrically conductive composite |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014243279A Division JP5908962B2 (ja) | 2005-07-01 | 2014-12-01 | 導電性複合材料の調製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009500802A JP2009500802A (ja) | 2009-01-08 |
| JP2009500802A5 true JP2009500802A5 (https=) | 2013-05-16 |
| JP5753338B2 JP5753338B2 (ja) | 2015-07-22 |
Family
ID=37604839
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008520015A Expired - Fee Related JP5753338B2 (ja) | 2005-07-01 | 2006-07-03 | 導電性複合材料 |
| JP2014243279A Expired - Fee Related JP5908962B2 (ja) | 2005-07-01 | 2014-12-01 | 導電性複合材料の調製方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014243279A Expired - Fee Related JP5908962B2 (ja) | 2005-07-01 | 2014-12-01 | 導電性複合材料の調製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8421231B2 (https=) |
| EP (1) | EP1899986B1 (https=) |
| JP (2) | JP5753338B2 (https=) |
| KR (1) | KR101423204B1 (https=) |
| CN (1) | CN101238528B (https=) |
| WO (1) | WO2007004033A2 (https=) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008009779A1 (en) | 2006-07-21 | 2008-01-24 | Valtion Teknillinen Tutkimuskeskus | Method for manufacturing conductors and semiconductors |
| US7611985B2 (en) * | 2006-09-20 | 2009-11-03 | Intel Corporation | Formation of holes in substrates using dewetting coatings |
| TWI345835B (en) * | 2007-01-02 | 2011-07-21 | Chunghwa Picture Tubes Ltd | Organic thin film transistor and method for manufacturing thereof |
| US10231344B2 (en) | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
| FI122014B (fi) | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi |
| FI122011B (fi) | 2007-06-08 | 2011-07-15 | Teknologian Tutkimuskeskus Vtt | Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste |
| FI122644B (fi) | 2007-06-08 | 2012-04-30 | Teknologian Tutkimuskeskus Vtt | Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen |
| US7768366B1 (en) * | 2007-10-29 | 2010-08-03 | The United States Of America As Represented By The Secretary Of The Air Force | Nanoparticles and corona enhanced MEMS switch apparatus |
| US9730333B2 (en) | 2008-05-15 | 2017-08-08 | Applied Nanotech Holdings, Inc. | Photo-curing process for metallic inks |
| FR2934705B1 (fr) * | 2008-07-29 | 2015-10-02 | Univ Toulouse 3 Paul Sabatier | Materiau solide composite electriquement conducteur et procede d'obtention d'un tel materiau |
| CN102119064B (zh) * | 2008-08-11 | 2015-04-01 | 地方独立行政法人大阪市立工业研究所 | 复合纳米粒子及其制造方法 |
| JP4477083B2 (ja) * | 2008-09-24 | 2010-06-09 | 株式会社東芝 | 金属ナノ粒子無機複合体の製造方法、金属ナノ粒子無機複合体およびプラズモン導波路 |
| US20130075672A1 (en) * | 2008-09-29 | 2013-03-28 | Simona Magdalena Rucareanu | Kit for preparing a conductive pattern |
| JP5243181B2 (ja) * | 2008-10-20 | 2013-07-24 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性高分子複合体及び導電性高分子材料を用いた熱電素子 |
| JP5453789B2 (ja) * | 2008-12-04 | 2014-03-26 | 東洋紡株式会社 | 金属微粒子分散体、金属薄膜の製造方法および金属薄膜 |
| US8647979B2 (en) | 2009-03-27 | 2014-02-11 | Applied Nanotech Holdings, Inc. | Buffer layer to enhance photo and/or laser sintering |
| US20120181173A1 (en) * | 2009-07-30 | 2012-07-19 | Fundacion Cidetec | Electrochemical sensor for the detection of analytes in liquid media |
| FI124372B (fi) | 2009-11-13 | 2014-07-31 | Teknologian Tutkimuskeskus Vtt | Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet |
| US8920681B2 (en) * | 2009-12-30 | 2014-12-30 | Korea University Research And Business Foundation | Electrically conductive polymers with enhanced conductivity |
| US8558117B2 (en) * | 2010-02-13 | 2013-10-15 | Aculon, Inc. | Electroconductive inks made with metallic nanoparticles |
| CN102071453B (zh) * | 2010-12-14 | 2012-05-02 | 吉林大学 | 室温下一锅法制备高质量水相半导体纳米晶的方法 |
| JP5756899B2 (ja) * | 2010-12-28 | 2015-07-29 | 株式会社ハッピージャパン | カルコパイライト構造を有する化合物の製造方法 |
| US8986819B2 (en) * | 2011-06-06 | 2015-03-24 | Xerox Corporation | Palladium precursor composition |
| US20140001420A1 (en) * | 2011-09-30 | 2014-01-02 | Lawrence T. Drzal | Method of preparing metal nanoparticles |
| CN103192086B (zh) * | 2012-01-10 | 2015-05-13 | 中国科学院宁波材料技术与工程研究所 | 一种可控的双金属合金纳米颗粒的制备方法 |
| TW201419315A (zh) | 2012-07-09 | 2014-05-16 | Applied Nanotech Holdings Inc | 微米尺寸銅粒子的光燒結法 |
| CN104176701B (zh) * | 2014-08-18 | 2016-08-24 | 中国科学院上海应用物理研究所 | 有机配体包裹的金纳米颗粒薄膜及其场致电子发射装置 |
| US9947431B2 (en) * | 2015-04-21 | 2018-04-17 | The Florida International University Board Of Trustees | Anisotropic films templated using ultrasonic focusing |
| CN104861189B (zh) | 2015-05-25 | 2018-04-13 | 华南理工大学 | 一种原位合成聚3,4‑乙撑二氧噻吩/纳米金属银透明导电涂层的方法 |
| CN105225721B (zh) * | 2015-08-26 | 2017-04-19 | 贵州理工学院 | 一种高导电复合金属氧化粉体材料及其制备方法 |
| FR3042305B1 (fr) * | 2015-10-13 | 2019-07-26 | Arkema France | Procede de fabrication d'un materiau composite conducteur et materiau composite ainsi obtenu |
| US20190100663A1 (en) * | 2017-10-03 | 2019-04-04 | Shin-Etsu Chemical Co., Ltd. | Anisotropic conductive film and method for manufacturing anisotropic conductive film |
| KR102578825B1 (ko) | 2017-10-31 | 2023-09-15 | 삼성전자주식회사 | 전자소자용 전도성 복합구조체 , 그 제조방법, 이를 포함하는 전자소자용 전극 및 전자소자 |
| KR102432090B1 (ko) * | 2018-06-08 | 2022-08-12 | 한국과학기술연구원 | 비정질 나노구조체를 이용하여 제조된 초소형 나노구조체 및 이의 제조방법 |
| EP3804886A4 (en) * | 2018-06-08 | 2022-02-09 | Korea Institute of Science and Technology | MICRO-NANOSTRUCTURE MANUFACTURED USING AMORPHIC NANOSTRUCTURE AND METHOD OF MANUFACTURE THEREOF |
| KR102102185B1 (ko) * | 2018-10-05 | 2020-04-21 | 한국과학기술연구원 | 고 신축성을 가진 전도성 고분자 복합체 |
| KR102102186B1 (ko) * | 2018-10-05 | 2020-04-21 | 한국과학기술연구원 | 고 신축성을 가진 전도성 고분자 복합체 및 그 제조방법 |
| KR102608512B1 (ko) * | 2019-02-19 | 2023-11-30 | 엘에스전선 주식회사 | 초전도 케이블 및 초전도 케이블의 제조방법 |
| WO2020230162A1 (en) * | 2019-05-12 | 2020-11-19 | Indian Institute Of Science | Low resistance nanostructured electrical conductor |
| JP6781437B1 (ja) * | 2019-07-19 | 2020-11-04 | 株式会社Gceインスティチュート | 発電素子、及び発電素子の製造方法 |
| US20210107810A1 (en) * | 2019-10-14 | 2021-04-15 | Quinton Wyatt | Electrically conductive polymer thin-films |
| CN111687428B (zh) * | 2020-05-13 | 2021-11-19 | 华南理工大学 | 两亲性聚合物介导金纳米粒子可控组装体及其制备与应用 |
| JP7626138B2 (ja) * | 2020-08-03 | 2025-02-04 | 株式会社村田製作所 | 導電性複合材料 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8909011D0 (en) | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
| JPH05105828A (ja) * | 1991-10-16 | 1993-04-27 | Matsushita Electric Works Ltd | 導電ペースト |
| JPH05347106A (ja) * | 1992-06-16 | 1993-12-27 | Matsushita Electric Ind Co Ltd | 導電性塗料 |
| US5523555A (en) * | 1994-09-14 | 1996-06-04 | Cambridge Display Technology | Photodetector device having a semiconductive conjugated polymer |
| GB9423692D0 (en) | 1994-11-23 | 1995-01-11 | Philips Electronics Uk Ltd | A photoresponsive device |
| EP0914244A1 (en) * | 1995-12-28 | 1999-05-12 | James R. Heath | Organically-functionalized monodisperse nanocrystals of metals |
| US5973050A (en) * | 1996-07-01 | 1999-10-26 | Integrated Cryoelectronic Inc. | Composite thermoelectric material |
| US6103868A (en) * | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
| US6251303B1 (en) * | 1998-09-18 | 2001-06-26 | Massachusetts Institute Of Technology | Water-soluble fluorescent nanocrystals |
| CN1271894C (zh) * | 1999-11-01 | 2006-08-23 | Jsr株式会社 | 导电层形成用水性分散液、导电层、电子器件、电路板及其制造方法,以及多层布线板及其制造方法 |
| GB0006050D0 (en) * | 2000-03-14 | 2000-05-03 | Johnson Matthey Plc | Liquid gold compositions |
| AU2001249459A1 (en) * | 2000-03-24 | 2001-10-08 | The State Of Oregon, Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon | Scaffold-organized clusters and electronic devices made using such clusters |
| EA200201020A1 (ru) * | 2000-03-27 | 2003-06-26 | Майкл Ф. Рей | Способ получения цианидной соли |
| JP2001325831A (ja) * | 2000-05-12 | 2001-11-22 | Bando Chem Ind Ltd | 金属コロイド液、導電性インク、導電性被膜及び導電性被膜形成用基底塗膜 |
| WO2002018080A1 (en) * | 2000-08-03 | 2002-03-07 | Upepo & Maji Inc. | Metal colloidal solution composition and conductor or ink for forming semiconductor pattern comprising it and method for forming conductor or semiconductor pattern |
| US6773926B1 (en) * | 2000-09-25 | 2004-08-10 | California Institute Of Technology | Nanoparticle-based sensors for detecting analytes in fluids |
| US6649138B2 (en) | 2000-10-13 | 2003-11-18 | Quantum Dot Corporation | Surface-modified semiconductive and metallic nanoparticles having enhanced dispersibility in aqueous media |
| WO2002035554A1 (en) * | 2000-10-25 | 2002-05-02 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
| CN1151512C (zh) * | 2000-11-23 | 2004-05-26 | 大连三科科技发展有限公司 | 含锑纳米导电微粒子材料及其制备方法 |
| KR100379250B1 (ko) * | 2000-12-04 | 2003-04-08 | 한국과학기술연구원 | 나노 단위 크기의 금속 입자가 함유된 고분자 복합 소재및 그 제조 방법 |
| EP1223615A1 (en) * | 2001-01-10 | 2002-07-17 | Eidgenössische Technische Hochschule Zürich | A method for producing a structure using nanoparticles |
| JP3774638B2 (ja) * | 2001-04-24 | 2006-05-17 | ハリマ化成株式会社 | インクジェット印刷法を利用する回路パターンの形成方法 |
| EP1468054A1 (en) | 2001-11-01 | 2004-10-20 | Yissum Research Development Company of the Hebrew University of Jerusalem | Ink-jet inks containing metal nanoparticles |
| GB0126236D0 (en) * | 2001-11-01 | 2002-01-02 | Univ East Anglia | Photosensitiser functionalised nanoparticles |
| US7413770B2 (en) * | 2002-08-01 | 2008-08-19 | E.I. Du Pont De Nemours And Company | Ethylene glycol monolayer protected nanoparticles |
| JP4464277B2 (ja) * | 2002-09-24 | 2010-05-19 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 導電性有機ポリマー/ナノ粒子複合材料およびその使用方法 |
| KR100965373B1 (ko) | 2003-06-10 | 2010-06-22 | 삼성전자주식회사 | 감광성 금속 나노입자 및 이를 이용한 도전성 패턴형성방법 |
| KR100740634B1 (ko) | 2003-09-12 | 2007-07-18 | 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 | 미세한 액적(液滴)의 형상으로 분사해, 적층 도포 가능한금속 나노 입자 분산액 |
-
2006
- 2006-07-03 US US11/988,183 patent/US8421231B2/en not_active Expired - Fee Related
- 2006-07-03 JP JP2008520015A patent/JP5753338B2/ja not_active Expired - Fee Related
- 2006-07-03 WO PCT/IB2006/001829 patent/WO2007004033A2/en not_active Ceased
- 2006-07-03 EP EP06779815.7A patent/EP1899986B1/en not_active Not-in-force
- 2006-07-03 CN CN2006800269399A patent/CN101238528B/zh not_active Expired - Fee Related
- 2006-07-03 KR KR1020087001943A patent/KR101423204B1/ko not_active Expired - Fee Related
-
2014
- 2014-12-01 JP JP2014243279A patent/JP5908962B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009500802A5 (https=) | ||
| JP5908962B2 (ja) | 導電性複合材料の調製方法 | |
| US11968787B2 (en) | Metal nanowire networks and transparent conductive material | |
| US12407349B2 (en) | Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks | |
| Wu et al. | High‐performance organic thin‐film transistors with solution‐printed gold contacts | |
| Wu et al. | Studies of gold nanoparticles as precursors to printed conductive features for thin-film transistors | |
| US20090050856A1 (en) | Voltage switchable dielectric material incorporating modified high aspect ratio particles | |
| US8026185B2 (en) | Method for manufacturing electronic circuit component | |
| EP3611231A1 (en) | Metal nanostructured networks and transparent conductive material | |
| CN106574135A (zh) | 分子油墨 | |
| JP2008166710A (ja) | 有機メモリ素子及びその製造方法 | |
| JP2007534780A (ja) | ポリアニリンおよびカーボンナノチューブを含有する絶縁ポリマー | |
| US20180033516A1 (en) | Method of interconnecting nanowires, nanowire network and transparent condutive electrode | |
| DiGregorio et al. | All-atmospheric fabrication of Ag–Cu core–shell nanowire transparent electrodes with Haacke figure of merit> 600× 10–3 Ω− 1 | |
| US20120315495A1 (en) | Conductive inks obtained by combining aqcs and metal nanoparticles | |
| Wang et al. | Long-term electrically stable silver nanowire composite transparent electrode under high current density | |
| KR101136878B1 (ko) | 기능성 블록공중합체-나노입자 복합체 및 이를 이용한 유기전자소자 | |
| Jafri et al. | Current-voltage characteristics of layer-by-layer self-assembled colloidal thin films | |
| JPWO2020080109A1 (ja) | 電界効果型トランジスタの製造方法および無線通信装置の製造方法 | |
| TW201937765A (zh) | 導電性膜及其製造方法 | |
| WO2023245148A2 (en) | Functional nanoinks for fully printed passive and active resistive switching devices | |
| Wu et al. | Organic Thin Film Transistors with Contacts Printed from Metal Nanoparticles | |
| Wu et al. | Development of Silver Nanoparticle Ink for Printed Electronics | |
| JP2012182364A (ja) | 有機電子素子用電極、有機トランジスタ素子 | |
| Ko et al. | Ultra high resolution, low temperature, direct metal patterning by selective laser processing of solution deposited metal nanoparticles |