SG118414A1 - Release film for encapsulation of semiconductor c hip - Google Patents

Release film for encapsulation of semiconductor c hip

Info

Publication number
SG118414A1
SG118414A1 SG200504111A SG200504111A SG118414A1 SG 118414 A1 SG118414 A1 SG 118414A1 SG 200504111 A SG200504111 A SG 200504111A SG 200504111 A SG200504111 A SG 200504111A SG 118414 A1 SG118414 A1 SG 118414A1
Authority
SG
Singapore
Prior art keywords
hip
encapsulation
semiconductor
release film
release
Prior art date
Application number
SG200504111A
Other languages
English (en)
Inventor
Kaya Seitoku
Fujimoto Yuki
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of SG118414A1 publication Critical patent/SG118414A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG200504111A 2004-06-29 2005-06-27 Release film for encapsulation of semiconductor c hip SG118414A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191258 2004-06-29

Publications (1)

Publication Number Publication Date
SG118414A1 true SG118414A1 (en) 2006-01-27

Family

ID=35057114

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200504111A SG118414A1 (en) 2004-06-29 2005-06-27 Release film for encapsulation of semiconductor c hip

Country Status (5)

Country Link
EP (1) EP1612021B1 (de)
CN (1) CN100471672C (de)
DE (1) DE602005016337D1 (de)
SG (1) SG118414A1 (de)
TW (1) TWI393621B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG171589A1 (en) 2006-04-25 2011-06-29 Asahi Glass Co Ltd Release film for semiconductor resin molds
CN103917347A (zh) * 2011-12-22 2014-07-09 大金工业株式会社 离型膜
US9455160B2 (en) * 2013-01-14 2016-09-27 Infineon Technologies Ag Method for fabricating a semiconductor chip panel
US9287472B2 (en) 2013-06-27 2016-03-15 Nichia Corporation Light emitting device and method of manufacturing the same
MY182272A (en) * 2014-03-07 2021-01-18 Agc Inc Mold release film and process for producing sealed body
US10196576B2 (en) * 2015-01-17 2019-02-05 Eagle Industry Co., Ltd. Water lubrication type bearing material
CN105172292A (zh) * 2015-09-15 2015-12-23 蚌埠冠宜型材科技有限公司 一种铸造用薄膜
SG11202012852TA (en) 2018-06-22 2021-01-28 Kobayashi & Co Ltd Release film and method of manufacturing release film
WO2019244448A1 (ja) 2018-06-22 2019-12-26 株式会社コバヤシ 離型フィルム及び離型フィルムの製造方法
CN109591232B (zh) * 2018-11-23 2020-04-07 中国科学院大连化学物理研究所 一种燃料电池用双极板的脱模方法及其应用
KR102601956B1 (ko) * 2019-03-28 2023-11-13 미쓰이 가가쿠 토세로 가부시키가이샤 프린트 배선기판 제조공정용 이형필름, 프린트 기판의 제조방법, 프린트 기판 제조장치 및 프린트 기판

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6790510B1 (en) 1999-08-31 2004-09-14 Mitsubishi Plastics, Inc. Releasing laminated film
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP4443715B2 (ja) * 1999-12-27 2010-03-31 日東電工株式会社 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム
JP3935314B2 (ja) 2000-10-18 2007-06-20 三菱樹脂株式会社 転写用フッ素樹脂積層フィルム
JP3791458B2 (ja) 2002-05-23 2006-06-28 旭硝子株式会社 離型フィルム

Also Published As

Publication number Publication date
DE602005016337D1 (de) 2009-10-15
TW200615107A (en) 2006-05-16
TWI393621B (zh) 2013-04-21
CN1715046A (zh) 2006-01-04
EP1612021A1 (de) 2006-01-04
EP1612021B1 (de) 2009-09-02
CN100471672C (zh) 2009-03-25

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