JP5254668B2 - 研磨終点検出方法 - Google Patents

研磨終点検出方法 Download PDF

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Publication number
JP5254668B2
JP5254668B2 JP2008145746A JP2008145746A JP5254668B2 JP 5254668 B2 JP5254668 B2 JP 5254668B2 JP 2008145746 A JP2008145746 A JP 2008145746A JP 2008145746 A JP2008145746 A JP 2008145746A JP 5254668 B2 JP5254668 B2 JP 5254668B2
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JP
Japan
Prior art keywords
polishing
time
end point
characteristic value
point
Prior art date
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JP2008145746A
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English (en)
Japanese (ja)
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JP2009291857A (ja
JP2009291857A5 (enExample
Inventor
展 清水
真朗 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2008145746A priority Critical patent/JP5254668B2/ja
Priority to US12/476,427 priority patent/US8157616B2/en
Publication of JP2009291857A publication Critical patent/JP2009291857A/ja
Publication of JP2009291857A5 publication Critical patent/JP2009291857A5/ja
Application granted granted Critical
Publication of JP5254668B2 publication Critical patent/JP5254668B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008145746A 2008-06-03 2008-06-03 研磨終点検出方法 Active JP5254668B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008145746A JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法
US12/476,427 US8157616B2 (en) 2008-06-03 2009-06-02 Polishing end point detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008145746A JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法

Publications (3)

Publication Number Publication Date
JP2009291857A JP2009291857A (ja) 2009-12-17
JP2009291857A5 JP2009291857A5 (enExample) 2012-05-17
JP5254668B2 true JP5254668B2 (ja) 2013-08-07

Family

ID=41380418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008145746A Active JP5254668B2 (ja) 2008-06-03 2008-06-03 研磨終点検出方法

Country Status (2)

Country Link
US (1) US8157616B2 (enExample)
JP (1) JP5254668B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101381341B1 (ko) 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
KR101892914B1 (ko) * 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
KR101436557B1 (ko) * 2013-05-02 2014-09-01 주식회사 케이씨텍 산화물층을 갖는 웨이퍼의 연마 엔드 포인트 검출 정확성이 향상된 화학 기계적 연마 방법 및 이를 이용한 화학 기계적 연마 시스템
TWI784719B (zh) 2016-08-26 2022-11-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
US12288724B2 (en) 2021-03-04 2025-04-29 Applied Materials, Inc. Region classification of film non-uniformity based on processing of substrate images

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111634A (en) 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
JP2002124496A (ja) * 2000-10-18 2002-04-26 Hitachi Ltd 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
JP4542324B2 (ja) * 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
US7406394B2 (en) 2005-08-22 2008-07-29 Applied Materials, Inc. Spectra based endpointing for chemical mechanical polishing
KR101381341B1 (ko) * 2006-10-06 2014-04-04 가부시끼가이샤 도시바 가공 종점 검지방법, 연마방법 및 연마장치

Also Published As

Publication number Publication date
US8157616B2 (en) 2012-04-17
JP2009291857A (ja) 2009-12-17
US20090298387A1 (en) 2009-12-03

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