JP2009151306A - マスクのペリクル除去装置および方法 - Google Patents
マスクのペリクル除去装置および方法 Download PDFInfo
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- JP2009151306A JP2009151306A JP2008322017A JP2008322017A JP2009151306A JP 2009151306 A JP2009151306 A JP 2009151306A JP 2008322017 A JP2008322017 A JP 2008322017A JP 2008322017 A JP2008322017 A JP 2008322017A JP 2009151306 A JP2009151306 A JP 2009151306A
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 7
- 238000000206 photolithography Methods 0.000 claims description 5
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract description 20
- 238000011109 contamination Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/919—Delaminating in preparation for post processing recycling step
- Y10S156/922—Specified electronic component delaminating in preparation for recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
- Y10S156/935—Delaminating means in preparation for post consumer recycling
- Y10S156/937—Means for delaminating specified electronic component in preparation for recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】装置は、ペリクルを備えるマスク操作用の少なくとも1つの把手部と、圧力を印加されてマスクの縁に係合する、少なくとも2つの固定部材と、ペリクルの径方向外縁部に形成されるマウントの位置を非接触に判断する少なくとも1つの検出器と、材料親和性によりマスク1にペリクルを固定する接着剤を加熱する加熱装置と、マスク固定ユニットおよびペリクル除去ユニット5を有するペリクルの除去装置とを、備える。
【選択図】図5
Description
2 ペリクル
2.1 マウント
3 把手部
3.1 固定部材
3.2 保持部材
3.3 バネ
3.4 駆動部
3.5 レバー・トランスミッション
3.6 偏心器
4 検出器
5 ペリクル除去ユニット
5.1 スパイク
5.2 除去駆動部
5.3 駆動部
Claims (18)
- フォトリソグラフィ用途に使用可能なマスクからペリクルを除去する装置であって、
印加された圧力によってマスク(1)の縁部と係合される少なくとも2つの固定部材を有し、ペリクル(2)を備えるマスク(1)を操作するための少なくとも1つの把手部(3)と、
ペリクル(2)の径方向外縁部に形成されるマウント(2.1)の位置を、非接触に判断するための少なくとも1つの検出器(4)と、
材料親和性(stoffschlussig)によりペリクル(2)をマスク(1)に固定する接着剤を加熱する加熱装置と、
マスク固定ユニットとペリクル除去ユニット(5)を有する、マスク(1)からのペリクル(2)の除去装置を備えることを特徴とする装置。 - 前記把手部(3)の固定部材は、引張バネによって事前に圧縮応力を加えられ、把手部(3)は、把手部により保持されたマスク(1)を解放するため、レバー・トランスミッション(3.5)または偏心器(3.6)を有して固定部材(3.1)と係合する駆動部を備えることを特徴とする請求項1に記載の装置。
- 前記固定部材(3.1)はマスク(1)の3箇所(3.2)と係合することを特徴とする請求項1または2に記載の装置。
- 前記ペリクル除去ユニット(5)は、ペリクル外縁部に備えられる各マウント(2.1)用のスパイク(5.1)を有し、該スパイク(5.1)は各マウント(2.1)に導入可能であって、ペリクル(2)のフレームの各マウント(2.1)に牽引力を作用させて、マスク(1)からペリクル(2)を分離させることを特徴とする請求項1から3の内のいずれか1項に記載の装置。
- 前記ペリクル除去ユニット(5)は、マウント(2.1)に導入可能な4つのスパイク(5.1)に作用し、マスク(1)からペリクル(2)を分離させる前記牽引力を加える除去駆動部(5.2)を備えることを特徴とする請求項1から4の内のいずれか1項に記載の装置。
- 前記除去駆動部(5.2)の内の1つは、他の3つの除去駆動部(5.2)より大きい牽引力効果を有することを特徴とする請求項5に記載の装置。
- 前記導入可能なスパイク(5.1)は、2軸の駆動部(5.3)によって直線に移動可能であって、これら2軸によって事前に設定される面に直交する軸上に垂直に調整可能であることを特徴とする請求項5または6に記載の装置。
- 前記加熱装置は、マスク(1)の下側に電磁波を放射することを特徴とする請求項1から7の内のいずれか1項に記載の装置。
- 前記検出器(4)は画像処理機能を有するビデオカメラで構成されることを特徴とする請求項1から8の内のいずれか1項に記載の装置。
- フォトリソグラフィ用途に使用可能なマスクからペリクルを除去する方法であって、
ペリクル(2)を備えるマスク(1)を、把手部(3)を用いて検出器(4)に対して位置決めし、
各ペリクル(2)の径方向外縁部に設置されたマウント(2.1)の位置を検出器(4)で検出し、
前記マスク(1)とペリクル(2)が固定されるペリクル除去ユニット(5)に、前記マスク(1)を供給し、
導入可能なスパイク(5.1)を、ペリクル(2)の前記検出されたマウント(2.1)の位置に合わせるように移動して、該スパイク(5.1)をマウント(2.1)に導入し、
材料親和性によりペリクル(2)をマスク(1)に結合させる接着剤を軟化させるため、マスク(1)を加熱装置で加熱し、
マスク(1)をマスク固定ユニットで保持した状態で、マスク温度を上昇させて、ペリクル(2)がマスク(1)から分離するまで、牽引力を前記導入可能なスパイク(5.1)を介して該ペリクル(2)に印加することを特徴とする方法。 - 導入可能なスパイク(5.1)を介してペリクル(2)に印加される前記牽引力を、該ペリクル(2)が分離するまで連続的に増加することを特徴とする請求項10に記載の方法。
- 前記牽引力は前記マスク(1)の面に対して垂直に印加されることを特徴とする請求項10または11に記載の方法。
- 前記牽引力を段階的に増加し、各段階毎に保持時間を観測することを特徴とする請求項10から12の内のいずれか1項に記載の方法。
- ペリクル(2)を分離する際に、1つの導入可能なスパイク(5.1)に他のスパイク(5.1)より大きい牽引力を作用させることを特徴とする請求項10から13の内のいずれか1項に記載の方法。
- 前記牽引力の増加は、所定の牽引力値および/または所定のマスク温度に達した後、有効になることを特徴とする請求項14に記載の方法。
- 前記マスク(1)のペリクル分離手順において、前記牽引力および/またはトルクを測定することを特徴とする請求項10から15の内のいずれか1項に記載の方法。
- 前記ペリクル(2)の径方向外縁部に設置される少なくとも1つのマウント(2.1)の位置を非接触に前記検出器(4)によって判断し、この方法で判断されたマウント(2.1)の位置を考慮して、前記導入可能なスパイク(5.1)の前記ペリクル(2)のマウント(2.1)への導入を3軸の駆動部によって制御することを特徴とする請求項10から16の内のいずれか1項に記載の方法。
- 前記マスク(1)を、前記把手部(3)の前記固定部材(3.1)を用いて、バネの牽引力効果のみによって保持し、前記固定部材(3.1)と係合する駆動部(3.4)を固定の解除時にのみ有効にすることを特徴とする請求項10から17の内のいずれか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007063383.3A DE102007063383B4 (de) | 2007-12-18 | 2007-12-18 | Vorrichtung und Verfahren zur Entfernung von Pelliclen von Masken |
DE102007063383.3 | 2007-12-18 |
Publications (2)
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JP2009151306A true JP2009151306A (ja) | 2009-07-09 |
JP5498691B2 JP5498691B2 (ja) | 2014-05-21 |
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JP2008322017A Active JP5498691B2 (ja) | 2007-12-18 | 2008-12-18 | マスクのペリクル除去装置および方法 |
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Country | Link |
---|---|
US (1) | US8168036B2 (ja) |
JP (1) | JP5498691B2 (ja) |
KR (1) | KR20090066226A (ja) |
CN (1) | CN101464626B (ja) |
DE (1) | DE102007063383B4 (ja) |
TW (1) | TWI454838B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009154407A (ja) * | 2007-12-27 | 2009-07-16 | Tdk Corp | 剥離装置、剥離方法および情報記録媒体製造方法 |
JP4879308B2 (ja) * | 2009-10-29 | 2012-02-22 | 信越化学工業株式会社 | ペリクル剥離用冶具および剥離方法 |
CH703815A1 (de) | 2010-09-16 | 2012-03-30 | Hsr Hochschule Fuer Technik Rapperswil | Kniescheibengreifer, Gerät zum Bewegen einer Kniescheibe und Verfahren zum Einstellen des Geräts zum Bewegen einer Kniescheibe. |
CN102719860B (zh) * | 2011-03-31 | 2015-04-15 | 昆山思拓机器有限公司 | 金属掩膜板剥离装置 |
ITFI20120233A1 (it) * | 2012-10-29 | 2014-04-30 | Esanastri S R L | Dispositivo di micro-sfridatura di film plastici o in carta a uno o più strati autoadesivi, biadesivizzati o elettrostatici accoppiati con un liner di supporto antiaderente |
US11183410B2 (en) * | 2017-04-24 | 2021-11-23 | Photronics, Inc. | Pellicle removal tool |
US11143952B2 (en) * | 2017-09-28 | 2021-10-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle removal method |
KR20210129663A (ko) * | 2019-02-28 | 2021-10-28 | 에이에스엠엘 네델란즈 비.브이. | 레티클 조립체의 조립을 위한 장치 |
CN110039880A (zh) * | 2019-04-19 | 2019-07-23 | 董代军 | 一种电梯保护膜撕除辅助装置 |
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2007
- 2007-12-18 DE DE102007063383.3A patent/DE102007063383B4/de not_active Expired - Fee Related
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2008
- 2008-12-09 US US12/330,652 patent/US8168036B2/en active Active
- 2008-12-10 TW TW097147941A patent/TWI454838B/zh active
- 2008-12-16 KR KR1020080127731A patent/KR20090066226A/ko not_active Application Discontinuation
- 2008-12-18 CN CN2008101881311A patent/CN101464626B/zh not_active Expired - Fee Related
- 2008-12-18 JP JP2008322017A patent/JP5498691B2/ja active Active
Patent Citations (4)
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JPH06175356A (ja) * | 1992-12-11 | 1994-06-24 | Nikon Corp | ペリクル剥離装置 |
US5976307A (en) * | 1998-03-13 | 1999-11-02 | Dupont Photomasks, Inc. | Method and apparatus for removing a pellicle frame from a photomask plate |
JP2005175413A (ja) * | 2003-11-18 | 2005-06-30 | Tokyo Seimitsu Co Ltd | 搬送システム及び搬送方法 |
JP2007304491A (ja) * | 2006-05-15 | 2007-11-22 | Shin Etsu Chem Co Ltd | ペリクルおよびペリクル剥離装置 |
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CN101464626A (zh) | 2009-06-24 |
US8168036B2 (en) | 2012-05-01 |
KR20090066226A (ko) | 2009-06-23 |
TWI454838B (zh) | 2014-10-01 |
TW200931173A (en) | 2009-07-16 |
US20090239156A1 (en) | 2009-09-24 |
JP5498691B2 (ja) | 2014-05-21 |
DE102007063383B4 (de) | 2020-07-02 |
CN101464626B (zh) | 2012-11-07 |
DE102007063383A1 (de) | 2009-06-25 |
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