JP2009246174A5 - - Google Patents
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- Publication number
- JP2009246174A5 JP2009246174A5 JP2008091644A JP2008091644A JP2009246174A5 JP 2009246174 A5 JP2009246174 A5 JP 2009246174A5 JP 2008091644 A JP2008091644 A JP 2008091644A JP 2008091644 A JP2008091644 A JP 2008091644A JP 2009246174 A5 JP2009246174 A5 JP 2009246174A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- resin layer
- semiconductor
- electrode
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 62
- 239000011347 resin Substances 0.000 claims 52
- 229920005989 resin Polymers 0.000 claims 52
- 239000002184 metal Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000005520 cutting process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 238000013459 approach Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000002788 crimping Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008091644A JP4753960B2 (ja) | 2008-03-31 | 2008-03-31 | 半導体モジュール、半導体モジュールの製造方法 |
| CN2009801172074A CN102027591B (zh) | 2008-03-31 | 2009-03-18 | 半导体模块、半导体模块的制造方法及便携式设备 |
| US12/935,854 US8476776B2 (en) | 2008-03-31 | 2009-03-18 | Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus |
| PCT/JP2009/055307 WO2009122911A1 (ja) | 2008-03-31 | 2009-03-18 | 半導体モジュール、半導体モジュールの製造方法、ならびに携帯機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008091644A JP4753960B2 (ja) | 2008-03-31 | 2008-03-31 | 半導体モジュール、半導体モジュールの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009246174A JP2009246174A (ja) | 2009-10-22 |
| JP2009246174A5 true JP2009246174A5 (cg-RX-API-DMAC7.html) | 2011-05-12 |
| JP4753960B2 JP4753960B2 (ja) | 2011-08-24 |
Family
ID=41135297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008091644A Expired - Fee Related JP4753960B2 (ja) | 2008-03-31 | 2008-03-31 | 半導体モジュール、半導体モジュールの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8476776B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4753960B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102027591B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2009122911A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011077108A (ja) * | 2009-09-29 | 2011-04-14 | Elpida Memory Inc | 半導体装置 |
| JP5496692B2 (ja) * | 2010-01-22 | 2014-05-21 | 三洋電機株式会社 | 半導体モジュールの製造方法 |
| KR101678052B1 (ko) * | 2010-02-25 | 2016-11-22 | 삼성전자 주식회사 | 단층 배선 패턴을 포함한 인쇄회로기판(ｐｃｂ), ｐｃｂ를 포함한 반도체 패키지, 반도체 패키지를 포함한 전기전자장치, ｐｃｂ제조방법, 및 반도체 패키지 제조방법 |
| US9748154B1 (en) * | 2010-11-04 | 2017-08-29 | Amkor Technology, Inc. | Wafer level fan out semiconductor device and manufacturing method thereof |
| JP5819999B2 (ja) * | 2014-02-05 | 2015-11-24 | ラピスセミコンダクタ株式会社 | 半導体装置およびその半導体装置の製造方法 |
| CN105097758B (zh) * | 2014-05-05 | 2018-10-26 | 日月光半导体制造股份有限公司 | 衬底、其半导体封装及其制造方法 |
| WO2023042450A1 (ja) * | 2021-09-14 | 2023-03-23 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置の製造方法、半導体装置、及び半導体装置用の配線基板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08236586A (ja) * | 1994-12-29 | 1996-09-13 | Nitto Denko Corp | 半導体装置及びその製造方法 |
| DE69635397T2 (de) * | 1995-03-24 | 2006-05-24 | Shinko Electric Industries Co., Ltd. | Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren |
| JPH08306828A (ja) * | 1995-05-11 | 1996-11-22 | Nitto Denko Corp | 半導体装置 |
| US6181569B1 (en) * | 1999-06-07 | 2001-01-30 | Kishore K. Chakravorty | Low cost chip size package and method of fabricating the same |
| JP2001176898A (ja) * | 1999-12-20 | 2001-06-29 | Mitsui High Tec Inc | 半導体パッケージの製造方法 |
| JP2002083904A (ja) * | 2000-09-06 | 2002-03-22 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| JP3923368B2 (ja) * | 2002-05-22 | 2007-05-30 | シャープ株式会社 | 半導体素子の製造方法 |
| US6998532B2 (en) * | 2002-12-24 | 2006-02-14 | Matsushita Electric Industrial Co., Ltd. | Electronic component-built-in module |
| JP2004349361A (ja) | 2003-05-21 | 2004-12-09 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
| US20090001604A1 (en) * | 2005-03-01 | 2009-01-01 | Daisuke Tanaka | Semiconductor Package and Method for Producing Same |
| JP4428337B2 (ja) * | 2005-12-02 | 2010-03-10 | ソニー株式会社 | 半導体装置の製造方法 |
| JP4877626B2 (ja) | 2006-02-16 | 2012-02-15 | 株式会社テラミクロス | 半導体装置の製造方法 |
| JP2008053693A (ja) | 2006-07-28 | 2008-03-06 | Sanyo Electric Co Ltd | 半導体モジュール、携帯機器、および半導体モジュールの製造方法 |
-
2008
- 2008-03-31 JP JP2008091644A patent/JP4753960B2/ja not_active Expired - Fee Related
-
2009
- 2009-03-18 US US12/935,854 patent/US8476776B2/en not_active Expired - Fee Related
- 2009-03-18 CN CN2009801172074A patent/CN102027591B/zh not_active Expired - Fee Related
- 2009-03-18 WO PCT/JP2009/055307 patent/WO2009122911A1/ja not_active Ceased