JP2009232257A5 - - Google Patents
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- Publication number
- JP2009232257A5 JP2009232257A5 JP2008076372A JP2008076372A JP2009232257A5 JP 2009232257 A5 JP2009232257 A5 JP 2009232257A5 JP 2008076372 A JP2008076372 A JP 2008076372A JP 2008076372 A JP2008076372 A JP 2008076372A JP 2009232257 A5 JP2009232257 A5 JP 2009232257A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- component
- electronic circuit
- plc
- digital
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 300
- 238000004891 communication Methods 0.000 description 41
- 229920005989 resin Polymers 0.000 description 40
- 239000011347 resin Substances 0.000 description 40
- 229920001187 thermosetting polymer Polymers 0.000 description 34
- 239000011256 inorganic filler Substances 0.000 description 33
- 229910003475 inorganic filler Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002131 composite material Substances 0.000 description 30
- 230000000051 modifying Effects 0.000 description 26
- 239000000203 mixture Substances 0.000 description 22
- 239000003990 capacitor Substances 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 230000001629 suppression Effects 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000149 penetrating Effects 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- -1 for example Inorganic materials 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000001808 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910021486 amorphous silicon dioxide Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002250 progressing Effects 0.000 description 2
- 230000000644 propagated Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005549 size reduction Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000001154 acute Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011068 load Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000069 poly(p-phenylene sulfide) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008076372A JP5225721B2 (ja) | 2008-03-24 | 2008-03-24 | 電子回路装置およびこれを用いた電力線通信装置 |
| PCT/JP2009/001308 WO2009119077A1 (ja) | 2008-03-24 | 2009-03-24 | 電子回路基板、およびこれを用いた電力線通信装置 |
| CN2009801105154A CN101982027A (zh) | 2008-03-24 | 2009-03-24 | 电子电路板以及使用其的电力线通信装置 |
| BRPI0909517A BRPI0909517A2 (pt) | 2008-03-24 | 2009-03-24 | painél de circuito eletrônico e aparelho de comunicação de linha de energia utilizando o mesmo |
| US12/933,860 US8582312B2 (en) | 2008-03-24 | 2009-03-24 | Electronic circuit board and power line communication apparatus using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008076372A JP5225721B2 (ja) | 2008-03-24 | 2008-03-24 | 電子回路装置およびこれを用いた電力線通信装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009232257A JP2009232257A (ja) | 2009-10-08 |
| JP2009232257A5 true JP2009232257A5 (ru) | 2011-05-06 |
| JP5225721B2 JP5225721B2 (ja) | 2013-07-03 |
Family
ID=41247129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008076372A Expired - Fee Related JP5225721B2 (ja) | 2008-03-24 | 2008-03-24 | 電子回路装置およびこれを用いた電力線通信装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5225721B2 (ru) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018019419A (ja) * | 2017-09-29 | 2018-02-01 | 日本電波工業株式会社 | 圧電発振器 |
| WO2020185462A1 (en) * | 2019-03-12 | 2020-09-17 | Avx Corporation | High power, double-sided thin film filter |
| CN112788842A (zh) | 2019-11-08 | 2021-05-11 | 华为技术有限公司 | 一种芯片供电系统、芯片、pcb和计算机设备 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190167A (ja) * | 1996-12-27 | 1998-07-21 | Olympus Optical Co Ltd | 回路基板 |
| JP3817571B1 (ja) * | 2005-07-19 | 2006-09-06 | 株式会社日立製作所 | アナログデジタル混在実装回路基板及び核医学診断装置 |
| JP5285842B2 (ja) * | 2006-04-13 | 2013-09-11 | パナソニック株式会社 | 集積回路実装基板および電力線通信装置 |
-
2008
- 2008-03-24 JP JP2008076372A patent/JP5225721B2/ja not_active Expired - Fee Related
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