JP2009152494A5 - - Google Patents

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Publication number
JP2009152494A5
JP2009152494A5 JP2007330988A JP2007330988A JP2009152494A5 JP 2009152494 A5 JP2009152494 A5 JP 2009152494A5 JP 2007330988 A JP2007330988 A JP 2007330988A JP 2007330988 A JP2007330988 A JP 2007330988A JP 2009152494 A5 JP2009152494 A5 JP 2009152494A5
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JP
Japan
Prior art keywords
heat sink
recess
semiconductor package
area
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007330988A
Other languages
English (en)
Japanese (ja)
Other versions
JP5153316B2 (ja
JP2009152494A (ja
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Publication date
Application filed filed Critical
Priority to JP2007330988A priority Critical patent/JP5153316B2/ja
Priority claimed from JP2007330988A external-priority patent/JP5153316B2/ja
Priority to KR1020080129029A priority patent/KR20090068140A/ko
Priority to US12/339,725 priority patent/US20090183855A1/en
Priority to CN2008101864797A priority patent/CN101465329B/zh
Publication of JP2009152494A publication Critical patent/JP2009152494A/ja
Publication of JP2009152494A5 publication Critical patent/JP2009152494A5/ja
Application granted granted Critical
Publication of JP5153316B2 publication Critical patent/JP5153316B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007330988A 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法 Active JP5153316B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007330988A JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法
KR1020080129029A KR20090068140A (ko) 2007-12-21 2008-12-18 반도체 패키지용 방열판 및 그 도금 방법
US12/339,725 US20090183855A1 (en) 2007-12-21 2008-12-19 Heat radiating plate for semiconductor package and plating method thereof
CN2008101864797A CN101465329B (zh) 2007-12-21 2008-12-19 半导体封装用的散热板以及该散热板的电镀方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007330988A JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法

Publications (3)

Publication Number Publication Date
JP2009152494A JP2009152494A (ja) 2009-07-09
JP2009152494A5 true JP2009152494A5 (enExample) 2011-01-13
JP5153316B2 JP5153316B2 (ja) 2013-02-27

Family

ID=40805811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007330988A Active JP5153316B2 (ja) 2007-12-21 2007-12-21 半導体パッケージ用放熱板およびそのめっき方法

Country Status (4)

Country Link
US (1) US20090183855A1 (enExample)
JP (1) JP5153316B2 (enExample)
KR (1) KR20090068140A (enExample)
CN (1) CN101465329B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011144249A1 (en) * 2010-05-21 2011-11-24 Nokia Siemens Networks Oy Method and device for thermally coupling a heat sink to a component
CN102299127B (zh) * 2011-07-13 2013-12-11 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法
EP3361500B1 (en) * 2015-10-05 2021-04-21 Mitsubishi Electric Corporation Electronic control device
CN110648987B (zh) * 2019-10-11 2022-09-06 宁波施捷电子有限公司 一种界面导热材料层及其用途
CN114823573B (zh) * 2022-06-24 2022-09-09 威海市泓淋电力技术股份有限公司 一种散热型封装结构及其形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065699B2 (ja) * 1987-09-16 1994-01-19 日本電気株式会社 半導体装置
US5482898A (en) * 1993-04-12 1996-01-09 Amkor Electronics, Inc. Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding
US6461891B1 (en) * 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
JP2001308215A (ja) * 2000-04-24 2001-11-02 Ngk Spark Plug Co Ltd 半導体装置
US6282096B1 (en) * 2000-04-28 2001-08-28 Siliconware Precision Industries Co., Ltd. Integration of heat conducting apparatus and chip carrier in IC package
JP4421118B2 (ja) * 2001-01-05 2010-02-24 富士通マイクロエレクトロニクス株式会社 半導体装置製造方法
JP3841768B2 (ja) * 2003-05-22 2006-11-01 新光電気工業株式会社 パッケージ部品及び半導体パッケージ
JP3809168B2 (ja) * 2004-02-03 2006-08-16 株式会社東芝 半導体モジュール
CN101379612B (zh) * 2006-02-24 2014-07-09 富士通株式会社 半导体装置
JP5113346B2 (ja) * 2006-05-22 2013-01-09 日立電線株式会社 電子装置用基板およびその製造方法、ならびに電子装置およびその製造方法

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