JP2009272502A - Film-like adhesive fracturing apparatus and fracturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film-like adhesive fracturing apparatus and method that prevents the debris generated by the fracture of protruding portion of a film-like adhesive from sticking to the surface of a wafer. <P>SOLUTION: An fracturing apparatus 1 includes a frame holding means 2 to hold an annular frame 12, an extension means 3 to extend a protective tape 13, a forward and backward movement means 4 which relatively positions the extension means 3 and the holding plane of the frame holding means 2, and a cooling means 6 to cool a film-like adhesive 10, and fractures a film-like adhesive 10 attached to the backside of a wafer 11 while the adhesive is applied to the protective tape 13 attached to the opening 12a of the annular frame 12, wherein a press-stopping member 5 is provided which press-stops the portion protruding from the wafer 11 of the film-like adhesive 10 while the protective tape 13 is extended. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a breaking device and a breaking method for breaking a film adhesive used for mounting or laminating semiconductor chips.

  In the manufacturing process of a semiconductor device, a large number of circuits such as IC (integrated circuit) or LSI (large-scale integration) are formed on the surface of a substantially disc-shaped semiconductor wafer. Each semiconductor chip (device) is manufactured by dicing each region in which a circuit is formed in a lattice shape along a predetermined street (cutting line).

  The divided semiconductor chip is made of a thermosetting resin such as an epoxy resin on the back surface thereof, and a film adhesive having a thickness of, for example, 20 to 100 μm is attached thereto, and the die bonding frame is interposed through the film adhesive. Etc.

  As a method for attaching the film adhesive to the back surface of the semiconductor chip, generally, a method is adopted in which the film adhesive is applied to the back surface of the semiconductor wafer before division and the film adhesive is diced together with the semiconductor wafer. (For example, refer to Patent Document 1) Conventionally, a film-like adhesive is not completely cut, but is cut into a state where a dicing tape that holds a semiconductor wafer is expanded to expand the film. A method of breaking the adhesive is also proposed (see Patent Document 2).

  On the other hand, in recent years, as a method of dividing a plate-like workpiece such as a semiconductor wafer, a laser that irradiates a pulse laser beam having transparency to the workpiece with a converging point inside the region to be divided. A processing method has been tried (see, for example, Patent Document 3). As described in Patent Document 1, for example, a splitting method using a laser processing method focuses a pulse laser beam in an infrared region having transparency to a workpiece on the inside of the workpiece. A point is put together and it irradiates from one surface side, and along the division | segmentation scheduled line, an altered layer is continuously formed in the inside of a workpiece. And an external force is applied along the division | segmentation planned line where intensity | strength fell by forming a deteriorated layer, and a workpiece is divided | segmented.

  When dicing a semiconductor wafer by the laser processing method described above, a film-like adhesive is formed together with the semiconductor wafer by forming a modified region along the planned dividing line inside the film-like adhesive and extending the dicing tape. A method of breaking is also proposed (see Patent Document 4). In the method described in Patent Document 4, after a deteriorated layer is formed in a semiconductor wafer, a laser beam is irradiated with a focusing point inside the film adhesive, and heat curing or light is applied along the division line. A modified region is formed by curing.

  On the other hand, since the film-like adhesive is formed of a soft paste-like substance, when the dicing tape is expanded, the film-like adhesive also extends, and it is difficult to reliably break at a predetermined position. Therefore, when expanding the dicing tape, a rupturing method has been proposed in which the film adhesive is cooled by cooling means and its stretchability is reduced, so that the film adhesive can be reliably broken ( (See Patent Document 5).

JP 2007-109808 A JP 2007-294651 A Japanese Patent No. 3408805 JP 2006-80142 A JP 2007-27250 A

  However, the conventional techniques described above have the following problems. That is, when the film adhesive is cut together with the semiconductor wafer by the cutting blade as in the method described in Patent Document 1, burrs are generated on the back surface of the film adhesive, causing disconnection during wire bonding. There is. This problem can be solved by providing an uncut portion without completely cutting the film-like adhesive as in the method described in Patent Document 2, but even in that case, a hard semiconductor wafer and In order to cut the soft film adhesive at the same time, there is a problem that the cutting speed has to be slowed and the production efficiency is lowered.

  Further, in the methods described in Patent Documents 2 and 4, the film adhesive is broken by expanding the dicing tape, but in this method, the film adhesive is also stretched together with the dicing tape, There is a problem that it cannot be reliably broken at a predetermined position. On the other hand, if the film adhesive is broken while being cooled as in the method described in Patent Document 5, the above-mentioned problems do not occur. However, even in this method, when the dicing tape is expanded, the film adhesive There is a problem in that the protruding part of the material is broken and the fragments are scattered.

  Currently, film adhesives such as a die bonding film and a die attach film are laminated on a dicing tape that holds a wafer when dicing, and are sold as an integral film. When a film adhesive is applied to the back surface of the semiconductor wafer, such an integrated film is attached to an annular frame, and the film adhesive and the back surface of the semiconductor wafer are bonded together in this state. It has been. Since such a pasting operation is normally performed automatically using a pasting device, the outer diameter of the film adhesive is set to be several mm larger than the outer diameter of the semiconductor wafer in consideration of misalignment and the like. Has been.

  For this reason, in the state which stuck the film adhesive on the back surface of the semiconductor wafer, a part of film adhesive protrudes outside the semiconductor wafer. If the film-like adhesive is cooled when it is cooled, the protruding portion also becomes less elastic and hard, so that when the dicing tape is expanded, breakage occurs, and the fragments adhere to the wafer surface. Or splash around. In particular, if a piece of film adhesive adheres to a semiconductor chip, it causes a chip failure, which is not preferable.

  Therefore, the present invention has as its main object to provide a film adhesive breakage apparatus and breakage method capable of preventing fragments produced by breaking the protruding portion of the film adhesive from adhering to the wafer surface. .

  The film adhesive breaking apparatus according to the present invention is a film adhesive having a diameter larger than that of the wafer attached to the back surface of the wafer in which a plurality of devices are formed in a matrix shape. A breaker that breaks along a street partitioning the device in a state of being attached onto a protective tape having elasticity attached thereto, and a frame holding means having a holding surface for holding the annular frame; An expansion means for expanding the protective tape by acting on a wafer sticking region of the protective tape attached to the annular frame held by the holding surface, and the expansion means and the holding surface are separated from each other. An advancing / retreating means that is relatively positioned at a standby position and an extended position where the protective tape is expanded, and at least the fill when the protective tape is expanded. It has a pressing member for 押止 the part that protrudes from the wafer of Jo adhesive, and cooling means for cooling at least the film-like adhesive, a. In the present invention, the wafer to which the film-like adhesive to be broken is attached is divided into individual chips by dicing or grinding after dicing, or by formation of a deteriorated layer on the street by a laser. This includes wafers in various states, such as those given a trigger for division.

  In the present invention, when the protective tape is expanded and the film adhesive is broken, the protruding portion of the film adhesive protruding from the wafer is held by the pressing member, so that the protruding portion is broken. However, the debris does not scatter toward the wafer surface.

  The holding member in this breaking device may have irregularities formed on the surface in contact with the film adhesive.

  In this breaking device, the wafer can be broken along the street together with the film adhesive.

  In the method for breaking a film adhesive according to the present invention, a film-like adhesive having a diameter larger than that of the wafer attached to the back surface of the wafer on which a plurality of devices are formed in a matrix is formed in the opening of the annular frame. A method of breaking along a street partitioning the device in a state where the device is attached to a protective tape having elasticity, and a step of holding the annular frame on a holding surface of a frame holding means; A step of expanding the protective tape mounted on the annular frame while cooling, and at least a part of the film adhesive protruding from the wafer when the protective tape is expanded. It is characterized by holding down.

  In this breaking method, the wafer may be broken along the street together with the film adhesive.

  According to the present invention, when the film adhesive is ruptured, the protruding portion of the film adhesive protruding from the wafer is retained, so even if the protruding portion breaks, the fragments adhere to the wafer surface. Can be prevented.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing a configuration of a breaking device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an appearance thereof. FIG. 3 is a perspective view showing a state of the film adhesive to be broken.

  As shown in FIGS. 1 and 2, the breaking device 1 of this embodiment applies a film adhesive 10 attached to the back surface of a wafer 11 to a protective tape 13 attached to an opening 12 a of an annular frame 12. It breaks when worn. The breaking device 1 has at least a frame holding means 2 for holding the annular frame 12, an expansion means 3 for expanding the protective tape 13, and the expansion means 3 and the holding surface of the frame holding means 2 relatively. A positioning member 5 is provided, which includes an advancing / retreating means 4 for positioning and a cooling means 6 for cooling the film-like adhesive 10, and a pressing member 5 for holding a portion of the film-like adhesive 10 protruding from the wafer 11. It has been.

  The film adhesive 10 to be broken by the breaking device 1 is used when a semiconductor chip is mounted or stacked, and examples thereof include a die bonding film and a die attach film. As shown in FIG. 3, these film adhesives 10 are usually designed to have an outer diameter larger than that of the wafer 11, and a part of the adhesive protrudes from the wafer 11. On the other hand, a plurality of devices 14 are formed in a matrix on the surface of the wafer 11, and the film adhesive 10 is broken along a grid-like street 15 that partitions these devices 14.

  Further, the frame holding means 2 in the breaking device 1 of the present embodiment includes plate-like holding members 2a and 2b made of a metal material such as SUS, for example. The pair of holding members 2a and 2b are formed with an opening having substantially the same diameter as the opening 12a of the annular frame 12 at the center thereof. The annular frame 12 is arranged between the holding member 2a and the holding member 2b so that the opening 12a and the openings of the holding members 2a and 2b are aligned, and the annular frame 12 is sandwiched between the holding members 2a and 2b. To be retained. In this case, the surfaces around the openings of the holding members 2 a and 2 b function as the holding surface of the annular frame 12.

  On the other hand, the expansion means 3 acts on the wafer affixing region of the protective tape 13 attached to the annular frame 12 held by the frame holding means 2 to expand the protective tape 13, It has a surface. The pressing surface has a smaller diameter than the openings of the holding members 2a and 2b and can be inserted through these openings. Further, when the expansion unit 3 is in a standby state where it does not act on the protective tape 13, for example, a position that does not contact the protective tape 13 such as a position below the holding surface of the holding member 2a (hereinafter referred to as a standby position). ). Furthermore, the expansion means 3 may be formed with an annular groove on the outer peripheral portion of the pressing surface, and a plurality of expansion auxiliary rollers may be rotatably disposed along the annular groove. When such an extension auxiliary roller is provided, the frictional resistance generated when the protective tape 13 is expanded can be reduced, and the tensile force can be applied uniformly.

  The advance / retreat means 4 positions the expansion means 3 from the standby position to the expansion position where the protective tape 13 is expanded. For example, a servo motor can be used. In the breaking device 1 shown in FIG. 1, the advancing / retracting means 4 is connected to the lower part of the expanding means 3, and the expanding means 3 is moved from a standby position below the holding surface of the holding member 2a to above the holding surface. It is designed to move to the extended position. The breaking device according to the present invention is not limited to the configuration for moving the expansion means 3 shown in FIG. 1. For example, the advancing / retreating means 4 composed of an air piston mechanism or the like is connected to the frame holding means 2 to expand the expansion means. The position 3 may be fixed, and the frame holding means 2 may be moved so that the positional relationship between the holding surface of the holding member 2a and the expansion means 3 becomes the standby position or the expansion position.

  Furthermore, in the breaking device 1 of the present embodiment, when the expansion means 3 is positioned at the expansion position, that is, when the protective sheet 13 is expanded, at least a portion of the film adhesive 10 that protrudes from the wafer 11. A holding member 5 is provided to hold the. The pressing member 5 only needs to be provided at a position where the protruding portion of the film adhesive 10 can be pressed. For example, the pressing member 5 can be installed along the opening of the holding member 2b as shown in FIG. On the other hand, in an apparatus having no holding member 2b, such as when the frame 12 is fixed to the holding member 2a by a fixing member such as a clamp, the holding member 8 can be installed alone.

  In addition, the material of the holding member 5 in the breaking device 1 of the present embodiment is flexible even under a temperature condition of −10 to 0 ° C., and sticking occurs with the film adhesive 10. For example, rubber and resin are preferable, and a satin urethane material is particularly preferable. Furthermore, it is desirable that the pressing member 8 has irregularities formed on the surface that contacts the film adhesive 10, thereby improving the peelability from the film adhesive 10.

  Furthermore, as shown in FIG. 2, the holding means 2, the expansion means 3, the advance / retreat means 4, and the pressing member 5 described above may be surrounded by a casing 7, and in that case, the casing 7 is cooled by the cooling means 6. The film adhesive 10 can be cooled by cooling the inside. The housing 7 includes, for example, a rectangular parallelepiped housing 7a having an upper opening and a box-shaped lid 7a that closes the upper opening of the housing 7a with a hinge so as to be opened and closed. An annular frame is formed on a part of the housing 7a. The shutter mechanism 7c for taking in and out 12 and the like can be freely opened and closed.

  Moreover, the cooling means 6 should just be a thing which can cool the temperature in the housing | casing 7 to about -10 to 0 degreeC, for example, cool air in the housing | casing 7 via piping from cooling gas supply apparatuses, such as a cooler unit. In addition, the internal gas can be exhausted from the exhaust port provided in the housing 7.

  As described above, in the breaking device 1 of the present embodiment, when the film adhesive 10 is broken, the pressing member 5 that holds the protruding portion of the film adhesive 10 protruding from the wafer 11 is provided. Therefore, when the protruding part of the film adhesive 10 is broken, it is possible to prevent the fragments from being scattered.

  Next, the operation of the breaking device 1 described above, that is, a method for breaking the film adhesive 10 using the breaking device 1 will be described. 4-7 is sectional drawing which shows the method of fracture | rupturing the film adhesive 10 with the fracture | rupture apparatus 1 of this embodiment in order of the process. When the film-like adhesive 10 is to be broken by the breaking device 1 of the present embodiment, first, as shown in FIG. 4, the wafer 11 having the film-like adhesive 10 affixed to the back surface is interposed via the protective tape 13. The annular frame 12 supported by the opening 12 a is placed on the holding portion 2 a of the frame holding means 2. At this time, the wafer 11 may be in a state of being divided into individual chips after dicing, or a state in which an altered layer is formed on the street by a laser.

  Next, as shown in FIG. 5, cold air is introduced into the casing 7 to cool the film adhesive 10, and the holding portion 2 a is raised by an air piston mechanism or the like to hold the annular frame 12 to the holding portion. It is clamped between 2a and the holding part 2b. At this time, the protruding portion of the film adhesive 10 comes into contact with the pressing member 5 and is sandwiched between the protective tape 13 and the pressing member 5. FIG. 5 shows the case where the holding portion 2a is lifted to be in the holding state, but the present invention is not limited to this, and the holding portion 2b is lowered to hold the annular frame 12 You may let them.

  Subsequently, as shown in FIG. 6, the expansion means 3 is lifted from the standby position by the advance / retreat means 4 and is moved at a predetermined speed to the expansion position above the holding surface of the holding member 2a. Thereby, the wafer pasting area of the protective tape 13 attached to the annular frame 12 is pushed up. At this time, since the protective tape 13 has a low freezing point, the protective tape 13 does not become hard even under a temperature condition of about −10 to 0 ° C., and expands radially by receiving an external force from the expansion means 3. On the other hand, a tensile force acts also on the film adhesive 10 stuck on the protective tape 13, but the film adhesive 10 is cooled and hardened so that it does not expand and breaks along the street. .

  At this time, since the protruding portion of the film adhesive 10 is held by the holding member 8, even when the protruding portion is broken, it is possible to prevent fragments from being scattered.

  In the case where the wafer 11 is not divided and a deteriorated layer is formed on the street by a laser or the like, when the protective tape 13 is expanded, a tensile force acts on the wafer 11 as well. As a result, the wafer 11 as well as the film adhesive 10 is broken along the position where the deteriorated layer is formed, that is, along the street.

  After the rupture of the film adhesive 10 is completed, as shown in FIG. 7, the expansion means 3 is lowered to the standby position by the advance / retreat means 4, and the holding portion 2a is also lowered to a predetermined position by the air piston mechanism or the like. Thereby, the holding by the holding means 8 is also released. And the cooling in the housing | casing 7 is complete | finished and the cyclic | annular flame | frame 12 is taken out.

  As described above, in the breaking device 1 of the present embodiment, when the film-like adhesive 10 is broken, the protruding portion of the film-like adhesive 10 is held by the holding member 5, so that the protruding portion is broken. Even if this occurs, the fragments can be prevented from scattering. Thus, even when the film adhesive 10 is broken while being cooled, it is possible to suppress the occurrence of defects due to adhesion to the surface of the wafer 11. As a result, the film adhesive 10 can be reliably broken without reducing the yield.

It is a disassembled perspective view which shows the structure of the fracture | rupture apparatus which concerns on embodiment of this invention. It is a perspective view which shows the external appearance of the fracture | rupture apparatus 1 shown in FIG. It is a perspective view which shows the state of the film-form adhesive of a fracture | rupture object. It is sectional drawing which shows the method of fracture | rupturing the film adhesive 10 with the fracture | rupture apparatus 1 shown in FIG. It is sectional drawing which shows the method of fracture | rupturing the film adhesive 10 with the fracture | rupture apparatus 1 shown in FIG. 1, and shows the next process of FIG. It is sectional drawing which shows the method of fracture | rupturing the film adhesive 10 with the fracture | rupture apparatus 1 shown in FIG. 1, and shows the next process of FIG. It is sectional drawing which shows the method of fracture | rupturing the film adhesive 10 with the fracture | rupture apparatus 1 shown in FIG. 1, and shows the next process of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Breaking device 2 Frame holding means 3 Expansion means 4 Advancement / retraction means 5 Holding member 6 Cooling means 7 Case 7a Housing 7b Cover 7c Shutter mechanism 10 Film adhesive 11 Wafer 12 Annular frame 12a Opening part 13 Protection tape 14 Device 15 Street

Claims (5)

A film-like adhesive having a diameter larger than that of the wafer affixed to the back surface of the wafer in which a plurality of devices are formed in a matrix is attached onto a stretchable protective tape attached to the opening of the annular frame. A breaking device that breaks along the street partitioning the device,
Frame holding means having a holding surface for holding the annular frame;
Expansion means for acting on a wafer sticking region of the protective tape attached to the annular frame held on the holding surface to expand the protective tape;
Advancing / retreating means for relatively positioning the expansion means and the holding surface at a standby position spaced apart from each other and an expansion position at which the protective tape is expanded;
When the protective tape is expanded, at least a pressing member for pressing the portion of the film adhesive that protrudes from the wafer;
Cooling means for cooling at least the film adhesive;
An apparatus for breaking a film-like adhesive.   2. The film adhesive breaking device according to claim 1, wherein the pressing member has irregularities formed on a surface in contact with the film adhesive.   The apparatus for breaking a film adhesive according to claim 1 or 2, wherein the wafer is also broken along the street together with the film adhesive. A film-like adhesive having a diameter larger than that of the wafer affixed to the back surface of the wafer in which a plurality of devices are formed in a matrix is attached onto a stretchable protective tape attached to the opening of the annular frame. In a state where the device breaks along the streets dividing the device,
Holding the annular frame on the holding surface of the frame holding means;
And expanding the protective tape attached to the annular frame while cooling,
When the protective tape is expanded, at least a portion of the film adhesive that protrudes from the wafer is pressed. The method for breaking a film adhesive according to claim 4, wherein the wafer is also broken along the street together with the film adhesive.