DE602005016337D1 - Trennfolie für die Einkapselung von Halbleiterchips - Google Patents

Trennfolie für die Einkapselung von Halbleiterchips

Info

Publication number
DE602005016337D1
DE602005016337D1 DE200560016337 DE602005016337T DE602005016337D1 DE 602005016337 D1 DE602005016337 D1 DE 602005016337D1 DE 200560016337 DE200560016337 DE 200560016337 DE 602005016337 T DE602005016337 T DE 602005016337T DE 602005016337 D1 DE602005016337 D1 DE 602005016337D1
Authority
DE
Germany
Prior art keywords
encapsulation
semiconductor chips
release film
chips
release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560016337
Other languages
English (en)
Inventor
Seitoku Kaya
Yuki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of DE602005016337D1 publication Critical patent/DE602005016337D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE200560016337 2004-06-29 2005-06-13 Trennfolie für die Einkapselung von Halbleiterchips Active DE602005016337D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191258 2004-06-29

Publications (1)

Publication Number Publication Date
DE602005016337D1 true DE602005016337D1 (de) 2009-10-15

Family

ID=35057114

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560016337 Active DE602005016337D1 (de) 2004-06-29 2005-06-13 Trennfolie für die Einkapselung von Halbleiterchips

Country Status (5)

Country Link
EP (1) EP1612021B1 (de)
CN (1) CN100471672C (de)
DE (1) DE602005016337D1 (de)
SG (1) SG118414A1 (de)
TW (1) TWI393621B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5234419B2 (ja) 2006-04-25 2013-07-10 旭硝子株式会社 半導体樹脂モールド用離型フィルム
WO2013094752A1 (ja) * 2011-12-22 2013-06-27 ダイキン工業株式会社 離型フィルム
US9455160B2 (en) 2013-01-14 2016-09-27 Infineon Technologies Ag Method for fabricating a semiconductor chip panel
US9287472B2 (en) 2013-06-27 2016-03-15 Nichia Corporation Light emitting device and method of manufacturing the same
TWI656972B (zh) * 2014-03-07 2019-04-21 日商Ａｇｃ股份有限公司 脫模膜及密封體之製造方法
US10196576B2 (en) * 2015-01-17 2019-02-05 Eagle Industry Co., Ltd. Water lubrication type bearing material
CN105172292A (zh) * 2015-09-15 2015-12-23 蚌埠冠宜型材科技有限公司 一种铸造用薄膜
KR20210021466A (ko) 2018-06-22 2021-02-26 가부시키가이샤 고바야시 이형 필름 및 이형 필름의 제조 방법
CN109591232B (zh) * 2018-11-23 2020-04-07 中国科学院大连化学物理研究所 一种燃料电池用双极板的脱模方法及其应用
KR102601956B1 (ko) * 2019-03-28 2023-11-13 미쓰이 가가쿠 토세로 가부시키가이샤 프린트 배선기판 제조공정용 이형필름, 프린트 기판의 제조방법, 프린트 기판 제조장치 및 프린트 기판

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1375134B1 (de) 1999-08-31 2004-10-20 Mitsubishi Plastics Inc. Trennbare Mehrschichtfolie
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP4443715B2 (ja) * 1999-12-27 2010-03-31 日東電工株式会社 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム
JP3935314B2 (ja) 2000-10-18 2007-06-20 三菱樹脂株式会社 転写用フッ素樹脂積層フィルム
JP3791458B2 (ja) 2002-05-23 2006-06-28 旭硝子株式会社 離型フィルム

Also Published As

Publication number Publication date
EP1612021A1 (de) 2006-01-04
SG118414A1 (en) 2006-01-27
TW200615107A (en) 2006-05-16
TWI393621B (zh) 2013-04-21
CN100471672C (zh) 2009-03-25
EP1612021B1 (de) 2009-09-02
CN1715046A (zh) 2006-01-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition