CN106024671B

CN106024671B - Expansion device

Info

Publication number: CN106024671B
Application number: CN201610153195.2A
Authority: CN
Inventors: 松田智人
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2015-03-25
Filing date: 2016-03-17
Publication date: 2021-03-05
Anticipated expiration: 2036-03-17
Also published as: CN106024671A; JP6494360B2; JP2016181659A; KR102380038B1; KR20160115723A

Abstract

The invention provides an expansion device which can restrain condensation in the vicinity of a carrying-in and carrying-out port. The expansion device (2) comprises: frame holding units (26, 28) that hold the annular frame (25) of the frame assembly (1); band expanding means (18, 20) for expanding a protective band (23) that blocks the opening of the annular frame held by the frame holding means; a chamber (4) which has a carrying-in/carrying-out port (4a) for allowing the frame assembly to pass therethrough, and a shielding means (8) for shielding the carrying-in/carrying-out port, and which houses the frame holding means and the tape expanding means therein; and a cooling unit (6, 36) for cooling the inside of the cavity, wherein the shielding unit comprises: a shutter door (10) covering the carry-in and carry-out port of the chamber; and a moving unit (12) which moves the shielding door between a shielding position for shielding the carrying-in and carrying-out port and an opening position for opening the carrying-in and carrying-out port, wherein the shielding door is composed of a resin plate-shaped object (42) with a hollow area (42d) inside.

Description

Expansion device

Technical Field

The present invention relates to an expanding device for expanding a protective tape or the like attached to a wafer.

Background

A wafer having a plurality of devices formed on the front surface thereof is cut or laser-processed along, for example, lines to be divided (streets), and is divided into a plurality of device chips corresponding to the respective devices. In order to fix the device chip to another wafer, a device chip, or the like in a stacked manner, an adhesive layer for fixation may be provided on the back surface side of the device chip.

The adhesive layer provided on the back side is brought into close contact with an object to be fixed, and the adhesive layer is cured by applying external stimulus such as heat or light to fix the device chip. As the adhesive layer, for example, a Film-like adhesive for Die bonding called Die Attach Film (DAF) or the like can be used.

The film-like adhesive is formed to cover the entire back surface of the wafer, and is attached to the back surface of the wafer before dicing, for example. After the film-like adhesive is applied to the back surface of the wafer, the film-like adhesive is divided together with the wafer, whereby the device chip having the adhesive layer on the back surface side can be eliminated.

Further, if a processing method such as DBG (Dicing Before Grinding) that does not completely cut the wafer, SDBG (Stealth Before Grinding) that condenses laser light inside the wafer to form a modified layer by multiphoton absorption is used, there is a high possibility that the film-like adhesive cannot be properly divided together with the wafer.

In view of the above, a method of breaking a film-like adhesive for joining the film-like adhesive to a protective tape (dicing tape, expanding tape) and expanding the protective tape after sufficient cooling has been proposed (for example, see patent document 1). According to this breaking method, the stretchability of the film-like adhesive is reduced by cooling, and therefore the film-like adhesive can be easily broken only by expanding the protective tape.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2009-272502

In the above-described fracturing method, an expansion device provided with a cavity for cooling is used. The chamber is covered with a heat insulating material except for a transfer port for transferring the wafer, and the inside thereof is kept at a low temperature. However, such an expansion device has a problem that condensation is likely to occur in the vicinity of the carrying-in/out port.

Disclosure of Invention

The present invention has been made in view of the above problems, and an object thereof is to provide an expansion device capable of suppressing condensation in the vicinity of a carrying-in/out port.

The present invention provides an expanding apparatus for expanding a protective tape to break an adhesive film along planned dividing lines in a state where the adhesive film is bonded to a frame assembly on the protective tape, wherein a device is formed in a region of a front surface of a wafer partitioned by the planned dividing lines, the adhesive film is bonded to a back surface of the wafer, and the protective tape blocks an opening of an annular frame, the expanding apparatus comprising: a frame holding unit that holds the ring frame of the frame assembly; a belt expanding unit that expands the protective belt that blocks the opening of the ring-shaped frame held by the frame holding unit; a chamber having a carrying-in/carrying-out port that allows passage of the frame assembly and a shielding unit that shields the carrying-in/carrying-out port, and the frame holding unit and the tape expanding unit being housed inside the chamber; and a cooling unit that cools the inside of the chamber, the shielding unit having: a shutter door that covers the carry-in/carry-out port of the chamber; and a moving unit that moves the shutter door between a shutter position for shielding the carrying-in/carrying-out port and an open position for opening the carrying-in/carrying-out port, wherein the shutter door is formed of a plate-like material made of resin and having a hollow region therein.

In the present invention, it is preferable that a sealing unit including a sealing brush for filling a gap between the carrying in/out port and the shutter door positioned at the shutter position is provided in the vicinity of the carrying in/out port.

ADVANTAGEOUS EFFECTS OF INVENTION

The expansion device of the present invention has a shutter door covering the carry-in/carry-out port of the chamber formed by a resin plate having a hollow region therein, and therefore, the heat insulating effect can be improved and dew condensation can be suppressed in the vicinity of the carry-in/carry-out port.

Drawings

Fig. 1 is a perspective view schematically showing a 1 st state of the stent.

Fig. 2 is a perspective view schematically showing the 2 nd state of the expanding device.

Fig. 3 is an exploded perspective view schematically showing the internal condition of the chamber.

Fig. 4 is a perspective view schematically showing the structure of the shutter door.

Fig. 5 is a perspective view schematically showing the structure of an expanding device according to a modification.

Fig. 6 is a partially cross-sectional plan view schematically showing a seal structure of an expansion device according to a modification.

Description of the reference symbols

2. 62: expanding device, 4: cavity, 4 a: carry-in/carry-out port, 6: cold air supply pipe (cooling unit), 8: shielding assembly (shielding unit), 10: shutter door, 12: moving assembly (moving unit), 14: ejection member, 16: base station, 18: expanding roller (belt expanding unit), 20: lifting assembly (belt expanding unit), 22: cylinder liner, 24: piston rod, 26: table (frame holding unit), 26 a: opening, 28: platen (frame holding unit), 28 a: opening, 30: heating and cooling assembly, 32: guide structure, 34: heater, 36: cold air supply pipe (cooling unit), 42: plate, 42 a: surface plate, 42 b: back plate, 42 c: transverse plate, 42 d: hollow region, 44, 46, 48, 50: reinforcing material, 48a, 50 a: angle bar, 48b, 50 b: sealing material, 64: seal structure (seal unit), 66: cover member, 66 a: space, 68: sealing brush, 1: frame assembly, 11: wafer, 13: device, 21: film-like adhesive (adhesive film), 23: protective tape, 25: an annular frame.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view schematically showing a 1 st state of the stent of the present embodiment, and fig. 2 is a perspective view schematically showing a 2 nd state of the stent. Fig. 1 also shows a frame assembly that is carried in and out.

As shown in fig. 1, the frame assembly 1 includes a wafer 11 formed in a disc shape from a material such as silicon or sapphire. The front surface of the wafer 11 is divided into a device region at the center and a peripheral remainder region surrounding the device region.

The device region is further divided into a plurality of regions by a plurality of lines to divide (streets) arranged in a lattice shape, and devices 13 such as ICs and LEDs are formed in each region. The wafer 11 has, for example, modified layers, processing grooves, and the like formed thereon along the planned dividing lines, which serve as starting points for fracture. Therefore, by applying an external force to the wafer 11, the wafer 11 can be divided into a plurality of device chips corresponding to the respective devices 13 along the lines to divide.

A film-like adhesive (adhesive film) 21 having a larger diameter than the wafer 11 is attached to the back surface side of the wafer 11. The film-like adhesive 21 is made of a material such as a resin that is cured by application of external stimulus such as heat or light, and is used to fix the device chip to an arbitrary object to be fixed.

A protective tape (dicing tape, expanding tape) 23 having a diameter larger than that of the film-like adhesive 21 is attached to the lower surface side of the film-like adhesive 21. An annular frame 25 having a circular opening is fixed to an outer peripheral portion of the protective tape 23.

That is, the film-like adhesive 21 is stuck to the protective tape 23 which closes the opening of the ring frame 25. The wafer 11 is supported by the ring frame 25 via the film-like adhesive 21 and the protective tape 23.

The expanding device 2 of the present embodiment expands the protective tape 23 to divide the wafer 11 along the planned dividing lines, for example, and also to break the film-like adhesive agent 21 stuck to the wafer 11 along the planned dividing lines. As shown in fig. 1, the stent 2 has a lumen 4 in which a treatment space is formed.

A carrying-in/out port 4a for allowing the frame assembly 1 to pass therethrough is formed in the front surface of the chamber 4. The frame assembly 1 is carried into the chamber 4 through the carrying-in and carrying-out port 4 a.

On the other hand, a cold air supply pipe (cooling means) 6 is provided on the back surface side of the chamber 4. The cold air supply pipe 6 is connected to a cold air supply source (not shown) disposed outside the chamber 4, for example, so as to guide cold air supplied from the cold air supply source to the inside of the chamber 4.

A shielding member (shielding means) 8 for shielding the carrying-in/out port 4a from the outside is provided in the vicinity of the carrying-in/out port 4 a. The shutter unit 8 includes a shutter door 10 corresponding to the carrying-in/out port 4a, and a moving unit (moving means) 12 for supporting the shutter door 10 from below. The moving unit 12 is constituted by, for example, a cylinder or the like so as to move the shutter door 10 up and down.

As shown in fig. 1, if the shutter door 10 is moved downward by the moving unit 12 and positioned at the open position where the loading/unloading port 4a is opened, the frame assembly 1 can be loaded into and unloaded from the loading/unloading port 4 a.

On the other hand, as shown in fig. 2, the shutter door 10 is moved upward by the moving unit 12 and positioned at a shutter position for shielding the carrying in/out port 4a, so that the carrying in/out port 4a can be covered with the shutter door 10 to keep the inside of the chamber 4 at a low temperature.

Further, a pushing member 14 corresponding to the shutter door 10 is disposed above the carrying in/out port 4 a. By moving the shutter door 10 upward to push the pushing member 14, leakage of the cold air to the upper side of the carrying-in/out port 4a can be suppressed to improve the heat insulating effect, and dew condensation can be suppressed.

Fig. 3 is an exploded perspective view schematically showing the internal condition of the chamber 4. As shown in fig. 3, a rectangular parallelepiped base 16 is disposed inside the chamber 4. A cylindrical expanding roller (belt expanding means) 18 is fixed to the upper surface of the base 16. The outer peripheral diameter of the expanding roller 18 is smaller than the opening diameter of the ring frame 25, and the inner peripheral diameter of the expanding roller 18 is larger than the diameter of the film-like adhesive 21.

At positions surrounding the base 16, 4 elevating units (belt expanding units) 20 are arranged. Each of the lift assemblies 20 has a cylinder liner 22 and a piston rod 24, and a table (frame holding unit) 26 on which an annular frame 25 is placed is fixed to an upper end portion of the piston rod 24. A circular opening 26a corresponding to the expanding drum 18 is formed at the center of the table 26, and the expanding drum 18 communicates with the opening 26 a.

A platen (frame holding unit) 28 that presses and fixes the ring frame 25 placed on the table 26 from above is provided above the table 26. An opening 28a corresponding to the opening 26a of the stage 26 is formed at the center of the platen 28, and the wafer 11, the film-like adhesive 21, and a part of the protective tape 23 are exposed from the opening 28 a.

A heating and cooling unit 30 is disposed above the platen 28. The heating and cooling unit 30 includes a disc-shaped guide structure 32, a heater 34 provided on the outer periphery of the lower surface of the guide structure 32, and a cold air supply pipe (cooling unit) 36 connected to the center of the upper surface of the guide structure 32.

The heater 34 is configured to be capable of radiating infrared rays, for example, and to heat and shrink the outer peripheral portion of the protective tape 23 exposed from the opening 28a of the platen 28 in a non-contact manner. After the protective tape 23 is expanded, the outer peripheral portion is contracted by the heater 34, so that the interval between the adjacent device chips can be maintained in the expanded state. The heater 34 may be of a contact type.

The cold air supply duct 36 is connected to the cold air supply duct 6. The cold air supplied from the cold air supply source through the cold air supply pipes 6, 36 is guided by the guide structure 32 to cool the wafer 11, the film-like adhesive 21, the protective tape 23, and the like, to, for example, 0 ℃.

When the protective tape 23 is expanded by the expanding device 2, the ring-shaped frame 25 is placed on the table 26 and fixed by the pressing plate 28, and the table 26 and the pressing plate 28 are lowered by the elevating unit 20. This allows the frame assembly 1 to be lowered relative to the expanding roller 18, and the protective tape 23 to be expanded by the expanding roller 18.

When the protective tape 23 is expanded, an external force in the horizontal direction is applied to the film-like adhesive 21 and the wafer 11. Thus, the wafer 11 is divided into device chips along the lines to divide. Further, by cooling the film-shaped adhesive 21 to a temperature suitable for breaking in advance, the film-shaped adhesive 21 can be suitably broken.

In addition, in the vicinity of the carry-in/out port 4a not covered with a heat insulator or the like, dew condensation is likely to occur due to the influence of the cold air inside the chamber 4. In the expansion device 2 of the present embodiment, measures are taken against the material, structure, and the like of the shutter door 10, and condensation is suppressed in the vicinity of the carrying-in/out port 4 a. Fig. 4 is a perspective view schematically showing the structure of the shutter door 10.

As shown in fig. 4, the shutter door 10 includes a plate-like object 42 integrally molded of a material such as resin suitable for heat insulation. The plate 42 includes: a rectangular dial plate 42a corresponding to the carrying-in and carrying-out port 4 a; a back plate 42b having the same shape as the front plate 42 a; and a plurality of cross plates 42c connecting the face plate 42a and the back plate 42b front and back.

The plate-like object 42 is partitioned into a plurality of hollow regions 42d by the front plate 42a, the back plate 42b, and the plurality of transverse plates 42c, and the heat insulation performance of the plate-like object 42 is improved by the hollow regions 42 d. As such a plate-like object 42, for example, Twincarbo (registered trademark) manufactured by asahi glass company, etc. can be used.

A reinforcing material 44 for reinforcing the upper portion of the plate-like object 42 is attached to the upper side of the plate-like object 42, and a reinforcing material 46 for reinforcing the lower portion of the plate-like object 42 is attached to the lower side of the plate-like object 42. On the other hand, one side edge of the plate 42 is mounted with a reinforcing material 48 for reinforcing one side portion of the plate 42, and the other side edge of the plate 42 is mounted with a reinforcing material 50 for reinforcing the other side portion of the plate 42.

The reinforcing members 44 and 46 are, for example, angle members made of the same resin as the plate-like object 42, and are formed to have lengths corresponding to the upper and lower sides of the plate-like object 42. On the other hand, the reinforcing

members

48 and 50 are composed of, for example,

angle members

48a and 50a similar to the reinforcing members 44 and 46, and sealing

members

48b and 50b such as sponge provided on the

angle members

48a and 50 a.

The

angle members

48a, 50a are formed in a length corresponding to both side edges of the plate-like object 42. The sealing

members

48b, 50b are fixed to the

angle members

48a, 50a so as to face the hollow regions 42d opened at both side ends of the plate-like object 42, thereby sealing the hollow regions 42 d. In this way, the heat insulation performance of the shutter door 10 is further improved by sealing the hollow area 42d of the plate-like object 42.

As described above, in the expansion device 2 of the present embodiment, the shutter door 10 covering the carry-in/carry-out port 4a of the chamber 4 is formed by the plate-like object 42 made of resin having the hollow region 42d inside, and therefore, the heat insulating effect in the vicinity of the carry-in/carry-out port 4a can be improved to suppress dew condensation.

Further, the shutter door 10 of the present embodiment has a high heat insulating effect, and thus the internal temperature of the chamber 4 is easily maintained. Further, since the shutter door 10 of the present embodiment is extremely lightweight, the structure of the moving assembly (moving unit) 12 can be simplified and the cost thereof can be reduced.

The present invention is not limited to the above embodiments, and various modifications can be made. Fig. 5 is a perspective view schematically showing the structure of an expanding device according to a modification. As shown in fig. 5, the stent 62 in the modification is mostly the same in structure as the stent 2 in the above embodiment. Therefore, the same configurations as those of the stent 2 are given common reference numerals, and detailed descriptions thereof are omitted.

As shown in fig. 5, the expanding device 62 of the modified example has 2 sets of sealing structures (sealing means) 64 corresponding to both side portions of the shutter door 10 (the carry-in/carry-out port 4a) positioned at the shutter position. Fig. 6 is a partially cross-sectional plan view schematically showing a seal structure 64 of an expanding device 62 according to a modification. As shown in fig. 6, each seal structure 64 includes a cover member 66 that covers the entire side portion of the loading/unloading port 4a and the entire side portion of the shutter door 10 positioned at the shutter position.

A space 66a extending in the vertical direction is formed inside the cover member 66, and a seal brush 68 is disposed in the space 66 a. The seal brush 68 is fixed to the cover member 66 so as to fill a gap between the side portion of the shutter door 10 positioned at the shutter position and the side portion of the loading/unloading port 4 a.

By providing such a sealing structure 64, leakage of cold air from the gap between the side portion of the shielding door 10 and the side portion of the carrying-in/out opening 4a can be suppressed, and the heat insulating effect can be further improved. That is, condensation can be more appropriately suppressed, and the internal temperature of the chamber 4 can be more easily maintained. Further, since the gap between the side portion of the shutter door 10 and the side portion of the loading/unloading port 4a is sealed by the seal brush 68 that deforms with a small force, the vertical movement of the shutter door 10 by the moving unit (moving means) 12 is not hindered.

The structure, method, and the like of the above embodiments may be modified as appropriate without departing from the object of the present invention.

Claims

1. An expanding device for expanding a protective tape to break the adhesive film along planned dividing lines in a state where the adhesive film is bonded to a frame assembly on the protective tape, wherein the adhesive film is bonded to a back surface of a wafer having devices formed in regions of a front surface thereof partitioned by the planned dividing lines, and the protective tape blocks openings of an annular frame,

the stent is characterized by comprising:

a frame holding unit that holds the ring frame of the frame assembly;

a belt expanding unit that expands the protective belt that blocks the opening of the ring-shaped frame held by the frame holding unit;

a chamber having a carrying-in/carrying-out port that allows passage of the frame assembly and a shielding unit that shields the carrying-in/carrying-out port, and the frame holding unit and the tape expanding unit being housed inside the chamber; and

a cooling unit that cools the inside of the chamber,

the shielding unit has:

a shutter door that covers the carry-in/carry-out port of the chamber; and

a moving unit for moving the shielding door between a shielding position for shielding the carrying-in/carrying-out port and an opening position for opening the carrying-in/carrying-out port,

the shutter door is composed of a plate-shaped object made of resin, the plate-shaped object is provided with a hollow area inside,

a sealing unit is provided on a side of an outside of the carry-in/carry-out port, and the sealing unit includes a sealing brush that is disposed outside a gap between the carry-in/carry-out port and the shutter door positioned at the shutter position to seal the gap.

2. The stent of claim 1,

should shelter from the door includes:

a plate-like object made of resin, in which a face plate, a back plate, and a plurality of transverse plates are integrally molded; and

a reinforcing material for reinforcing the upper, lower and side edges of the plate-like object;

the inner part of the plate-shaped object is divided into a plurality of hollow areas by connecting the front plate and the back plate with a plurality of transverse plates,

a sealing material for sealing the plurality of hollow regions is provided on the reinforcing material for reinforcing the side edge.