JP2009156862A - 位置測定システムおよびリソグラフィ装置 - Google Patents
位置測定システムおよびリソグラフィ装置 Download PDFInfo
- Publication number
- JP2009156862A JP2009156862A JP2008273658A JP2008273658A JP2009156862A JP 2009156862 A JP2009156862 A JP 2009156862A JP 2008273658 A JP2008273658 A JP 2008273658A JP 2008273658 A JP2008273658 A JP 2008273658A JP 2009156862 A JP2009156862 A JP 2009156862A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- measurement system
- sensor
- position measurement
- lithographic apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 claims description 59
- 230000005855 radiation Effects 0.000 claims description 53
- 238000000059 patterning Methods 0.000 claims description 44
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 208000025174 PANDAS Diseases 0.000 description 1
- 208000021155 Paediatric autoimmune neuropsychiatric disorders associated with streptococcal infection Diseases 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/36—Forming the light into pulses
- G01D5/38—Forming the light into pulses by diffraction gratings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Abstract
【解決手段】 測定システムは、構造に対するセンサの第1位置量を決定するために測定システムの構造上に配置される第1パターンと協動するように配置され、かつ構造に対するセンサの第2位置量を決定するために構造上に配置される第2パターンと協動するように配置されるセンサを含み、前記第1および第2パターンが、構造の異なる表面上に配置される。
【選択図】 図4
Description
Claims (14)
- (1)構造に対するセンサの第1位置量を決定するために、前記構造上に配置された第1パターンと協動するように、かつ(2)前記構造に対する前記センサの第2位置量を決定するために、前記構造上に配置された第2パターンと協動するように配置された、前記センサを含む位置測定システムであって、前記第1パターンと前記第2パターンは、前記構造の異なる表面上に配置される、位置測定システム。
- 前記第1パターンは、第1方向に延在するリニア格子である、請求項1に記載の位置測定システム。
- 前記第2パターンは、前記第1方向に実質的に垂直な第2方向に延在するリニア格子である、請求項2に記載の位置測定システム。
- 前記第1パターンは、第1ピッチを有するリニア格子であり、前記第2パターンは、前記第1ピッチとは異なる第2ピッチを有するリニア格子である、請求項1に記載の位置測定システム。
- 前記センサは、前記第1パターンに向けて、かつ少なくとも部分的に前記構造を通して前記第2パターンに向けて放射ビームを投影するように配置されている、請求項1に記載の位置測定システム。
- 前記構造は透明層を含む、請求項1に記載の位置測定システム。
- 前記センサは、前記第1パターンの+1および−1次反射波形を受けるようにさらに配置されている、請求項1に記載の位置測定システム。
- 前記センサは、前記第2パターンの+1および−1次反射波形を受けるようにさらに配置されている、請求項7に記載の位置測定システム。
- 前記第1パターンと前記第2パターンは、前記構造の対向する表面に配置される、請求項1に記載の位置測定システム。
- 前記パターンの少なくとも1つは、前記構造の内表面に提供されている、請求項1に記載の位置測定システム。
- 放射ビームを調整するように構成された照明システム、
前記放射ビームの断面にパターンを付与して、パターン付き放射ビームを形成することができるパターニングデバイスを支持するように構成されたパターニングデバイスサポート、
基板を保持するように構成された基板サポート、
前記基板のターゲット部分に前記パターン付き放射ビームを投影するように構成された投影システム、および
前記サポートのうちの1つの第1および第2位置量を測定するように構成された位置測定システムであって、(1)前記サポートの前記第1位置量を決定するために前記測定システムの構造上に配置された第1パターン、および(2)前記サポートの前記第2位置量を決定するために前記構造上に配置された第2パターンと協動するように配置されたセンサを含む、位置測定システム
を含む、リソグラフィ装置であって、
前記第1および第2パターンは、前記構造の異なる表面上に配置される、リソグラフィ装置。 - 前記第1位置量は第1方向の変位であり、前記第2位置量は第2方向の変位であり、前記第1方向は水平面に実質的に垂直であり、前記第2方向は水平面に実質的に平行である、請求項11に記載のリソグラフィ装置。
- 前記サポートは前記パターニングデバイスサポートである、請求項11に記載のリソグラフィ装置。
- 前記サポートは前記基板サポートである、請求項11に記載のリソグラフィ装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99610607P | 2007-11-01 | 2007-11-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009156862A true JP2009156862A (ja) | 2009-07-16 |
Family
ID=40587772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008273658A Pending JP2009156862A (ja) | 2007-11-01 | 2008-10-24 | 位置測定システムおよびリソグラフィ装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8319940B2 (ja) |
JP (1) | JP2009156862A (ja) |
KR (1) | KR101022395B1 (ja) |
CN (1) | CN101424513B (ja) |
NL (1) | NL1036080A1 (ja) |
TW (1) | TWI476538B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101249126B1 (ko) * | 2011-12-29 | 2013-04-02 | 한국교통대학교산학협력단 | 변위 측정 장치 |
KR20150040763A (ko) * | 2013-10-07 | 2015-04-15 | 덕터 요한네스 하이덴하인 게엠베하 | 측정 눈금 및 이를 포함하는 광전기적 위치 측정 장치 |
WO2016027477A1 (ja) * | 2014-08-20 | 2016-02-25 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
WO2016136690A1 (ja) * | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びに管理方法、重ね合わせ計測方法及びデバイス製造方法 |
KR101791123B1 (ko) | 2013-05-07 | 2017-10-27 | 에이에스엠엘 네델란즈 비.브이. | 정렬 센서, 리소그래피 장치 및 정렬 방법 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009036637A (ja) * | 2007-08-01 | 2009-02-19 | Sony Corp | 変位測定装置 |
US9229338B2 (en) * | 2008-09-08 | 2016-01-05 | Asml Netherlands B.V. | Substrate, a method of measuring a property, an inspection apparatus and a lithographic apparatus |
NL2005975A (en) | 2010-03-03 | 2011-09-06 | Asml Netherlands Bv | Imprint lithography. |
NL2006743A (en) * | 2010-06-09 | 2011-12-12 | Asml Netherlands Bv | Position sensor and lithographic apparatus. |
JP5743958B2 (ja) * | 2012-05-30 | 2015-07-01 | キヤノン株式会社 | 計測方法、露光方法および装置 |
SG11201503261TA (en) * | 2012-11-19 | 2015-05-28 | Asml Netherlands Bv | Position measurement system, grating for a position measurement system and method |
JP6341883B2 (ja) * | 2014-06-27 | 2018-06-13 | キヤノン株式会社 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
TWI693477B (zh) | 2015-02-23 | 2020-05-11 | 日商尼康股份有限公司 | 測量裝置、微影系統及曝光裝置、以及元件製造方法 |
TWI702474B (zh) | 2015-02-23 | 2020-08-21 | 日商尼康股份有限公司 | 基板處理系統及基板處理方法、以及元件製造方法 |
WO2017111923A1 (en) * | 2015-12-21 | 2017-06-29 | Intel Corporation | Approaches for measuring overlay, dose or focus on pre-patterned hardmask structures using scanning electron microscopy (sem) |
JP6207671B1 (ja) * | 2016-06-01 | 2017-10-04 | キヤノン株式会社 | パターン形成装置、基板配置方法及び物品の製造方法 |
CN106019857B (zh) * | 2016-07-22 | 2018-02-02 | 合肥芯碁微电子装备有限公司 | 一种基于无掩膜直写系统套刻曝光的定位方法 |
US11761929B2 (en) * | 2018-06-19 | 2023-09-19 | Asml Netherlands B.V. | Sensor apparatus for lithographic measurements |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63307730A (ja) * | 1987-06-01 | 1988-12-15 | ヒューレット‐パッカード・カンパニー | 走査投射アライナ用焦点面測定方法 |
JPH01269002A (ja) * | 1988-04-21 | 1989-10-26 | Mitsutoyo Corp | 2次元変位検出装置 |
JPH02184704A (ja) * | 1989-01-11 | 1990-07-19 | Nec Corp | 測長装置 |
JPH02231526A (ja) * | 1989-03-03 | 1990-09-13 | Canon Inc | エンコーダ |
JPH06260389A (ja) * | 1993-03-05 | 1994-09-16 | Nikon Corp | アライメント装置 |
JPH09189574A (ja) * | 1996-01-10 | 1997-07-22 | Canon Inc | 光学式リニアエンコーダ、及びこれを用いた電子装置、記録装置 |
JP2000299276A (ja) * | 1999-04-15 | 2000-10-24 | Nikon Corp | 露光装置 |
JP2002014005A (ja) * | 2000-04-25 | 2002-01-18 | Nikon Corp | 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置 |
JP2002372407A (ja) * | 2001-06-13 | 2002-12-26 | Mitsutoyo Corp | 格子干渉型変位検出装置 |
JP2004038536A (ja) * | 2002-07-03 | 2004-02-05 | Ricoh Co Ltd | 光学素子の測定方法 |
JP2004198252A (ja) * | 2002-12-18 | 2004-07-15 | Yaskawa Electric Corp | 光学式エンコーダ |
JP2005147828A (ja) * | 2003-11-14 | 2005-06-09 | Mitsutoyo Corp | 変位検出装置 |
JP2006216925A (ja) * | 2005-02-04 | 2006-08-17 | Samsung Electro-Mechanics Co Ltd | 振動アクチュエータ |
JP2007013192A (ja) * | 2005-06-28 | 2007-01-18 | Asml Netherlands Bv | 測定方法及び較正基板 |
JP2007178281A (ja) * | 2005-12-28 | 2007-07-12 | Sendai Nikon:Kk | チルトセンサ及びエンコーダ |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3106499B2 (ja) | 1990-11-30 | 2000-11-06 | 株式会社ニコン | 露光装置 |
US6153886A (en) * | 1993-02-19 | 2000-11-28 | Nikon Corporation | Alignment apparatus in projection exposure apparatus |
EP0906590B1 (en) * | 1997-03-07 | 2003-08-27 | ASML Netherlands B.V. | Lithographic projection apparatus with off-axis alignment unit |
US20020041377A1 (en) * | 2000-04-25 | 2002-04-11 | Nikon Corporation | Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method |
JP2002038536A (ja) | 2000-07-27 | 2002-02-06 | Hitachi Constr Mach Co Ltd | 建設機械のカットオフ制御装置 |
US6768539B2 (en) * | 2001-01-15 | 2004-07-27 | Asml Netherlands B.V. | Lithographic apparatus |
TW594431B (en) * | 2002-03-01 | 2004-06-21 | Asml Netherlands Bv | Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods |
CN1497355A (zh) * | 2002-10-18 | 2004-05-19 | Asml荷兰有限公司 | 确定杂散辐射的方法,光刻投影设备 |
SG124270A1 (en) * | 2002-12-16 | 2006-08-30 | Asml Netherlands Bv | Lithographic apparatus with alignment subsystem, device manufacturing method using alignment, and alignment structure |
EP1630857A4 (en) * | 2003-05-28 | 2008-04-16 | Nikon Corp | METHOD AND DEVICE FOR MEASURING POSITION INFORMATION, AND METHOD AND SYSTEM FOR EXPOSURE |
US7310130B2 (en) * | 2004-10-05 | 2007-12-18 | Asml Netherlands B.V. | Lithographic apparatus and position measuring method |
KR20070035531A (ko) * | 2004-11-29 | 2007-03-30 | 에이에스엠엘 네델란즈 비.브이. | 모아레 패턴 생성 장치 및 기판의 위치를 측정하는 방법 |
EP1983555B1 (en) * | 2006-01-19 | 2014-05-28 | Nikon Corporation | Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method |
JP2007266091A (ja) | 2006-03-27 | 2007-10-11 | Nikon Corp | 空間像センサのスリット板、空間像センサおよび露光装置 |
-
2008
- 2008-10-16 NL NL1036080A patent/NL1036080A1/nl not_active Application Discontinuation
- 2008-10-21 US US12/255,328 patent/US8319940B2/en active Active
- 2008-10-24 JP JP2008273658A patent/JP2009156862A/ja active Pending
- 2008-10-29 TW TW097141665A patent/TWI476538B/zh not_active IP Right Cessation
- 2008-10-29 CN CN200810173807XA patent/CN101424513B/zh active Active
- 2008-10-31 KR KR1020080107980A patent/KR101022395B1/ko active IP Right Grant
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63307730A (ja) * | 1987-06-01 | 1988-12-15 | ヒューレット‐パッカード・カンパニー | 走査投射アライナ用焦点面測定方法 |
JPH01269002A (ja) * | 1988-04-21 | 1989-10-26 | Mitsutoyo Corp | 2次元変位検出装置 |
JPH02184704A (ja) * | 1989-01-11 | 1990-07-19 | Nec Corp | 測長装置 |
JPH02231526A (ja) * | 1989-03-03 | 1990-09-13 | Canon Inc | エンコーダ |
JPH06260389A (ja) * | 1993-03-05 | 1994-09-16 | Nikon Corp | アライメント装置 |
JPH09189574A (ja) * | 1996-01-10 | 1997-07-22 | Canon Inc | 光学式リニアエンコーダ、及びこれを用いた電子装置、記録装置 |
JP2000299276A (ja) * | 1999-04-15 | 2000-10-24 | Nikon Corp | 露光装置 |
JP2002014005A (ja) * | 2000-04-25 | 2002-01-18 | Nikon Corp | 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置 |
JP2002372407A (ja) * | 2001-06-13 | 2002-12-26 | Mitsutoyo Corp | 格子干渉型変位検出装置 |
JP2004038536A (ja) * | 2002-07-03 | 2004-02-05 | Ricoh Co Ltd | 光学素子の測定方法 |
JP2004198252A (ja) * | 2002-12-18 | 2004-07-15 | Yaskawa Electric Corp | 光学式エンコーダ |
JP2005147828A (ja) * | 2003-11-14 | 2005-06-09 | Mitsutoyo Corp | 変位検出装置 |
JP2006216925A (ja) * | 2005-02-04 | 2006-08-17 | Samsung Electro-Mechanics Co Ltd | 振動アクチュエータ |
JP2007013192A (ja) * | 2005-06-28 | 2007-01-18 | Asml Netherlands Bv | 測定方法及び較正基板 |
JP2007178281A (ja) * | 2005-12-28 | 2007-07-12 | Sendai Nikon:Kk | チルトセンサ及びエンコーダ |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101249126B1 (ko) * | 2011-12-29 | 2013-04-02 | 한국교통대학교산학협력단 | 변위 측정 장치 |
KR101791123B1 (ko) | 2013-05-07 | 2017-10-27 | 에이에스엠엘 네델란즈 비.브이. | 정렬 센서, 리소그래피 장치 및 정렬 방법 |
KR20150040763A (ko) * | 2013-10-07 | 2015-04-15 | 덕터 요한네스 하이덴하인 게엠베하 | 측정 눈금 및 이를 포함하는 광전기적 위치 측정 장치 |
JP2015075484A (ja) * | 2013-10-07 | 2015-04-20 | ドクトル・ヨハネス・ハイデンハイン・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングDr. Johannes Heidenhain Gesellschaft Mitbeschrankter Haftung | 測定目盛及びその測定目盛を備えた光電式位置測定装置 |
KR102169432B1 (ko) * | 2013-10-07 | 2020-10-26 | 덕터 요한네스 하이덴하인 게엠베하 | 측정 눈금 및 이를 포함하는 광전기적 위치 측정 장치 |
WO2016027477A1 (ja) * | 2014-08-20 | 2016-02-25 | 株式会社ニコン | 露光装置及び露光方法、並びにデバイス製造方法 |
WO2016136690A1 (ja) * | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びに管理方法、重ね合わせ計測方法及びデバイス製造方法 |
JPWO2016136690A1 (ja) * | 2015-02-23 | 2017-11-30 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びに管理方法、重ね合わせ計測方法及びデバイス製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101022395B1 (ko) | 2011-03-15 |
US8319940B2 (en) | 2012-11-27 |
TW200928610A (en) | 2009-07-01 |
NL1036080A1 (nl) | 2009-05-07 |
CN101424513B (zh) | 2012-03-28 |
TWI476538B (zh) | 2015-03-11 |
US20090115987A1 (en) | 2009-05-07 |
CN101424513A (zh) | 2009-05-06 |
KR20090045126A (ko) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101022395B1 (ko) | 위치 측정 시스템 및 리소그래피 장치 | |
KR101244395B1 (ko) | 리소그래피 장치 및 디바이스 제조방법 | |
US8351024B2 (en) | Lithographic apparatus and device manufacturing method involving a level sensor having a detection grating including three or more segments | |
JP6080970B2 (ja) | 位置測定システム、位置測定システムの格子及び方法 | |
KR101129529B1 (ko) | 리소그래피 장치 및 디바이스 제조 방법 | |
KR101185462B1 (ko) | 리소그래피 장치 및 디바이스 제조 방법 | |
JP2007335863A (ja) | グレーフィルタを有する波面センサおよびそれを含むリソグラフィ装置 | |
JP4643627B2 (ja) | フォーカステスト実施方法およびデバイス製造方法 | |
JP6082471B2 (ja) | オブジェクト位置決めシステム、リソグラフィ装置、およびデバイス製造方法 | |
US20120013879A1 (en) | Lithographic apparatus and device manufacturing method | |
US8111377B2 (en) | Lithographic apparatus with an encoder arranged for defining a zero level | |
JP4543026B2 (ja) | パターンアライメント方法およびリソグラフィ装置 | |
JP5784576B2 (ja) | リソグラフィ装置および方法 | |
CN108369390B (zh) | 光刻设备和器件制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101004 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110509 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111027 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120220 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20120227 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20120907 |