JP2009267366A5 - - Google Patents
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- Publication number
- JP2009267366A5 JP2009267366A5 JP2009030450A JP2009030450A JP2009267366A5 JP 2009267366 A5 JP2009267366 A5 JP 2009267366A5 JP 2009030450 A JP2009030450 A JP 2009030450A JP 2009030450 A JP2009030450 A JP 2009030450A JP 2009267366 A5 JP2009267366 A5 JP 2009267366A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- silicon
- oxide film
- interface
- silicon oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Claims (1)
- シリコン基板とゲート電極の間に、前記シリコン基板側から順に第1シリコン酸化膜、シリコン窒化膜、第2シリコン酸化膜が積層した絶縁膜が介在した半導体記憶装置であって、
前記第1シリコン酸化膜と前記シリコン窒化膜の間の界面、前記シリコン窒化膜と前記第2シリコン酸化膜の間の界面、及び前記第2シリコン酸化膜と前記ゲート電極の間の界面の全て又は少なくとも1つの界面に水素吸蔵膜が介在することを特徴とする半導体記憶装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009030450A JP2009267366A (ja) | 2008-04-02 | 2009-02-12 | 半導体記憶装置及びその製造方法 |
US12/417,186 US8063435B2 (en) | 2008-04-02 | 2009-04-02 | Semiconductor memory and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008096373 | 2008-04-02 | ||
JP2009030450A JP2009267366A (ja) | 2008-04-02 | 2009-02-12 | 半導体記憶装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009267366A JP2009267366A (ja) | 2009-11-12 |
JP2009267366A5 true JP2009267366A5 (ja) | 2012-03-15 |
Family
ID=40930808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009030450A Pending JP2009267366A (ja) | 2008-04-02 | 2009-02-12 | 半導体記憶装置及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8063435B2 (ja) |
JP (1) | JP2009267366A (ja) |
Families Citing this family (33)
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US8232176B2 (en) | 2006-06-22 | 2012-07-31 | Applied Materials, Inc. | Dielectric deposition and etch back processes for bottom up gapfill |
US7867923B2 (en) | 2007-10-22 | 2011-01-11 | Applied Materials, Inc. | High quality silicon oxide films by remote plasma CVD from disilane precursors |
WO2009089066A2 (en) | 2008-01-10 | 2009-07-16 | Stc.Unm | Compounds for use in diagnosing and treating melanoma, including metastatic melanoma and methods related to same |
US8357435B2 (en) | 2008-05-09 | 2013-01-22 | Applied Materials, Inc. | Flowable dielectric equipment and processes |
KR101512494B1 (ko) | 2009-01-09 | 2015-04-16 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
US8511281B2 (en) * | 2009-07-10 | 2013-08-20 | Tula Technology, Inc. | Skip fire engine control |
US8980382B2 (en) | 2009-12-02 | 2015-03-17 | Applied Materials, Inc. | Oxygen-doping for non-carbon radical-component CVD films |
US8741788B2 (en) | 2009-08-06 | 2014-06-03 | Applied Materials, Inc. | Formation of silicon oxide using non-carbon flowable CVD processes |
US8449942B2 (en) | 2009-11-12 | 2013-05-28 | Applied Materials, Inc. | Methods of curing non-carbon flowable CVD films |
KR20120111738A (ko) | 2009-12-30 | 2012-10-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 융통성을 가진 질소/수소 비율을 이용하여 제조된 라디칼에 의한 유전체 필름의 성장 |
US8329262B2 (en) | 2010-01-05 | 2012-12-11 | Applied Materials, Inc. | Dielectric film formation using inert gas excitation |
US8647992B2 (en) | 2010-01-06 | 2014-02-11 | Applied Materials, Inc. | Flowable dielectric using oxide liner |
JP2013516788A (ja) | 2010-01-07 | 2013-05-13 | アプライド マテリアルズ インコーポレイテッド | ラジカル成分cvd用のインサイチュオゾン硬化 |
SG183873A1 (en) * | 2010-03-05 | 2012-10-30 | Applied Materials Inc | Conformal layers by radical-component cvd |
US9285168B2 (en) | 2010-10-05 | 2016-03-15 | Applied Materials, Inc. | Module for ozone cure and post-cure moisture treatment |
US8664127B2 (en) | 2010-10-15 | 2014-03-04 | Applied Materials, Inc. | Two silicon-containing precursors for gapfill enhancing dielectric liner |
US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US8450191B2 (en) | 2011-01-24 | 2013-05-28 | Applied Materials, Inc. | Polysilicon films by HDP-CVD |
US8716154B2 (en) | 2011-03-04 | 2014-05-06 | Applied Materials, Inc. | Reduced pattern loading using silicon oxide multi-layers |
US8445078B2 (en) | 2011-04-20 | 2013-05-21 | Applied Materials, Inc. | Low temperature silicon oxide conversion |
US8466073B2 (en) | 2011-06-03 | 2013-06-18 | Applied Materials, Inc. | Capping layer for reduced outgassing |
US9404178B2 (en) | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
US8617989B2 (en) | 2011-09-26 | 2013-12-31 | Applied Materials, Inc. | Liner property improvement |
US8551891B2 (en) | 2011-10-04 | 2013-10-08 | Applied Materials, Inc. | Remote plasma burn-in |
KR101261928B1 (ko) * | 2011-11-07 | 2013-05-08 | 현대자동차주식회사 | 실리콘 카바이드 쇼트키 베리어 다이오드의 제조방법 |
KR101942504B1 (ko) * | 2012-08-31 | 2019-01-28 | 에스케이하이닉스 주식회사 | 매립 게이트형 반도체 소자, 그 반도체 소자를 갖는 모듈 및 시스템 그리고 그 반도체 소자 제조 방법 |
US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
JP6292507B2 (ja) * | 2014-02-28 | 2018-03-14 | 国立研究開発法人物質・材料研究機構 | 水素拡散障壁を備える半導体デバイス及びその製作方法 |
US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
KR102263315B1 (ko) | 2014-08-06 | 2021-06-15 | 삼성전자주식회사 | 반도체 장치 및 반도체 장치의 제조방법 |
CN110391289B (zh) * | 2019-06-20 | 2020-06-19 | 长江存储科技有限责任公司 | 一种半导体结构及其制作方法 |
KR20210117389A (ko) * | 2020-03-18 | 2021-09-29 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09115904A (ja) | 1995-10-14 | 1997-05-02 | Semiconductor Energy Lab Co Ltd | 酸化膜の作製方法及び酸化膜の作製装置 |
US20030017670A1 (en) * | 2001-07-20 | 2003-01-23 | Macronix International Co., Ltd. | Method of manufacturing a semiconductor memory device with a gate dielectric stack |
JP3724648B2 (ja) * | 2003-10-01 | 2005-12-07 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
US7183166B2 (en) * | 2003-11-25 | 2007-02-27 | Macronix International Co., Ltd. | Method for forming oxide on ONO structure |
JP2005260177A (ja) * | 2004-03-15 | 2005-09-22 | Toshiba Corp | 半導体装置の製造方法 |
JP4781806B2 (ja) * | 2005-12-20 | 2011-09-28 | シャープ株式会社 | 半導体記憶装置およびその製造方法 |
JP2007311695A (ja) * | 2006-05-22 | 2007-11-29 | Renesas Technology Corp | 半導体装置の製造方法 |
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2009
- 2009-02-12 JP JP2009030450A patent/JP2009267366A/ja active Pending
- 2009-04-02 US US12/417,186 patent/US8063435B2/en active Active
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