JP2009175418A - 光電気混載基板及びその製造方法 - Google Patents

光電気混載基板及びその製造方法 Download PDF

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Publication number
JP2009175418A
JP2009175418A JP2008013752A JP2008013752A JP2009175418A JP 2009175418 A JP2009175418 A JP 2009175418A JP 2008013752 A JP2008013752 A JP 2008013752A JP 2008013752 A JP2008013752 A JP 2008013752A JP 2009175418 A JP2009175418 A JP 2009175418A
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JP
Japan
Prior art keywords
mirror
opto
mirror support
electric hybrid
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008013752A
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English (en)
Japanese (ja)
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JP2009175418A5 (enExample
Inventor
Kenji Yanagisawa
賢司 柳沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008013752A priority Critical patent/JP2009175418A/ja
Priority to US12/358,521 priority patent/US8041159B2/en
Publication of JP2009175418A publication Critical patent/JP2009175418A/ja
Publication of JP2009175418A5 publication Critical patent/JP2009175418A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2008013752A 2008-01-24 2008-01-24 光電気混載基板及びその製造方法 Pending JP2009175418A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008013752A JP2009175418A (ja) 2008-01-24 2008-01-24 光電気混載基板及びその製造方法
US12/358,521 US8041159B2 (en) 2008-01-24 2009-01-23 Optical/electrical hybrid substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008013752A JP2009175418A (ja) 2008-01-24 2008-01-24 光電気混載基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009175418A true JP2009175418A (ja) 2009-08-06
JP2009175418A5 JP2009175418A5 (enExample) 2011-01-06

Family

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Family Applications (1)

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JP2008013752A Pending JP2009175418A (ja) 2008-01-24 2008-01-24 光電気混載基板及びその製造方法

Country Status (2)

Country Link
US (1) US8041159B2 (enExample)
JP (1) JP2009175418A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012118424A (ja) * 2010-12-03 2012-06-21 Shinko Electric Ind Co Ltd 光導波路及びその製造方法と光導波路装置
JP2012155036A (ja) * 2011-01-24 2012-08-16 Hitachi Chem Co Ltd ミラー付き光導波路及びその製造方法、ミラー付きフレキシブル導波路及びその製造方法、ミラー付き光ファイバコネクタ及びその製造方法
JP2014122929A (ja) * 2012-12-20 2014-07-03 Shinko Electric Ind Co Ltd 光導波路装置及びその製造方法
US9151910B2 (en) 2012-06-11 2015-10-06 Shinko Electric Industries Co., Ltd. Optical module and method for manufacturing optical module
JP2016145907A (ja) * 2015-02-06 2016-08-12 富士通コンポーネント株式会社 光導波路モジュール

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* Cited by examiner, † Cited by third party
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JP5313849B2 (ja) * 2009-11-30 2013-10-09 新光電気工業株式会社 光導波路装置及びその製造方法
KR101108730B1 (ko) * 2010-06-23 2012-02-29 삼성전기주식회사 광 연성인쇄회로기판 및 이의 제조 방법
WO2013085225A1 (en) * 2011-12-08 2013-06-13 Lg Innotek Co., Ltd. Optical printed circuit board and method of manufacturing the same
JP5838881B2 (ja) * 2012-03-27 2016-01-06 富士通株式会社 光射出部材の実装方法及び実装装置
JP6053331B2 (ja) * 2012-05-30 2016-12-27 キヤノン株式会社 画像読取装置および組立方法
JP6235878B2 (ja) * 2013-11-25 2017-11-22 新光電気工業株式会社 光導波路装置及びその製造方法
EP2881773B1 (en) * 2013-12-03 2018-07-11 ams AG Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
US11037892B2 (en) * 2016-12-30 2021-06-15 Intel Corporation Substrate dielectric waveguides in semiconductor packages
WO2019246594A1 (en) 2018-06-22 2019-12-26 Masseta Technologies Llc Discrete optical unit on a substrate of an integrated photonics chip
US11525958B1 (en) * 2019-09-09 2022-12-13 Apple Inc. Off-cut wafer with a supported outcoupler
US11500154B1 (en) 2019-10-18 2022-11-15 Apple Inc. Asymmetric optical power splitting system and method
WO2022087479A1 (en) 2020-10-23 2022-04-28 Alexander Goldis Fast-axis collimator with hanging connector
JP2023008205A (ja) * 2021-07-05 2023-01-19 イビデン株式会社 配線基板
US12292597B2 (en) 2021-09-23 2025-05-06 Apple Inc. Light output devices and light outputting methods for optical systems
US12405420B2 (en) 2021-09-23 2025-09-02 Apple Inc. Light output devices and light outputting methods for optical systems

Citations (8)

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JPH07159658A (ja) * 1993-12-07 1995-06-23 Nippon Telegr & Teleph Corp <Ntt> 光導波路−光素子結合構造およびその製造方法
JPH1164675A (ja) * 1997-08-26 1999-03-05 Sharp Corp 光結合器の製造方法
JP2004258065A (ja) * 2003-02-24 2004-09-16 Ngk Spark Plug Co Ltd 光導波路基板及びその製造方法、光電気複合実装配線基板及びその製造方法
JP2005070142A (ja) * 2003-08-28 2005-03-17 Ngk Spark Plug Co Ltd 光路変換部品付きの光導波路構造体、光路変換部品及びその製造方法
JP2006003868A (ja) * 2004-05-20 2006-01-05 Ngk Spark Plug Co Ltd 光導波路デバイス及びその製造方法
JP2006133763A (ja) * 2004-10-07 2006-05-25 Nec Corp Ｌｓｉパッケージの光電気配線板への実装構造、実装方法、情報処理装置、光インタフェース、光電気配線板
JP2006292852A (ja) * 2005-04-07 2006-10-26 Kyocera Corp 光電気配線基板
JP2006330697A (ja) * 2005-04-25 2006-12-07 Kyocera Corp 光結合構造並びに光伝送機能内蔵基板およびその製造方法

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US5761350A (en) * 1997-01-22 1998-06-02 Koh; Seungug Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly
US6713788B2 (en) * 1998-03-30 2004-03-30 Micron Technology, Inc. Opto-electric mounting apparatus
JP4306011B2 (ja) 1999-04-20 2009-07-29 凸版印刷株式会社 光配線層及びその製造方法並びに光・電気配線基板及びその製造方法並びに実装基板
US6670208B2 (en) * 2000-06-23 2003-12-30 Nec Corporation Optical circuit in which fabrication is easy
JP3762208B2 (ja) * 2000-09-29 2006-04-05 株式会社東芝 光配線基板の製造方法
WO2002073256A1 (fr) * 2001-02-28 2002-09-19 Nec Corporation Circuit optique et son procede de production, circuit optique en reseau, et dispositif a circuit optique l'utilisant
JP3791394B2 (ja) * 2001-11-01 2006-06-28 日本電気株式会社 光導波路基板
US6801679B2 (en) * 2001-11-23 2004-10-05 Seungug Koh Multifunctional intelligent optical modules based on planar lightwave circuits
US20060239612A1 (en) * 2002-06-19 2006-10-26 Peter De Dobbelaere Flip-chip devices formed on photonic integrated circuit chips
JP4012785B2 (ja) * 2002-08-27 2007-11-21 日本板硝子株式会社 光接続装置
US7149376B2 (en) * 2002-08-27 2006-12-12 Ibiden Co., Ltd. Embedded optical coupling in circuit boards
US20050063637A1 (en) * 2003-09-22 2005-03-24 Mershon Jayne L. Connecting a component with an embedded optical fiber
US7481545B2 (en) * 2005-10-13 2009-01-27 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Method of forming and mounting an angled reflector
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Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07159658A (ja) * 1993-12-07 1995-06-23 Nippon Telegr & Teleph Corp <Ntt> 光導波路−光素子結合構造およびその製造方法
JPH1164675A (ja) * 1997-08-26 1999-03-05 Sharp Corp 光結合器の製造方法
JP2004258065A (ja) * 2003-02-24 2004-09-16 Ngk Spark Plug Co Ltd 光導波路基板及びその製造方法、光電気複合実装配線基板及びその製造方法
JP2005070142A (ja) * 2003-08-28 2005-03-17 Ngk Spark Plug Co Ltd 光路変換部品付きの光導波路構造体、光路変換部品及びその製造方法
JP2006003868A (ja) * 2004-05-20 2006-01-05 Ngk Spark Plug Co Ltd 光導波路デバイス及びその製造方法
JP2006133763A (ja) * 2004-10-07 2006-05-25 Nec Corp Ｌｓｉパッケージの光電気配線板への実装構造、実装方法、情報処理装置、光インタフェース、光電気配線板
JP2006292852A (ja) * 2005-04-07 2006-10-26 Kyocera Corp 光電気配線基板
JP2006330697A (ja) * 2005-04-25 2006-12-07 Kyocera Corp 光結合構造並びに光伝送機能内蔵基板およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012118424A (ja) * 2010-12-03 2012-06-21 Shinko Electric Ind Co Ltd 光導波路及びその製造方法と光導波路装置
JP2012155036A (ja) * 2011-01-24 2012-08-16 Hitachi Chem Co Ltd ミラー付き光導波路及びその製造方法、ミラー付きフレキシブル導波路及びその製造方法、ミラー付き光ファイバコネクタ及びその製造方法
US9151910B2 (en) 2012-06-11 2015-10-06 Shinko Electric Industries Co., Ltd. Optical module and method for manufacturing optical module
JP2014122929A (ja) * 2012-12-20 2014-07-03 Shinko Electric Ind Co Ltd 光導波路装置及びその製造方法
JP2016145907A (ja) * 2015-02-06 2016-08-12 富士通コンポーネント株式会社 光導波路モジュール

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US8041159B2 (en) 2011-10-18
US20090190878A1 (en) 2009-07-30

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