JP2009188036A - サポートプレート - Google Patents
サポートプレート Download PDFInfo
- Publication number
- JP2009188036A JP2009188036A JP2008024033A JP2008024033A JP2009188036A JP 2009188036 A JP2009188036 A JP 2009188036A JP 2008024033 A JP2008024033 A JP 2008024033A JP 2008024033 A JP2008024033 A JP 2008024033A JP 2009188036 A JP2009188036 A JP 2009188036A
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- region
- substrate
- semiconductor wafer
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 abstract description 41
- 238000000034 method Methods 0.000 abstract description 31
- 239000002904 solvent Substances 0.000 abstract description 15
- 239000012790 adhesive layer Substances 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003176 water-insoluble polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249975—Void shape specified [e.g., crushed, flat, round, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249981—Plural void-containing components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】基板2に貼着して基板2を支持するサポートプレート1を提供する。サポートプレート1において、複数の開孔15・15’が、基板2に面する接着面と該接着面に対向する非接着面とを貫通しており、該接着面には、第1領域11および第1領域11を取り囲む第2領域12からなる開孔が形成されている領域13が設けられており、第1領域11における開孔率が第2領域12の開孔率より大きい。
【選択図】図1
Description
2 半導体ウエハ(基板)
3 接着層
11 第1領域
12 第2領域
13 開孔が形成されている領域
14 外縁部領域
15 貫通穴(開孔)
Claims (7)
- 基板に貼着して該基板を支持するサポートプレートであって、
複数の開孔が、基板に面する接着面と該接着面に対向する非接着面とを貫通しており、
該接着面には、第1領域および第1領域を取り囲む第2領域が設けられており、
第1領域における開孔率が第2領域の開孔率より大きいことを特徴とするサポートプレート。 - 第1領域に形成されている開孔の口径が0.1〜1.0mmであり、かつ第2領域に形成されている開孔の口径より大きいことを特徴とする請求項1に記載のサポートプレート。
- 第1領域に形成されている開孔の間隔が0.1〜1.5mmであり、かつ第2領域に形成されている開孔の間隔より小さいことを特徴とする請求項1または2に記載のサポートプレート。
- 前記接着面の開孔率が10〜40%であることを特徴とする請求項1〜3のいずれか一項に記載のサポートプレート。
- 開孔が形成されていない領域が前記接着面の外縁部に設けられていることを特徴とする請求項1〜4のいずれか一項に記載のサポートプレート。
- 第1領域の面積が前記接着面の面積の50〜99.5%を占めることを特徴とする請求項1〜5のいずれか一項に記載のサポートプレート。
- 前記開孔が砂時計形状である、請求項1に記載のサポートプレート。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008024033A JP5271554B2 (ja) | 2008-02-04 | 2008-02-04 | サポートプレート |
TW98102600A TW200947602A (en) | 2008-02-04 | 2009-01-22 | Support plate |
US12/322,093 US20090197070A1 (en) | 2008-02-04 | 2009-01-29 | Support plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008024033A JP5271554B2 (ja) | 2008-02-04 | 2008-02-04 | サポートプレート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009188036A true JP2009188036A (ja) | 2009-08-20 |
JP5271554B2 JP5271554B2 (ja) | 2013-08-21 |
Family
ID=40931975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008024033A Active JP5271554B2 (ja) | 2008-02-04 | 2008-02-04 | サポートプレート |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090197070A1 (ja) |
JP (1) | JP5271554B2 (ja) |
TW (1) | TW200947602A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013035621A1 (ja) * | 2011-09-07 | 2013-03-14 | 東京エレクトロン株式会社 | 接合方法、コンピュータ記憶媒体及び接合システム |
WO2013035620A1 (ja) * | 2011-09-07 | 2013-03-14 | 東京エレクトロン株式会社 | 接合方法及び接合システム |
WO2014104060A1 (ja) * | 2012-12-27 | 2014-07-03 | 富士フイルム株式会社 | 半導体装置製造用仮接合層、積層体、及び、半導体装置の製造方法 |
JP2018511172A (ja) * | 2015-03-11 | 2018-04-19 | エンベー ベカルト ソシエテ アノニムNV Bekaert SA | 一時的に接着されるウェハ用のキャリア |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5662664B2 (ja) | 2008-12-19 | 2015-02-04 | 東京応化工業株式会社 | 加工基板及びその製造方法 |
EP2706562A3 (de) * | 2009-09-01 | 2014-09-03 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat mittels Kippens eines Filmrahmens |
KR101295358B1 (ko) * | 2011-03-16 | 2013-08-12 | 삼성전자주식회사 | 액정 표시 장치 및 이에 구비되는 엘이디 모듈 |
WO2016142240A1 (en) | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
WO2016142239A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
WO2016142238A1 (en) * | 2015-03-11 | 2016-09-15 | Nv Bekaert Sa | Carrier for temporary bonded wafers |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61208842A (ja) * | 1985-03-14 | 1986-09-17 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ウエハ支持基板 |
JPH06275717A (ja) * | 1993-01-22 | 1994-09-30 | Mitsubishi Electric Corp | ウエハはがし方法 |
JP2002059363A (ja) * | 2000-08-23 | 2002-02-26 | Chemitoronics Co Ltd | ウエーハ支持体 |
JP2004079784A (ja) * | 2002-08-19 | 2004-03-11 | Toshiba Ceramics Co Ltd | 流体流通用シリカガラス板及びその製造方法 |
JP2004335655A (ja) * | 2003-05-06 | 2004-11-25 | Internatl Business Mach Corp <Ibm> | 穴形成方法、プリント配線基板および穴形成装置 |
JP2008021929A (ja) * | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
US6531397B1 (en) * | 1998-01-09 | 2003-03-11 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
DE10260233B4 (de) * | 2002-12-20 | 2016-05-19 | Infineon Technologies Ag | Verfahren zum Befestigen eines Werkstücks mit einem Feststoff an einem Werkstückträger und Werkstückträger |
JP2005191550A (ja) * | 2003-12-01 | 2005-07-14 | Tokyo Ohka Kogyo Co Ltd | 基板の貼り付け方法 |
JP2006135272A (ja) * | 2003-12-01 | 2006-05-25 | Tokyo Ohka Kogyo Co Ltd | 基板のサポートプレート及びサポートプレートの剥離方法 |
JP4721828B2 (ja) * | 2005-08-31 | 2011-07-13 | 東京応化工業株式会社 | サポートプレートの剥離方法 |
-
2008
- 2008-02-04 JP JP2008024033A patent/JP5271554B2/ja active Active
-
2009
- 2009-01-22 TW TW98102600A patent/TW200947602A/zh unknown
- 2009-01-29 US US12/322,093 patent/US20090197070A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61208842A (ja) * | 1985-03-14 | 1986-09-17 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ウエハ支持基板 |
JPH06275717A (ja) * | 1993-01-22 | 1994-09-30 | Mitsubishi Electric Corp | ウエハはがし方法 |
JP2002059363A (ja) * | 2000-08-23 | 2002-02-26 | Chemitoronics Co Ltd | ウエーハ支持体 |
JP2004079784A (ja) * | 2002-08-19 | 2004-03-11 | Toshiba Ceramics Co Ltd | 流体流通用シリカガラス板及びその製造方法 |
JP2004335655A (ja) * | 2003-05-06 | 2004-11-25 | Internatl Business Mach Corp <Ibm> | 穴形成方法、プリント配線基板および穴形成装置 |
JP2008021929A (ja) * | 2006-07-14 | 2008-01-31 | Tokyo Ohka Kogyo Co Ltd | サポートプレート、搬送装置、剥離装置及び剥離方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013035621A1 (ja) * | 2011-09-07 | 2013-03-14 | 東京エレクトロン株式会社 | 接合方法、コンピュータ記憶媒体及び接合システム |
WO2013035620A1 (ja) * | 2011-09-07 | 2013-03-14 | 東京エレクトロン株式会社 | 接合方法及び接合システム |
JP2013058571A (ja) * | 2011-09-07 | 2013-03-28 | Tokyo Electron Ltd | 接合方法、プログラム、コンピュータ記憶媒体及び接合システム |
JP2013058568A (ja) * | 2011-09-07 | 2013-03-28 | Tokyo Electron Ltd | 接合方法、プログラム、コンピュータ記憶媒体及び接合システム |
US9463612B2 (en) | 2011-09-07 | 2016-10-11 | Tokyo Electron Limited | Joining method and joining system |
WO2014104060A1 (ja) * | 2012-12-27 | 2014-07-03 | 富士フイルム株式会社 | 半導体装置製造用仮接合層、積層体、及び、半導体装置の製造方法 |
JP2018511172A (ja) * | 2015-03-11 | 2018-04-19 | エンベー ベカルト ソシエテ アノニムNV Bekaert SA | 一時的に接着されるウェハ用のキャリア |
Also Published As
Publication number | Publication date |
---|---|
TW200947602A (en) | 2009-11-16 |
JP5271554B2 (ja) | 2013-08-21 |
US20090197070A1 (en) | 2009-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5271554B2 (ja) | サポートプレート | |
US7867876B2 (en) | Method of thinning a semiconductor substrate | |
JP5196838B2 (ja) | 接着剤付きチップの製造方法 | |
JP5238927B2 (ja) | 半導体装置の製造方法 | |
US10186447B2 (en) | Method for bonding thin semiconductor chips to a substrate | |
JP2006135272A (ja) | 基板のサポートプレート及びサポートプレートの剥離方法 | |
KR100759687B1 (ko) | 기판의 박판화 방법 및 회로소자의 제조방법 | |
JP5334411B2 (ja) | 貼り合わせ基板および貼り合せ基板を用いた半導体装置の製造方法 | |
US8500182B2 (en) | Vacuum wafer carriers for strengthening thin wafers | |
JP5074719B2 (ja) | ウエハを薄くする方法及びサポートプレート | |
JP2008028325A (ja) | 半導体装置の製造方法 | |
KR20190119031A (ko) | 칩들을 본딩하기 위한 방법 및 디바이스 | |
JP2004282035A (ja) | 半導体装置の製造方法 | |
US7960247B2 (en) | Die thinning processes and structures | |
JP5074940B2 (ja) | 基板の処理方法 | |
TW201246402A (en) | Forming die backside coating structures with coreless packages | |
US20090249604A1 (en) | Method and apparatus for releasing support plate and wafer chips from each other | |
JP2007036074A (ja) | 半導体装置の製造方法 | |
KR100927778B1 (ko) | 반도체 패키지 제조 방법 | |
JP2010042469A (ja) | サポートプレート | |
JP2008244132A (ja) | 半導体装置の製造方法および半導体装置 | |
TWI824470B (zh) | 液體中固晶方法 | |
JP2006140303A (ja) | 半導体装置の製造方法 | |
JP2008041780A (ja) | サポートプレート、ウエハを剥離する方法、及びウエハを薄くする方法 | |
JP4859716B2 (ja) | ウエハ及びその搬送システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101122 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130227 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130319 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130412 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130507 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130513 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5271554 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |