JP2009129642A - Led illumination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress temperature elevation of an LED light source by arranging that the LED illumination device using the LED as a light source has a highly heat dissipating structure, and thus provide the LED illumination device in which increase of illumination light amount is made possible since reduction of emission efficiency of the LED light source is suppressed while securing high reliability by prolongation of service life coping with large power output of the LED light source. <P>SOLUTION: The LED illumination device 1 is constituted of a lamp body part 2 having the LED light source and a water-cooled jacket to cool the LED light source, and a heat dissipating mechanism part 30 to cool a refrigerant liquid that receives the heat from the LED light source. The heat generated during a lighting time of the LED light source is received by the refrigerant liquid in the water-cooled jacket via the water-cooled jacket, the refrigerant liquid that receives the heat is heat-dissipated and cooled in the radiator 31, and a water-cooled refrigerant liquid circulation system is formed in which the cooled refrigerant liquid is made to return to the water-cooled jacket again. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a water-cooled LED illumination device using an LED as a light source.

  At present, proposals have been made to use a semiconductor light emitting device (for example, an LED) as a light source in place of a conventional discharge lamp such as a xenon lamp or a sodium lamp as a light source for an illumination device such as a vehicle headlamp or an outdoor lamp. ing.

  Since discharge lamps such as xenon lamps and sodium lamps have high electro-optical conversion efficiency (hereinafter referred to as light conversion efficiency), the light emission output (hereinafter referred to as output) is high, and a large amount of irradiation light is required. It is an excellent light source in the lighting device, but life, emission color (limited to the emission spectrum unique to inert gas), output stability (it takes time from the start of lighting until the output stabilizes), etc. It also has many problems.

  In that respect, the LED has many advantages such as long life, generation of white light, and instantaneous lighting, although the light conversion efficiency is inferior to that of the discharge lamp. However, the LED also has a characteristic that acts disadvantageously for use in that the light conversion efficiency is lowered and the life is shortened due to the temperature rise. Specifically, the lifetime of the LED depends on the semiconductor material, but there is also a characteristic that the LED temperature is reduced by about half when the LED temperature rises by 10 ° C, and the light conversion efficiency is 100% when the LED temperature is 25 ° C. It is known that when the temperature of the LED exceeds 100 ° C., it decreases to about 90%, and when it exceeds 150 ° C., it decreases to about 70%.

  Therefore, when driving the LED with high power (large current) to increase the output of the LED, heat dissipation means is employed so that the light conversion efficiency is not lowered and the life is not shortened due to self-heating when the LED is turned on. It is necessary to suppress the temperature rise of the LED by applying. Conventionally, as a heat dissipation means for increasing the power of an LED, it has been attempted to improve the heat dissipation of an LED light source module in which an LED serving as a light source is mounted on a substrate.

  As a result, an LED light source module that can supply power of 10 W or more to the mounted LED has also been proposed. By using the LED light source module, the LED driving current can be reduced during the last 10 years. It has become possible to increase from several tens of mA to several hundred mA.

  In order to further increase the output of the LED light source, it is necessary to further improve the heat dissipation of the LED light source module and to optimize the semiconductor material constituting the LED chip serving as the light source. In addition, for an LED of a type that generates white light by a combination of an LED chip and a fluorescent material, improvement in wavelength conversion efficiency of the fluorescent material is also an important factor for increasing the output of the LED light source.

  FIG. 11 shows a conventional lighting device in consideration of the problem of heat generation of the LED light source. The configuration is such that an LED mounting substrate 51 on which a plurality of LEDs 50 are mounted is pressed and fixed to a heat dissipation fixing plate 52 made of metal by a heat dissipation cover 53 made of metal, and the heat dissipation fixing plate 52 to which the LED mounting substrate 51 is fixed is transparent. It is disposed in a sealed space 56 formed by the light cover 54 and the resin case 55.

  A plurality of heat radiating fins 57 are formed on the lower surface of the heat radiating fixing plate 52, and the heat radiating fins 57 are integrated with the resin case 55 so as to be embedded in the bottom of the resin case 55.

At this time, the heat generated in the LED 50 is conducted to the heat radiating fixing plate 52 through the LED mounting substrate 51 and is conducted to the heat radiating fixing plate 52 through the heat radiating cover 53, and the heat conducted to the heat radiating fixing plate 52 is The heat radiation fins 57 are conducted to the resin at the bottom of the resin case 55 and are diffused to the outside from the surface of the resin. (For example, refer to Patent Document 1).
JP 2002-299700 A

  By the way, the LED is composed of one or a plurality of LED chips. In any case, the amount of emitted light is smaller than that of the conventional lamp described above, and the LED is used to obtain the same amount of light as the conventional lamp. It is necessary to arrange a plurality.

  In that case, problems such as an increase in the size of the lamp and an increase in manufacturing cost will occur. To avoid this, the light output is increased by increasing the power of the LED, and the light source is configured with as few LEDs as possible. Is required.

  By the way, when the LED is turned on at room temperature of 25 ° C., if the thermal resistance of the LED light source module is 2.5 ° C./W and the thermal resistance of the radiator on which the LED light source module is mounted is 5 ° C./W, The temperature of the LED when the power consumption is about 10 W is about 100 ° C.

  Therefore, as a heat dissipation measure for suppressing the temperature rise of the LED, the method of naturally cooling the resin integrated on the heat dissipation fixing plate as described above makes the structure of the lamp very simple and 10 W / ( LED power source module) power dissipation effect is good, but since the heat dissipation performance is almost determined by the surface area of the heat dissipation fin and the thermal conductivity of the resin, heat dissipation to cope with further increase in power consumption of the LED. If it is going to improve performance, the enlargement and weight of a heat-radiating fixing plate (including heat-dissipating fins) cannot be avoided, and the thermal conductivity of the resin hinders improvement of the heat-radiating performance.

  In addition, in order to drive an LED with high power, for example, electronic components for driving the LED, such as transistors, ICs, resistors, etc., also generate a large amount of heat. There is a need to consider. Therefore, it is conceivable that the electronic component mounting circuit board on which the electronic components are mounted is separated from the lamp housing the LED mounting board and the cooling means is individually provided. However, in that case, the entire lighting device is further increased in size. Become.

As described above, the problem of the natural cooling and heat dissipation structure in the conventional LED lighting device is
(1) Since the heat dissipation performance is determined by the surface area of the heat dissipation member (heat sink), an increase in heat dissipation performance results in an increase in size and weight.
(2) The thermal conductivity of the resin hinders improvement in heat dissipation performance.
(3) The heat dissipation performance is limited to about 10 W / (LED light source module), and it is difficult to cope with further increase in power.
(4) It is necessary to provide heat dissipation means separately from the LED in the electronic component that drives the LED.
(Some electronic components have a guaranteed operating temperature lower than that of LEDs.)

  Therefore, the present invention was devised in view of the above problems, and the object of the present invention is to suppress the temperature rise of the LED light source by making the LED illumination device using the LED as a light source a highly heat-radiating structure, Accordingly, it is an object of the present invention to provide an LED lighting device capable of increasing the amount of irradiation light while suppressing the decrease in the light emission efficiency of the LED light source while ensuring high reliability due to the long life in increasing the power of the LED light source.

  In order to solve the above-mentioned problem, the invention described in claim 1 of the present invention comprises at least an LED light source and a water cooling jacket for cooling the LED light source in a closed space formed by a cover lens and a housing. It comprises a lamp body, a water cooling jacket, a radiator having a cooling fan, a circulation pump, and a heat dissipating mechanism section in which a refrigerant liquid is sealed in a circulation path in which a tank is annularly connected by a pipe. Is.

  According to a second aspect of the present invention, in the first aspect, the LED light source is mounted on a substrate provided with a wiring pattern to form an LED light source module. One of the LED light source modules The above is arranged on the surface of the water cooling jacket on the cover lens side.

  According to a third aspect of the present invention, in the first aspect, the water cooling jacket is provided with a wiring pattern on the surface on the cover lens side, and one or more surfaces are provided on the surface on which the wiring pattern is provided. An LED light source is mounted.

  Further, in the invention described in claim 4 of the present invention, in any one of claims 1 and 2, the LED light source module is disposed on the water cooling jacket via a heat conductive base plate. It is characterized by.

  Further, in the invention described in claim 5 of the present invention, in claim 2, the surface of the water cooling jacket on the cover lens side has a polyhedral shape, and the surface of the polyhedron on the cover lens side is An LED light source module is provided.

  Further, in the invention described in claim 6 of the present invention, in claim 3, the surface on the cover lens side of the water cooling jacket has a polyhedral shape, and the surface of the polyhedron on the cover lens side has the surface. An LED light source is provided.

  The invention described in claim 7 of the present invention is the substrate according to any one of claims 2 to 6, wherein the substrate is one substrate selected from a metal substrate, a ceramic substrate, and a flexible substrate. It is characterized by.

  Moreover, the invention described in claim 8 of the present invention drives the LED light source on the surface of the water cooling jacket opposite to the side where the LED light source is located in any one of claims 2 to 6. An LED light source driving circuit module is provided.

  The LED lighting device of the present invention includes an LED light source and a lamp body having a water-cooling jacket that cools the LED light source, and a heat-dissipating mechanism that cools the refrigerant liquid that has received heat from the LED light source by the water-cooling jacket using a radiator. Then, the heat generated when the LED light source is turned on is received by the refrigerant liquid in the water cooling jacket through the water cooling jacket, and the received refrigerant liquid is dissipated and cooled by the radiator, and the cooled refrigerant liquid is again cooled by the water cooling jacket. A water-cooled refrigerant liquid circulation system is formed which is returned to

  As a result, the LED lighting device using the LED as a light source has a structure with high heat dissipation to suppress the temperature rise of the LED light source, and thus ensure high reliability by extending the life of the LED light source with high power. An LED illumination device capable of suppressing the decrease in light emission efficiency of the light source and increasing the amount of irradiation light has been realized.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. 1 to 10 (the same parts are denoted by the same reference numerals). The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention particularly limits the present invention in the following description. Unless stated to the effect, the present invention is not limited to these embodiments.

  The LED lighting device of the present invention includes an LED light source and a lamp body portion having a water cooling jacket for cooling the LED light source, and a heat radiation mechanism portion for cooling the refrigerant liquid that has received heat from the LED light source by the water cooling jacket with a radiator. It is. The heat generated when the LED light source is turned on is received by the refrigerant liquid in the water cooling jacket through the water cooling jacket, and the received refrigerant liquid is transported to the radiator by the circulation pump, and is dissipated by the cooling air from the cooling fan by the radiator. Then, the refrigerant liquid is forcibly cooled, and the cooled refrigerant liquid is returned to the water cooling jacket again.

  The above heat dissipation means suppresses the temperature rise when the LED light source is turned on. Therefore, even when driving a large current more than twice that of a normal natural air cooling type heat dissipation mechanism, the LED light source It is possible to realize an LED lighting device in which a decrease in light emission efficiency is suppressed and an irradiation light amount can be increased.

  FIG. 1 is an exploded three-dimensional view showing a lamp body according to a first embodiment relating to an LED lighting device including a lamp body and a heat dissipation mechanism, and FIG. 2 is a cross-sectional view of the lamp body. As shown in FIG. 1, the lamp body 2 of the LED lighting device 1 is an LED light source in which a cover lens 3, an LED (LED light source 4) and a connector 5 are mounted on a substrate 6 in order from the light irradiation direction to the opposite direction. The module 7, the heat conductive base plate 8, the water cooling jacket 9, the LED light source driving circuit module (including a constant current circuit) 10, and the housing 11 are located.

  2, the LED light source module 7 in which the LED light source 4 and the connector 5 are mounted on the substrate 6 in the closed space 12 formed by the cover lens 3 and the housing 11, the heat conductive base plate 8, the water cooling jacket 9, The LED light source drive circuit module 10 is accommodated.

  The LED light source is a white LED in which an LED chip is mounted on a material having high thermal conductivity, such as ceramic or copper, and is sealed with a sealing resin in which a fluorescent material is mixed, thereby achieving low thermal resistance.

  In addition, when not limiting to white LED, the light of various colors other than white light can be produced | generated by combining suitably the wavelength of the light radiate | emitted from an LED chip, and the kind of fluorescent material.

  As the substrate 6 on which the LED light source 4 is mounted, a rigid substrate or a flexible substrate is used. In the case of a rigid substrate, the base material is a material having good thermal conductivity, for example, a metal material or ceramic made mainly of copper, aluminum, or the like. A material is employed, and in the case of a flexible substrate, polyimide is employed as a base material.

  In a metal substrate, a wiring pattern is stuck on a base material with an insulating layer sandwiched. In a ceramic substrate, a wiring pattern is printed on a ceramic. On a flexible substrate, a wiring pattern is stuck on a polyimide. 4 and the region other than the region where the connector 5 is mounted are covered with a resist layer 18 (see the explanatory diagram showing the positional relationship among the LED light source module 7, the heat conductive base plate 8, and the water cooling jacket 9 in FIG. 3).

  As described above, in this embodiment, the LED is formed by the metal substrate provided with the wiring pattern, the LED light source mounted on the metal substrate, and the connector which is similarly mounted on the metal substrate and receives the driving power of the LED light source. A light source module is configured.

  2, the LED light source module is attached to a heat conductive base plate 8 made of a metal material such as copper or aluminum via an insulating heat conductive sheet 19 having elasticity made of a silicone resin or the like. Yes. The heat conductive base plate 8 corresponds to the shape and size of the insulating heat conductive sheet 19 in a region immediately below the LED light source 4 when the LED light source modules 7 on the side where the LED light source module 7 is attached. In addition, a digging portion 20 that is slightly shallower than the thickness of the insulating heat conductive sheet 19 is provided, and when the insulating heat conductive sheet 19 is arranged, the insulating heat conductive sheet 19 can be easily positioned by the digging portion 20. And it can be done accurately.

  And the part which protruded from the digging part 20 of the insulating heat conductive sheet 19 is pressed with the metal substrate 6 of the LED light source module 7, and this LED light source module 7 is attached to the heat conductive base plate 8, thereby insulating heat conduction. The metal substrate 6 on which the LED light source 4 is mounted and the heat conductive base plate 8 are integrally connected with the sheet 19 interposed therebetween.

  The cover lens 3 is located in the main light irradiation direction of the LED light source of the heat conductive base plate 8 to which the LED light source module is attached. At this time, the size of the light emitting surface of the LED light source 4 is relatively small with respect to the size of the cover lens 3, and the distance between the LED light sources 4 adjacent to each other is relative to the size of the light emitting surface of the LED light source 4. And relatively long. That is, the LED light source 4 can be regarded as a point light source roughly arranged with respect to the cover lens 3.

  For this reason, the cover lens 3 is provided with an independent lens cut portion 21 at a position corresponding to the LED light source 4 in the main light emission direction of each LED light source 4, and light emitted from each LED light source 4 corresponds to the cover lens 3. The light distribution is individually controlled by the individual lens cut portions 21. In the present embodiment, the lens cut portion 21 of the cover lens 3 is configured in a matrix shape having three matrix numbers in the vertical and horizontal directions, and the LED light source 4 is located at a position corresponding to each of the nine lens cut areas. ing.

  A water cooling jacket 9 is attached to the surface of the heat conductive base plate 8 opposite to the side where the LED light source module 7 is mounted, and the surfaces of the heat conductive base plate 8 and the water cooling jacket 9 are in surface contact with each other. Yes. The water cooling jacket 9 has a flat plate shape, and a hollow portion 22 serving as a flow path for the refrigerant liquid is formed therein, and the refrigerant received by the water cooling jacket 9 and the inlet 23a into which the refrigerant liquid cooled outside flows. A discharge port 23b for discharging the liquid is provided (see FIG. 1). The refrigerant liquid is a mixture of LLC in water at a predetermined ratio.

  The LED light source drive composed of electronic components and circuit components including a constant current power supply circuit for driving the LED light source 4 on the surface opposite to the side on which the thermally conductive base plate 8 is attached of the water cooling jacket 9 A circuit module 10 is attached, and the heat generated from the component when the LED light source 4 is driven is heated to the refrigerant liquid in the water-cooling jacket 9 to suppress the temperature rise of the component.

  A housing 11 is positioned in a direction in which the LED light source driving circuit module 10 of the water cooling jacket 9 is positioned. The LED light source module 7, the heat conductive base plate 8, the water cooling jacket 9, and the LED light source driving circuit module 10 are covered lenses. 3 and the housing 11 are accommodated in a closed space 12.

  At this time, two pipe joints 25a and 25b for pipe connection are attached to the housing 11, and one pipe joint 25a is connected to the inlet 23a of the water cooling jacket 9 and is routed in the closed space 12. The other pipe joint 25b is connected to the pipe 26b connected to the outlet 23b of the water cooling jacket 9 and routed in the closed space 12 (see FIG. 1).

  FIG. 4 is a perspective view of the first embodiment related to the LED lighting device including the lamp body and the heat dissipation mechanism. In addition, since it demonstrated in detail above about the lamp | ramp part which comprises LED lighting apparatus, description is abbreviate | omitted here and only demonstrates about a thermal radiation mechanism part below.

  The heat radiating mechanism 30 includes a radiator 31 that radiates the heat of the refrigerant liquid received by the water cooling jacket 9 to cool the refrigerant liquid, a cooling fan 32 that supplies cooling air to the radiator 31, and a circulation pump that circulates the refrigerant liquid. 33 and a reserve tank 34 for storing the refrigerant liquid, and the cooling fan 32 is disposed at a position facing the radiator 31.

  The pipe 26c connected to the pipe joint 25b connected to the refrigerant liquid outlet 23b of the water cooling jacket 9 via the pipe 26b is connected to the refrigerant liquid inlet 31a of the radiator 31, and the refrigerant liquid outlet 31b of the radiator 31. The pipe 26 d connected to the refrigerant pump is connected to the refrigerant liquid inlet 33 a of the circulation pump 33. A pipe 26 e connected to the refrigerant liquid outlet 33 b of the circulation pump 33 is connected to the refrigerant liquid inlet 34 a of the reserve tank 34, and a pipe 26 f connected to the refrigerant liquid outlet 34 b of the reserve tank 34 is the refrigerant of the water cooling jacket 9. It is connected to a pipe joint 25a connected to the liquid inlet 23a via a pipe 26a. Thereby, the water cooling jacket 9, the radiator 31, the circulation pump 33, and the reserve tank 34 are connected by the pipes 26a to 26f, and the refrigerant liquid is enclosed in the circulation path.

  In such a circulation path of the refrigerant liquid, the refrigerant liquid receives heat generated by the LED light source 4 by the water cooling jacket 9 to suppress the temperature rise of the LED light source 4, and the received refrigerant liquid is transported through the pipe 26c to be a radiator. 31. Then, heat is dissipated to the outside by the cooling air supplied from the cooling fan 32 by the radiator 31, cooled, transported through the pipes 26 d and 26 e, stored in the reserve tank 34 via the circulation pump 33, and piped from the reserve tank 34. 26 f is transported and sent to the water cooling jacket 9.

  FIG. 5 shows a natural air-cooled LED lighting apparatus having a heat sink 35 that also serves as a housing shown in FIG. It is the graph which compared both the thermal radiation effect as a comparative example. The temperatures measured for verifying the heat dissipation effect are the junction temperature Tj of the LED chip serving as the light source and the temperature Tp immediately below the LED light source mounted on the back surface of the substrate on which the LED light source is mounted. The junction temperature of the air-cooled LED lighting device is ATj, the substrate temperature is ATp, the junction temperature of the water-cooled LED lighting device of the embodiment is WTj, and the substrate temperature is WTp. The ambient temperature Ta is also measured at the same time.

  5, when a current of 0.7 A flows through the LED chip, the substrate temperature ATp of the comparative example is about 30 ° C. higher than the substrate temperature WTp of the example at that time, and the junction temperature ATj of the LED chip of the comparative example is also the example. This is about 30 ° C. higher than the junction temperature WTj of the LED chip. Further, the temperature increase rate of WTj is larger than the temperature increase rate of WTp. When a current of 1.4 A, twice 0.7A, is passed through the LED chip, the WTj at that time is substantially the same as ATj when a current of 0.7 A is passed through the LED chip.

  That is, even if a current twice as large as the current flowing through the LED chip of the natural air-cooled LED lighting device is passed through the LED chip of the water-cooled LED lighting device of the present invention, the water-cooled LED chip junction temperature WTj is the air-cooled type. The LED chip junction temperature ATj is almost equal to the temperature. At this time, the output of the LED chip of the water-cooled LED lighting device is 1.6 times or more the output of the LED chip of the natural air-cooled LED lighting device.

  Therefore, the water-cooled LED lighting device has a highly heat-dissipating structure. Therefore, the temperature rise of the LED chip serving as a light-emitting source is suppressed and reliability is ensured while ensuring reliability. It has been confirmed that it is possible to pass a current twice or more through the LED chip. As a result, the feasibility of a lighting device with a large amount of irradiation (bright) was verified while ensuring the reliability by extending the lifetime by increasing the power of the LED light source.

  FIG. 7 is an explanatory diagram illustrating the relationship between the LED light source module 7 and the water cooling jacket 9 according to the second embodiment. The second embodiment is different from the first embodiment in that the LED light source module 7 is directly attached to the water-cooling jacket 9 with a heat conductive adhesive (not shown) without using the heat conductive base plate 8. Other configurations are the same as those in the first embodiment. In this case, as the substrate 6 on which the LED light source 4 is mounted, a metal substrate, a ceramic substrate, and a flexible substrate can be used as in the first embodiment. However, the substrate 6 is thin and flexible because of the structure to be attached by an adhesive. It is preferred to use a substrate.

  In any case, the substrate is covered with a resist layer 18 except for the region where the LED light source 4 and the connector (not shown) are mounted, and the LED light source 4 and the region are not provided in the region where the resist layer 18 of the wiring pattern is not provided. A connector for receiving the driving power of the LED light source 4 is mounted.

  Thus, by making the lamp body portion of the LED lighting device unnecessary for the heat conductive base plate, the heat generation of the LED light source is efficiently conducted to the water cooling jacket, and the suppression of the temperature rise of the LED light source is improved. Therefore, it is possible to reduce the thickness and manufacturing cost of the LED lighting device.

  FIG. 8 is an explanatory diagram illustrating the relationship between the LED light source 4 and the water cooling jacket 9 according to the third embodiment. The third embodiment is different from the second embodiment in that the LED light source 4 is directly mounted on the water-cooling jacket 9 without being mounted on the substrate, and other configurations are the same as those of the second embodiment. In this case, a wiring pattern is affixed on one surface of the water-cooling jacket 9 with an insulating layer interposed therebetween, and a region other than the region where the LED light source 4 and the connector (not shown) are mounted is covered with a resist layer 18.

  The LED light source 4 and a connector that receives the driving power of the LED light source 4 are mounted in a region where the resist layer 18 of the wiring pattern is not provided.

  In this way, by adopting a configuration in which the LED light source 4 is directly mounted on the water-cooling jacket 9, the heat generation of the LED light source 4 is efficiently conducted to the water-cooling jacket 9 and the suppression of the temperature rise of the LED light source 4 is further improved. Further, the manufacturing cost can be further reduced.

  In the first to third embodiments described above, the LED light source driving circuit module 10 is directly attached to the surface of the water cooling jacket 9 opposite to the side where the LED light source 4 is located. 10 does not necessarily need to be attached to the water-cooling jacket 9, and can be provided separately from the LED lighting device.

  By doing so, it is possible to reduce the thickness of the LED lighting device, and when a large-scale lighting facility is configured by a plurality of LED lighting devices, the LED light source driving circuit modules of each LED lighting device are concentrated in one place. It is possible to manage and to deal with the trouble that has occurred quickly and efficiently.

  Moreover, when a wide range illumination is calculated | required by an LED lighting apparatus, it can respond by arrange | positioning in the state which orient | assigned the main light irradiation direction of each LED light source to the different direction. In this case, the water cooling jacket 9 is formed into a polyhedron shape as shown in FIG. 9, and the LED light source is positioned on each surface outside the polyhedron.

  Specifically, the LED light source module is adhered to each outer surface of the polyhedral water-cooling jacket 9 via a heat conductive adhesive, or the insulating layer is sandwiched between the outer surfaces of the water-cooling jacket. The pattern is pasted to cover the area other than the area where the LED light source and connector of the wiring pattern are mounted with a resist layer, and the LED light source and the driving of the LED light source are directly applied to the area where the resist pattern of the wiring pattern of the water cooling jacket is not provided. Mount a connector to receive power.

  When the lamp body is configured using the polyhedral water-cooling jacket 9, the cover lens and the housing are formed with the surface on the side where the LED light source is located (outer surface) facing the cover lens. Store in a closed space.

  By configuring the lamp body of the LED illumination device in such a configuration, the irradiation light of each LED light source is directed in a different direction, and a wide area of the irradiated surface can be irradiated. At this time, the LED light source drive circuit module can be directly attached to the water cooling jacket, or can be provided separately from the LED lighting device.

  FIG. 10 shows the configuration of a large-scale lighting facility to which the LED lighting device of the present invention is applied. A lamp body 2 in which an LED light source (not shown) and a water-cooling jacket (not shown) are accommodated in a closed space formed by the cover lens 3 and the housing 11 has a predetermined number of matrices (in this application example, 5 × vertical). The lamp body unit 40 is configured in a matrix shape composed of 6 horizontal rows), and water-cooling jackets accommodated in the lamp bodies 2 are connected in series or in parallel to each other.

  A plurality of radiators 31 (three in this application example) are arranged in parallel to dissipate the heat of the refrigerant liquid received by the water cooling jacket of the lamp unit 40 to the outside and cool the refrigerant liquid. A cooling fan 32 for supplying cooling air to 31 is disposed at a position facing each radiator 31, and a circulation pump 33 for circulating the refrigerant liquid and a reserve tank (not shown) for storing the refrigerant liquid are also provided to dissipate heat. A mechanism part is configured. In addition, piping which connects a water cooling jacket (not shown), the radiator 31, the circulation pump 33, and a reserve tank is abbreviate | omitted.

  By configuring the heat dissipating mechanism as described above, it becomes possible to simultaneously cool a plurality of lamp bodies by sharing a radiator, a cooling fan that supplies cooling air to the radiator, a circulation pump, and a reserve tank. It is possible to reduce the size of large lighting equipment and reduce manufacturing costs.

  As described above, the LED lighting device of the present invention can suppress an increase in temperature due to heat generation of the LED light source by making the heat dissipation structure of the LED light source a water-cooled heat dissipation structure. .

  As a result, when the power of the LED light source is increased, it is possible to realize an LED illumination device that can suppress the decrease in the light emission efficiency of the LED light source and increase the amount of irradiation light while ensuring high reliability by extending the life.

  In addition, the conventional air-cooled LED illumination device requires a heat sink having fins with a height of about 30 mm for cooling the LED light source, whereas the water-cooled LED illumination device of the present invention cools the LED light source. The thickness of the water-cooled jacket is extremely thin, a few millimeters, and the LED lighting device can be significantly reduced in thickness.

  Furthermore, by attaching the LED light source drive circuit module directly to the water cooling jacket, the influence of heat on the circuit elements is suppressed, and stable circuit operation can be ensured. In particular, the LED light source drive circuit module is equipped with a constant current circuit for supplying a constant current to the LED light source to suppress fluctuations in brightness, so that circuit components having temperature dependence escape from the effects of temperature changes. As a result, a current with a small amount of change is supplied from the constant current circuit to the LED light source, and an LED lighting device with little brightness fluctuation can be realized.

  The LED lighting device of the present invention can be mainly used as a lighting device for outdoor lighting equipment such as street lamps, garden lights, and various stadium lightings.

It is a three-dimensional exploded view showing the lamp body of Example 1 according to the present invention. It is sectional drawing which shows the lamp | ramp part of Example 1 concerning this invention. It is explanatory drawing which shows the structure of the lamp | ramp part of Example 1 concerning this invention. It is a perspective view of Example 1 concerning the present invention. It is a graph which shows the relationship of (electric current-temperature). It is a perspective view of the heat sink of a comparative example. 6 is a schematic diagram illustrating a part of the configuration of Example 2. FIG. 10 is a schematic diagram illustrating a part of the configuration of Example 3. FIG. It is the schematic which shows a part of structure of a lamp | ramp part. It is the schematic which shows the application example of this invention. It is sectional drawing of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED illuminating device 2 Lamp body 3 Cover lens 4 LED light source 5 Connector 6 Board | substrate 7 LED light source module 8 Thermally conductive base plate 9 Water cooling jacket 10 LED light source drive circuit module 11 Housing 12 Closed space 18 Resist layer 19 Insulating heat conductive sheet 20 engraving portion 21 lens cut portion 22 hollow portion 23a inflow port 23b discharge port 25a piping joint 25b piping joint 26a piping 26b piping 26c piping 26d piping 26e piping 26f piping 30 heat dissipation mechanism 31 radiator 31a inlet 31b cooling outlet 31b 33 Circulation Pump 33a Suction Port 33b Discharge Port 34 Reserve Tank 34a Inlet 34b Outlet 35 Heat Sink 40 Lamp Unit

Claims (8)

  A lamp body having at least an LED light source and a water cooling jacket for cooling the LED light source in a closed space formed by a cover lens and a housing, the water cooling jacket, a radiator having a cooling fan, a circulation pump, and a tank are provided. An LED lighting device comprising: a heat dissipation mechanism part in which a refrigerant liquid is sealed in a circulation path connected in an annular shape by piping.   The LED light source is mounted on a substrate provided with a wiring pattern to constitute an LED light source module, and one or more of the LED light source modules are disposed on the surface of the water cooling jacket on the cover lens side. The LED lighting device according to claim 1, wherein   2. The LED illumination according to claim 1, wherein the water cooling jacket is provided with a wiring pattern on a surface on the cover lens side, and one or more LED light sources are mounted on the surface provided with the wiring pattern. apparatus.   3. The LED lighting device according to claim 1, wherein the LED light source module is disposed in the water cooling jacket via a heat conductive base plate.   The surface on the cover lens side of the water cooling jacket has a polyhedral shape, and the LED light source module is disposed on each surface of the polyhedron on the cover lens side. LED lighting device.   4. The LED according to claim 3, wherein a surface of the water cooling jacket on the cover lens side has a polyhedral shape, and the LED light source is disposed on each surface of the polyhedron on the cover lens side. Lighting device.   The LED lighting device according to claim 2, wherein the substrate is one substrate selected from a metal substrate, a ceramic substrate, and a flexible substrate.   The LED light source drive circuit module for driving the LED light source is disposed on the surface of the water cooling jacket opposite to the side where the LED light source is located. LED lighting apparatus of description.

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