JP2009291857A5 - - Google Patents

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Publication number
JP2009291857A5
JP2009291857A5 JP2008145746A JP2008145746A JP2009291857A5 JP 2009291857 A5 JP2009291857 A5 JP 2009291857A5 JP 2008145746 A JP2008145746 A JP 2008145746A JP 2008145746 A JP2008145746 A JP 2008145746A JP 2009291857 A5 JP2009291857 A5 JP 2009291857A5
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JP
Japan
Prior art keywords
end point
polishing end
time
point
predetermined
Prior art date
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Application number
JP2008145746A
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English (en)
Japanese (ja)
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JP2009291857A (ja
JP5254668B2 (ja
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Application filed filed Critical
Priority to JP2008145746A priority Critical patent/JP5254668B2/ja
Priority claimed from JP2008145746A external-priority patent/JP5254668B2/ja
Priority to US12/476,427 priority patent/US8157616B2/en
Publication of JP2009291857A publication Critical patent/JP2009291857A/ja
Publication of JP2009291857A5 publication Critical patent/JP2009291857A5/ja
Application granted granted Critical
Publication of JP5254668B2 publication Critical patent/JP5254668B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008145746A 2008-06-03 2008-06-03 研磨終点検出方法 Active JP5254668B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008145746A JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法
US12/476,427 US8157616B2 (en) 2008-06-03 2009-06-02 Polishing end point detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008145746A JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法

Publications (3)

Publication Number Publication Date
JP2009291857A JP2009291857A (ja) 2009-12-17
JP2009291857A5 true JP2009291857A5 (enExample) 2012-05-17
JP5254668B2 JP5254668B2 (ja) 2013-08-07

Family

ID=41380418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008145746A Active JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法

Country Status (2)

Country Link
US (1) US8157616B2 (enExample)
JP (1) JP5254668B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101381341B1 (ko) 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
KR101892914B1 (ko) * 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
KR101436557B1 (ko) * 2013-05-02 2014-09-01 주식회사 케이씨텍 산화물층을 갖는 웨이퍼의 연마 엔드 포인트 검출 정확성이 향상된 화학 기계적 연마 방법 및 이를 이용한 화학 기계적 연마 시스템
TWI784719B (zh) 2016-08-26 2022-11-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
US12288724B2 (en) 2021-03-04 2025-04-29 Applied Materials, Inc. Region classification of film non-uniformity based on processing of substrate images

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111634A (en) 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
JP2002124496A (ja) * 2000-10-18 2002-04-26 Hitachi Ltd 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
US7406394B2 (en) 2005-08-22 2008-07-29 Applied Materials, Inc. Spectra based endpointing for chemical mechanical polishing
KR101381341B1 (ko) * 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치

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