JP2009130146A5 - - Google Patents
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- Publication number
- JP2009130146A5 JP2009130146A5 JP2007303888A JP2007303888A JP2009130146A5 JP 2009130146 A5 JP2009130146 A5 JP 2009130146A5 JP 2007303888 A JP2007303888 A JP 2007303888A JP 2007303888 A JP2007303888 A JP 2007303888A JP 2009130146 A5 JP2009130146 A5 JP 2009130146A5
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- electronic device
- panel
- base plate
- storage box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 100
- 238000003860 storage Methods 0.000 claims description 83
- 230000002093 peripheral Effects 0.000 claims description 44
- 239000011162 core material Substances 0.000 claims description 37
- 239000006096 absorbing agent Substances 0.000 claims description 36
- 238000009423 ventilation Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 229920001971 elastomer Polymers 0.000 claims description 19
- 239000000835 fiber Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 33
- 229910000838 Al alloy Inorganic materials 0.000 description 30
- 210000000088 Lip Anatomy 0.000 description 18
- 206010063832 Electromagnetic interference Diseases 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 9
- 239000003973 paint Substances 0.000 description 9
- 238000009434 installation Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001965 increased Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000001681 protective Effects 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000006258 conductive agent Substances 0.000 description 3
- 230000000875 corresponding Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229920000180 Alkyd Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 240000006614 Hericium coralloides Species 0.000 description 1
- 210000001503 Joints Anatomy 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 210000003660 Reticulum Anatomy 0.000 description 1
- 210000002356 Skeleton Anatomy 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N TiO Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium(0) Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 230000000903 blocking Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229920000591 gum Polymers 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910000529 magnetic ferrite Inorganic materials 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910001929 titanium oxide Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007303888A JP5023996B2 (ja) | 2007-11-26 | 2007-11-26 | 電子機器収納箱および電子機器試験箱 |
PCT/JP2008/064839 WO2009069347A1 (ja) | 2007-11-26 | 2008-08-20 | 熱交換器および電子機器収納箱並びに電子機器試験箱 |
CN201210001635.4A CN102573419B (zh) | 2007-11-26 | 2008-08-20 | 热交换器 |
CN200880117775XA CN101874430B (zh) | 2007-11-26 | 2008-08-20 | 热交换器、电子设备收纳箱和电子设备试验箱 |
TW102110189A TWI468102B (zh) | 2007-11-26 | 2008-11-07 | Heat exchanger |
TW97143023A TWI402033B (zh) | 2007-11-26 | 2008-11-07 | Heat exchangers, electronic equipment storage boxes and electronic equipment test chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007303888A JP5023996B2 (ja) | 2007-11-26 | 2007-11-26 | 電子機器収納箱および電子機器試験箱 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012033730A Division JP5321705B2 (ja) | 2012-02-20 | 2012-02-20 | 熱交換器 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009130146A JP2009130146A (ja) | 2009-06-11 |
JP2009130146A5 true JP2009130146A5 (zh) | 2012-04-05 |
JP5023996B2 JP5023996B2 (ja) | 2012-09-12 |
Family
ID=40678255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007303888A Expired - Fee Related JP5023996B2 (ja) | 2007-11-26 | 2007-11-26 | 電子機器収納箱および電子機器試験箱 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5023996B2 (zh) |
CN (2) | CN102573419B (zh) |
TW (2) | TWI402033B (zh) |
WO (1) | WO2009069347A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5321705B2 (ja) * | 2012-02-20 | 2013-10-23 | 日本軽金属株式会社 | 熱交換器 |
CN103429058A (zh) * | 2013-07-26 | 2013-12-04 | 昆山维金五金制品有限公司 | 一种散热鳍片 |
CN103732043A (zh) * | 2013-12-23 | 2014-04-16 | 苏州宏泉高压电容器有限公司 | 散热器 |
CN108054104B (zh) * | 2018-01-22 | 2024-04-26 | 东莞领杰金属精密制造科技有限公司 | 3c产品颗粒小件自动化贴微小辅料组装设备 |
CN112005073B (zh) * | 2018-04-23 | 2022-03-29 | 三菱动力株式会社 | 热交换器 |
DE102018215434A1 (de) * | 2018-09-11 | 2020-03-12 | Convotherm-Elektrogeräte Gmbh | Gargerät |
CN111654006B (zh) * | 2020-06-04 | 2022-06-14 | Oppo(重庆)智能科技有限公司 | 一种环境试验箱控制方法、装置及计算机可读存储介质 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639505Y2 (ja) * | 1987-04-01 | 1994-10-12 | 昭和アルミニウム株式会社 | 密閉式制御盤に取り付けられる熱交換器 |
JPH0247098U (zh) * | 1988-09-27 | 1990-03-30 | ||
JPH0476994A (ja) * | 1990-07-18 | 1992-03-11 | Mitsubishi Electric Corp | 電子機器の冷却構造体 |
JP3364764B2 (ja) * | 1993-09-13 | 2003-01-08 | アクトロニクス株式会社 | 密閉機器筐体冷却装置 |
JPH07106640A (ja) * | 1993-10-04 | 1995-04-21 | Nippondenso Co Ltd | 熱電冷却装置 |
JP3303588B2 (ja) * | 1995-03-29 | 2002-07-22 | 三菱電機株式会社 | 制御盤 |
JP2001245408A (ja) * | 2000-02-29 | 2001-09-07 | Mori Seiki Co Ltd | 制御盤 |
JP2001267774A (ja) * | 2000-03-23 | 2001-09-28 | Furukawa Electric Co Ltd:The | 機器収納用筐体 |
JP4324312B2 (ja) * | 2000-07-04 | 2009-09-02 | 株式会社森精機製作所 | 制御盤の冷却構造 |
-
2007
- 2007-11-26 JP JP2007303888A patent/JP5023996B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-20 CN CN201210001635.4A patent/CN102573419B/zh not_active Expired - Fee Related
- 2008-08-20 CN CN200880117775XA patent/CN101874430B/zh not_active Expired - Fee Related
- 2008-08-20 WO PCT/JP2008/064839 patent/WO2009069347A1/ja active Application Filing
- 2008-11-07 TW TW97143023A patent/TWI402033B/zh not_active IP Right Cessation
- 2008-11-07 TW TW102110189A patent/TWI468102B/zh not_active IP Right Cessation
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