TWI658235B - Radiating device and light irradiation device having the same - Google Patents

Abstract

A heat dissipation device uses a heat pipe to reliably cool the entire support member, and can be arranged in a linear connection. The heat dissipation device for dissipating the heat of the heat source into the air includes: a support member, which is arranged in a manner that the first main surface side is in close contact with the heat source; a heat pipe, which is thermally combined with the support member; and a plurality of heat dissipation fins, the heat pipe has: a first straight line A second linear portion is thermally bonded to the support member; a second linear portion is thermally bonded to the plurality of radiating fins; and a connecting portion connects the first linear portion and the second linear portion, and the length of the heat pipe in the direction in which the first linear portion extends, and The length of the support member is the same or slightly shorter, and the connection portion has a bent portion that is thermally bonded to the support member near one end portion of the first linear portion.

Description

Radiating device and light irradiation device having the same

The present invention relates to a heat radiation device for cooling a light source and the like of a light irradiation device, and in particular, to a heat pipe type heat radiation device having a heat pipe into which a plurality of heat radiation fins are inserted, and a light irradiation device having the heat radiation device.

Currently, as the ink for sheet-fed offset printing, an ultraviolet-curable ink that is cured by irradiation with ultraviolet light is used. In addition, as an adhesive around a FPD (Flat Panel Display) such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, an ultraviolet curable resin is used. When curing such an ultraviolet-curable ink or an ultraviolet-curable resin, an ultraviolet light irradiation device that irradiates ultraviolet light is generally used.

As an ultraviolet light irradiation device, an electric light-type irradiation device using a high-pressure mercury lamp or a mercury-xenon lamp as a light source is currently known. However, in recent years, the current discharge has been replaced in response to requirements for reduction in power consumption, long life, and miniaturization of the device. The lamp has developed an ultraviolet light irradiation device using an LED (Light Emitting Diode) as a light source.

Such an ultraviolet light irradiation device using an LED as a light source is described in Patent Document 1, for example. The ultraviolet light irradiation device described in Patent Document 1 includes a plurality of light irradiation modules including a light irradiation device and the like on which a plurality of light emitting elements (LEDs) are mounted. A plurality of light irradiation modules are arranged in a line, and a specific region of an irradiation object disposed facing the plurality of light irradiation modules is irradiated with linear ultraviolet light.

Therefore, if an LED is used as a light source, most of the electric power that is turned on becomes heat, and there is a problem that the light emitting efficiency and life are reduced due to the heat generated by the LED itself, and the heat treatment becomes a problem. Therefore, the ultraviolet light irradiation device described in Patent Document 1 has a structure in which a heat radiation member is disposed on the back surface of each light irradiation device to forcibly dissipate heat generated by the LED.

The heat-dissipating member described in Patent Document 1 is a so-called water-cooled heat-dissipating member that cools by flowing a refrigerant. Since a pipe or the like for the refrigerant is required, there is a problem that the device itself becomes large, and measures against water leakage are necessary. problem. Therefore, a structure using a heat pipe is proposed as a method that has high heat dissipation efficiency even though it is air-cooled (for example, Patent Document 2).

The light irradiation device described in Patent Document 2 includes a heat pipe and a plurality of heat dissipation fins which are inserted and connected to the heat pipe on the back side of a light emitting module mounted with a plurality of light emitting elements (LEDs). The heat is transferred by the heat pipe, and the structure dissipates heat from the fins to the air.

Patent Literature Patent Literature 1: Japanese Laid-Open Patent Publication No. 2015-153771 Patent Literature 2: Japanese Laid-Open Patent Publication No. 2014-038866

According to the heat radiation device of the light irradiation device disclosed in Patent Document 2, since the heat generated by the LED is quickly transferred by the heat pipe and is radiated from a plurality of heat radiation fins, the LED is efficiently cooled. Therefore, the performance of the LED can be prevented from being degraded or damaged, and light can be emitted with high brightness. In addition, the heat dissipation device described in Patent Document 2 has a structure in which a heat pipe is bent in a "U" shape to transfer heat in a direction opposite to the direction in which the LED is emitted, so that light in a direction perpendicular to the direction in which the LED is emitted can be made. The size of the irradiation device is reduced.

However, in the case where the heat pipe is bent in a "U" shape as shown in the heat sink of Patent Document 2, if the bent portion of the heat pipe floats from the bottom plate (support member) of the light emitting module, the floating portion The cooling capacity will be significantly reduced. Therefore, if you want to reliably cool the entire bottom plate, you must arrange the straight part of the heat pipe closely on the entire back surface of the bottom plate, and the bent part of the heat pipe will be outside the bottom plate ( That is, the outer side compared with the outer shape of the light emitting module). In addition, if the curved portion of the heat pipe protrudes outside of the bottom plate, it cannot be arranged close to the arrangement direction of the LEDs (that is, the direction in which the straight portion of the heat pipe extends), and the light irradiation device cannot be lined like the structure described in Patent Document 1.状 连接 组合。 Link configuration.

The present invention has been made in view of this situation, and an object thereof is to provide a heat radiation device which can reliably cool the entire bottom plate (support member) using a heat pipe and can be arranged in a linear connection, thereby realizing a light irradiation device having the heat radiation device.

In order to achieve the above object, the heat dissipation device of the present invention is arranged in close contact with the heat source, and dissipates the heat of the heat source into the air. The heat dissipation device includes a support member in a plate shape, and the first main surface side is arranged in close contact with the heat source. A heat pipe supported by the support member and thermally bonded to the support member to transfer heat from the heat source; and a plurality of heat dissipation fins arranged in a space facing the second main surface opposite to the first main surface and thermally bonded to the heat pipe To dissipate the heat transferred by the heat pipe, the heat pipe has: a first straight portion thermally bonded to the support member; a second straight portion thermally bonded to a plurality of heat dissipation fins; and a connection portion connected to one end portion of the first straight portion and the One end portions of the two straight portions are connected, so that the first straight portion and the second straight portion are connected. The length of the heat pipe in the extension direction of the first straight portion is the same as or slightly shorter than the length of the supporting member in the extension direction of the first straight portion. There is a bent portion thermally joined to the support member near one end portion of the first linear portion, and a plurality of heat sinks are aligned in a direction in which the first linear portion extends. In this case, the first main surfaces may be connected in a continuous manner.

According to this structure, fluctuations in the cooling capacity are reduced in the direction in which the first straight portion extends, and the substrate can be cooled in the same (substantially uniform) manner, and the LED elements arranged on the substrate can also be cooled substantially uniformly. Therefore, the temperature difference between the LED elements is also reduced, and the fluctuation of the irradiation intensity due to the temperature characteristics is also reduced. In addition, since the heat pipe and the heat radiation fins are configured so as not to deviate from the space facing the second main surface of the support member, a plurality of heat radiation devices may be connected in a direction in which the first linear portion extends.

In addition, it is preferable that the first linear portion having the plurality of heat pipes is disposed at a first specific interval in a direction substantially orthogonal to a direction in which the first linear portion extends.

In addition, it is preferable that the second linear portions of the plurality of heat pipes are disposed at a first specific interval in a direction substantially parallel to the second principal surface and substantially orthogonal to a direction in which the first linear portion extends.

In addition, it is preferable that the second straight portion of the plurality of heat pipes is longer than the first specific interval in a direction substantially parallel to the second principal surface and substantially orthogonal to a direction in which the first straight portion extends. The second specific interval is configured.

In addition, a structure having a fan may be arranged in a space facing the second main surface to generate airflow in a direction substantially perpendicular to the second main surface.

In addition, when viewed from a direction in which the first straight portion extends, the position of the second straight portion of each heat pipe is preferably different in a direction substantially perpendicular to the second principal surface and a direction substantially parallel. In this case, it is preferable that a fan is provided, and the fan is disposed in a space facing the second main surface and generates airflow in a direction substantially parallel to the second main surface.

In addition, it is also possible to have a structure in which a plurality of heat radiating fins have a cutout portion in a space surrounded by a first straight portion and a second straight portion of a plurality of heat pipes, and the heat sink has a fan and is arranged in the space formed by the cutout portion. , Generating an airflow in a direction inclined with respect to the second principal surface.

In addition, it is preferable that the second straight portion is substantially parallel to the second principal surface.

In addition, it is preferable that the supporting member has a groove portion having a shape corresponding to the first straight portion and the bent portion on the second main surface side, and the first straight portion and the bent portion are arranged to fit into the groove portion.

In addition, from another viewpoint, the light irradiation device of the present invention includes: any one of the above-mentioned heat dissipation devices; a substrate arranged to be in close contact with the first main surface; and a plurality of LED elements on the surface of the substrate, and The first straight portions of the heat pipes are arranged substantially in parallel.

In addition, it is preferable that the plurality of LED elements are arranged at a predetermined pitch in a direction in which the first linear portion extends, and a distance from the first linear portion to one end of the supporting member in a direction in which the first linear portion extends, and a connection portion. The distance to the other end of the support member is less than or equal to 1/2 of the pitch.

In addition, it is preferable that the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to a direction in which the first linear portion extends.

In addition, it is preferable that the plurality of LED elements are disposed at positions opposed to the first linear portion via the substrate.

In addition, it is preferable that the light irradiation device includes a plurality of heat radiating devices connected such that the first main surface is continuous. In this case, it is preferable that the plurality of heat sinks are aligned and connected in a direction in which the first linear portion extends.

In addition, it is preferable that the LED element emits light having a wavelength that acts on the ultraviolet curable resin.

As described above, according to the present invention, a heat sink capable of reliably cooling the entire bottom plate (support member) using a heat pipe and being arranged in a linear connection, and a light irradiation device having the heat sink are realized.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same or equivalent parts in the drawings are denoted by the same reference numerals, and repeated descriptions thereof are omitted.

First Embodiment FIG. 1 is an external view illustrating a schematic configuration of a light irradiation device 10 including a heat radiation device 200 according to a first embodiment of the present invention. The light irradiation device 10 according to the present embodiment is a device mounted on a light source device that uses an ultraviolet curable ink used as an ink for sheet-fed offset printing, or is used as a flat panel display (FPD) or the like. The ultraviolet curing resin used for the adhesive is cured, and the light irradiation device 10 is disposed to face the irradiation object, and emits ultraviolet light to a specific region of the irradiation object. In this specification, the direction in which the first straight portion 203a of the heat pipe 203 of the heat sink 200 extends is defined as the X-axis direction, and the direction in which the first straight portion 203a of the heat pipe 203 is aligned is defined as the Y-axis direction. The direction in which the axes are orthogonal is defined as the Z-axis direction and described. In addition, the light irradiation device 10 has a different required irradiation area depending on the use or specifications of the light source device to be mounted. Therefore, the light irradiation device 10 according to this embodiment is configured to be connected in the X-axis direction and the Y-axis direction (described in detail later) ).

(Structure of Light Irradiation Device 10) As shown in FIG. 1, the light irradiation device 10 according to the present embodiment includes an LED unit 100 and a heat sink 200. 1 (a) is a front view of the light irradiation device 10 according to this embodiment (a view viewed from the Z-axis direction downstream side (positive direction side)), and FIG. 1 (b) is a plan view (viewed from the Y-axis direction) View from the downstream side (forward direction side), Figure 1 (c) is a right side view (view from the X-axis downstream side (forward direction side)), and Figure 1 (d) is a left side view (from the X-axis direction) A diagram viewed from the upstream side (negative direction side), and FIG. 1 (e) is a rear view (a diagram viewed from the upstream side (negative direction side) in the Z-axis direction).

(Configuration of LED Unit 100) FIG. 2 is a diagram illustrating the configuration of the LED unit 100 of the present embodiment, and is an enlarged view of a portion B of FIG. 1. As shown in FIGS. 1A and 2, the LED unit 100 includes a rectangular plate-shaped substrate 105 that is substantially parallel to the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 arranged on the substrate 105.

The substrate 105 is a rectangular wiring substrate formed of a material having high thermal conductivity (for example, copper, aluminum, aluminum nitride). As shown in FIG. 1 (a), the surface of the substrate 105 is spaced apart along the X-axis direction and the Y-axis direction. At a distance of 20 LEDs (Chip On Board: COB (Chip On Board)) of 20 (X-axis direction) × 10 rows (Y-axis direction). An anode pattern (not shown) and a cathode pattern (not shown) for supplying power to the LED elements 110 are formed on the substrate 105, and each LED element 110 is electrically connected to the anode pattern and the cathode pattern, respectively. In addition, the substrate 105 is electrically connected to an LED driving circuit (not shown) by a wiring cable (not shown), and a driving current is supplied from the LED driving circuit to each LED element 110 via an anode pattern and a cathode pattern.

The LED element 110 is a semiconductor element that receives a supply of a driving current from an LED driving circuit and emits ultraviolet light (for example, wavelengths of 365 nm, 385 nm, 395 nm, and 405 nm). In this embodiment, 20 LED elements 110 are arranged at a specific row pitch PX along the X-axis direction, and 10 LED elements 110 are arranged at a particular column pitch PY along the Y-axis direction as one column (FIG. 2). Therefore, when a drive current is supplied to each LED element 110, ten linear ultraviolet lights which are substantially parallel are emitted from the LED unit 100 along the X-axis direction. In addition, each LED element 110 of the present embodiment adjusts a driving current supplied to each LED element 110 so as to emit ultraviolet light having substantially the same amount of light, and the ultraviolet light emitted from the LED unit 100 is in the X-axis direction and the Y-axis direction. Has a substantially uniform light amount distribution. In addition, the light irradiation device 10 according to this embodiment is configured to change the irradiation area by being connected in the X-axis direction and the Y-axis direction. When the light irradiation devices 10 are connected, LEDs are arranged between adjacent light irradiation devices 10. The arrangement of the elements 110 is continuous. The LED elements 110 located at both ends in the X-axis direction are arranged at positions 1/2 PX from the edge of the support member 201 of the heat sink 200, and the LEDs located at both ends in the Y-axis direction. The element 110 is disposed at a position of 1/2 PY from the edge of the support member 201 of the heat sink 200 (FIG. 2).

(Structure of the heat sink 200)

FIG. 3 is a diagram illustrating a configuration of a heat sink 200 according to the present embodiment. Fig. 3 (a) is a cross-sectional view taken along AA of Fig. 1 (c), Fig. 3 (b) is an enlarged view of part C of Fig. 3 (a), and Fig. 3 (c) is an enlarged view of part D of Fig. 3 (a) . The heat radiating device 200 is disposed in close contact with the back surface of the substrate 105 of the LED unit 100 (the surface opposite to the surface on which the LED elements 110 are mounted), and is a device that dissipates heat generated by each LED element 110 and is supported by The component 201 is composed of a plurality of heat pipes 203 and a plurality of heat radiation fins 205. When a driving current flows in each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature of the LED element 110 itself increases and the temperature rises, which causes a problem that the light emission efficiency is significantly reduced. Therefore, in this embodiment, the heat dissipation device 200 is provided in close contact with the back surface of the substrate 105, and the heat generated by the LED element 110 is conducted to the heat dissipation device 200 via the substrate 105 to forcibly dissipate heat.

The support member 201 is a rectangular plate-shaped member formed of a metal (for example, copper or aluminum) having high thermal conductivity. The support member 201 is attached so that the first main surface 201 a is in close contact with the back surface of the substrate 105 via a thermally conductive material such as lubricating oil, and receives heat from the LED unit 100 that becomes a heat source. On the second main surface 201b (the surface opposite to the first main surface 201a) of the support member 201 of the present embodiment, a groove portion 201c (corresponding to the shape of the first straight portion 203a and the bent portion 203ca of the heat pipe 203 described later) is formed ( 1 (d) and 3), the heat pipe 203 is supported by the support member 201. Thus, the support member 201 of the present embodiment functions as a heat receiving section that receives heat from the LED unit 100 while supporting the heat pipe 203.

The heat pipe 203 is a hermetically closed tube in which a working fluid (for example, water, ethanol, ammonia, etc.) has a substantially circular cross-sectional hollow metal (for example, a metal such as copper, aluminum, iron, or magnesium, or an alloy containing these metals). As shown in FIG. 3, each heat pipe 203 according to this embodiment has a substantially U-shaped shape when viewed from the Y-axis direction, and is composed of a first straight portion 203a extending in the X-axis direction and a second straight line The portion 203b extends substantially parallel to the first straight portion 203a in the X-axis direction; and the connecting portion 203c connects one end (X of the first straight portion 203a to the first straight portion 203a and the second straight portion 203b continuously) One end on the downstream side (positive direction side) in the axial direction) is connected to one end (one end on the downstream side (positive direction side) in the X-axis direction) of the second straight portion 203b. In addition, the heat pipe 203 of the present embodiment is arranged so as not to deviate from the space of the second main surface 201 b facing the support member 201 so that the light irradiation devices 10 do not interfere with each other when they are connected.

The first straight portion 203a of each heat pipe 203 is a portion that receives heat from the support member 201. The first straight portion 203a of each heat pipe 203 is inserted into the groove portion 201c of the support member 201 by a fixing member (not shown) or The adhesive is fixed and thermally bonded to the supporting member 201 (FIG. 3). In the present embodiment, the first linear portions 203 a of the five heat pipes 203 are uniformly arranged at a predetermined interval in the Y-axis direction (FIGS. 1 (c) and 1 (d)).

The second straight portion 203b of each heat pipe 203 is a portion that dissipates heat received by the first straight portion 203a. The second straight portion 203b of each heat pipe 203 is inserted into the through hole 205a of the heat dissipation fin 205, and is mechanically connected to the heat dissipation fin 205. And thermal bonding (Figure 3). In the present embodiment, the second linear portions 203b of the five heat pipes 203 are arranged in parallel at a predetermined interval in the Y-axis direction (FIG. 1 (c), FIG. 1 (d)). In addition, the length of the second straight portion 203b of each heat pipe 203 in this embodiment is substantially equal to the length of the first straight portion 203a.

The connecting portion 203c of each heat pipe 203 extends from one end of the first linear portion 203a toward the upstream side (negative direction side) of the Z-axis so as to protrude from the second main surface 201b of the support member 201, and is connected to the second straight portion 203b. Connect at one end. That is, the connection portion 203c folds back the second straight portion 203b so that the second straight portion 203b is substantially parallel to the first straight portion 203a. The bent portions 203ca and 203cb are formed in the vicinity of the first straight portion 203a and the second straight portion 203b of the connection portion 203c of each heat pipe 203 so that the connection portion 203c does not buckle. In addition, in this embodiment, the bent portion 203ca is also fixed in a state of being fitted into the groove portion 201c, and is thermally coupled to the support member 201.

The radiating fin 205 is a member of a rectangular plate-shaped metal (for example, a metal such as copper, aluminum, iron, magnesium, or an alloy containing them). As shown in FIG. 3, each heat-dissipating fin 205 according to the present embodiment has a through-hole 205 a inserted into a second linear portion 203 b of each heat pipe 203. In this embodiment, 50 heat radiating fins 205 are sequentially inserted into the second straight portion 203b of each heat pipe 203, and are arranged side by side at a predetermined interval in the X-axis direction. In addition, each heat-dissipating fin 205 is mechanically and thermally coupled to the second straight portion 203b of each heat pipe 203 in each through-hole 205a by welding or soldering. The heat radiation fins 205 according to the present embodiment are arranged so as not to deviate from the space of the second main surface 201 b facing the support member 201 so as not to interfere with each other when the light irradiation devices 10 are connected.

When a driving current flows through each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature of the LED element 110 increases due to the self-heating of the LED element 110, but the heat generated by each LED element 110 is transmitted to each of the substrates 105 and the supporting member 201. The first straight portion 203a of the heat pipe 203 conducts (moves) quickly. When the heat moves to the first straight portion 203a of each heat pipe 203, the working fluid in each heat pipe 203 absorbs the heat and evaporates, and the vapor of the working fluid moves through the cavity in the connection portion 203c and the second straight portion 203b. The heat of one straight portion 203a moves to the second straight portion 203b. The heat moving to the second straight portion 203b further moves to the plurality of heat radiating fins 205 coupled to the second straight portion 203b, and radiates heat from each of the heat radiating fins 205 to the air. When the heat is dissipated from each of the heat radiating fins 205, the temperature of the second linear portion 203b also drops, so the vapor of the working fluid in the second linear portion 203b is also cooled to return to a liquid and moves to the first linear portion 203a. The working fluid moved to the first linear portion 203 a is used again to absorb heat conducted through the substrate 105 and the support member 201.

Therefore, in this embodiment, the working fluid in each heat pipe 203 loops between the first straight portion 203a and the second straight portion 203b, so that the heat generated by each LED element 110 is quickly moved to the heat radiation fin 205 To efficiently dissipate heat from the heat radiating fins 205 into the air. Therefore, the temperature of the LED element 110 does not increase excessively, nor does it cause a problem of a significant decrease in light emission efficiency.

In addition, the cooling capacity of the heat sink 200 is determined by the heat transfer amount of the heat pipe 203 and the heat dissipation amount of the heat dissipation fins 205. In addition, if a temperature difference occurs between the LED elements 110 that are two-dimensionally arranged on the substrate 105, fluctuations in irradiation intensity due to temperature characteristics occur. Therefore, from the viewpoint of irradiation intensity, it is required to move the substrate 105 along the X-axis direction and The Y-axis direction is cooled uniformly. In particular, in the light irradiation device 10 according to the present embodiment, the LED element 110 is arranged to the periphery of the end portion of the support member 201 because it can be connected in the X-axis direction and the Y-axis direction. Therefore, there is a problem that it is necessary to uniformly cool down to the periphery of the end portion of the support member 201.

Therefore, in the heat sink 200 of this embodiment, the length in the X-axis direction of each heat pipe 203 is the same as the length in the X-axis direction of the support member 201, or is slightly shorter, and the first straight line of each heat pipe 203 is configured. The portion 203a and the bent portion 203ca are thermally bonded to the support member 201, and thereby uniformly cooled in the X-axis direction. That is, by adopting a structure in which the first straight portion 203a and the bent portion 203ca of each heat pipe 203 are used to receive heat from the support member 201, each heat pipe 203 does not protrude in the X-axis direction and reaches the X-axis direction of the support member 201. Both ends are cooled uniformly. In the Y-axis direction, the plurality of heat pipes 203 are evenly arranged in the Y-axis direction, so that the cooling is performed uniformly in the Y-axis direction. In addition, as shown in FIG. 3 (b), the distance d1 of each heat pipe 203 from the front end of the first straight portion 203a to the edge of the support member 201 is preferably less than or equal to X of the LED element 110 (shown in FIG. 2). The dimension Lx in the axial direction is 1/2. In addition, similarly, as shown in FIG. 3 (c), the distance d2 from the curved portion 203ca of each heat pipe 203 to the edge of the support member 201 is preferably less than or equal to the dimension Lx in the X-axis direction of the LED element 110. 1/2.

Therefore, according to the structure of the present embodiment, fluctuations in the cooling capacity are reduced in the Y-axis direction and the X-axis direction, and the substrate 105 can be cooled uniformly (substantially uniformly). 200 LED elements arranged on the substrate 105 110 is also cooled approximately uniformly. Therefore, the temperature difference between the LED elements 110 is also reduced, and fluctuations in the irradiation intensity due to temperature characteristics are also reduced. In addition, as shown in FIGS. 1 and 3, the heat pipe 203 and the radiating fins 205 of the present embodiment are configured so as not to deviate from the second main surface 201 b facing the support member 201. Therefore, even if the light irradiation device 10 is connected Nor will they interfere with each other.

FIG. 4 is a diagram showing a state in which the light irradiation device 10 according to the present embodiment is connected in the X-axis direction, FIG. 4 (a) is a plan view (a view viewed from the Y-axis downstream side (positive direction side)), and FIG. 4 ( b) is a front view (a figure viewed from the Z-axis direction downstream side (positive direction side)). As shown in FIG. 4 (a), the light irradiation device 10 according to this embodiment is configured so that the heat pipe 203 and the heat radiation fins 205 do not deviate from the space facing the second main surface 201 b of the support member 201, so that the support member 201 can be removed. The joints are arranged so that the first main surfaces 201 a of the supporting members 201 are continuous (that is, the arrangement of the LED elements 110 is continuous between the adjacent light irradiation devices 10). Therefore, it is possible to form linear irradiation regions of various sizes in accordance with specifications or applications.

FIG. 5 is a view showing a state in which the light irradiation device 10 according to the present embodiment is connected in the X-axis direction and the Y-axis direction, and FIG. 5 (a) is a plan view (a view from the downstream side (positive direction side) of the Y-axis direction) Fig. 5 (b) is a front view (a diagram viewed from the Z-axis direction downstream side (positive direction side)). As shown in FIG. 5, the light irradiation device 10 of this embodiment is configured such that the heat pipe 203 and the heat radiation fins 205 do not deviate from the space facing the second main surface 201 b of the support member 201, and the support member 201 can be joined to support The first principal surfaces 201 a of the members 201 are arranged in a continuous manner (that is, in a manner in which the arrangement of the LED elements 110 is continuous between adjacent light irradiation devices 10). Therefore, irradiation areas of various sizes can be formed according to specifications or applications.

The above is the description of this embodiment, but the present invention is not limited to the above-mentioned structure, and various modifications can be made within the scope of the technical idea of the present invention.

For example, as shown in FIG. 1, in the heat sink 200 according to this embodiment, there are five heat pipes 203 and 50 heat radiating fins 205 arranged side by side at a specific interval in the Y-axis direction. However, the heat pipes 203 and The number of the heat radiation fins 205 is not limited to this. The number of radiating fins 205 is determined by the relationship between the amount of heat generated by the LED element 110 or the temperature of the air around the radiating fins 205, and is appropriately selected corresponding to the so-called fin area that can dissipate the heat generated by the LED element 110. In addition, the number of the heat pipes 203 is determined by the relationship between the heat generation amount of the LED elements 110 or the heat transfer amount of each heat pipe 203, and is appropriately selected so that the heat generated by the LED elements 110 can be sufficiently transferred.

In this embodiment, the LED elements 110 are arranged on the substrate 105 in 20 (X-axis direction) × 10 rows (Y-axis direction), and five heat pipes 203 are arranged on the back side of the substrate 105. However, from the viewpoint of cooling efficiency, it is preferable that each LED element 110 on the substrate 105 is disposed at a position corresponding to the first linear portion 203 a of each heat pipe 203.

In addition, in this embodiment, a case where the first straight portion 203a and the second straight portion 203b of the five heat pipes 203 are uniformly arranged along the Y-axis direction with a certain interval will be described as an example (FIG. 1 (c), Figure 1 (d)), but it is not necessarily limited to this structure. The interval between the first straight portion 203a and the second straight portion 203b may be configured to gradually widen (or narrow) according to the arrangement of the LED elements 110.

In addition, the heat dissipation device 200 according to the present embodiment is described by taking a case of natural air cooling as an example, but a fan that supplies cooling air to the heat dissipation device 200 may be provided to perform forced air cooling on the heat dissipation device 200.

(Modification 1) FIG. 6 is a diagram showing a light irradiation device 10M having a heat radiation device 200M according to a modification of the heat radiation device 200 of the present embodiment. FIG. 6 (a) is a plan view of the light irradiation device 10M according to this modification (a view viewed from the Y-axis downstream side (positive direction side)), and FIG. 6 (b) is a right side view (from the X-axis downstream side (positive side) Orientation side) Observed figure). As shown in FIG. 6, the light irradiation device 10M of this modification is different from the light irradiation device 10 of the present embodiment in that the heat radiation device 200M includes a cooling fan 210.

The cooling fan 210 is disposed on the upstream side (negative direction side) in the Z-axis direction of the heat sink 200M, and is a device that supplies cooling air to the heat sink 200M. As shown in FIG. 6 (b), the cooling fan 210 generates an air flow W in a direction perpendicular to the second main surface 201 b of the support member 201 (that is, a Z-axis direction or a direction opposite to the Z-axis direction). The airflow W generated by the cooling fan 210 flows between the heat radiating fins 205, cools the heat radiating fins 205, and cools the second straight portions 203b of the heat pipes 203 inserted in the heat radiating fins 205, and The second main surface 201b of the support member 201 is cooled. Therefore, according to the structure of this modification, the cooling capacity of the heat sink 200M can be significantly improved. In addition, the cooling fan 210 may be applied to a structure in which the light irradiation device 10M is connected as shown in FIGS. 4 and 5. In this case, one cooling fan 210 may be provided for each heat dissipation device 200M, or One cooling fan 210 may be provided for the plurality of heat sinks 200M.

Second Embodiment FIG. 7 is an external view illustrating a schematic configuration of a light irradiation device 20 including a heat radiation device 200A according to a second embodiment of the present invention. FIG. 7 (a) is a plan view of the light irradiation device 20 according to this embodiment (a view viewed from the Y-axis downstream side (positive direction side)), and FIG. 7 (b) is a rear view (from the Z-axis upstream side (negative side) (View side)), Figure 7 (c) is a right side view (view from the X-axis downstream side (positive direction side)), and Figure 7 (d) is a left side view (from the X-axis upstream side (negative) Orientation side) Observed figure). The light irradiation device 20 of this embodiment differs from the heat sink 200 of the first embodiment in that the arrangement interval of the first linear portions 203Aa of the heat pipe 203A is narrow, and the arrangement interval of the second linear portions 203Ab is increased. That is, in the heat radiating device 200A of this embodiment, when viewed from the X-axis direction, the first straight portion 203Aa of each heat pipe 203A is arranged close to the central portion of the support member 201A and is arranged substantially parallel to the Y-axis direction. When viewed from the X-axis direction, the two linear portions 203Ab are arranged substantially parallel to the Y-axis direction with an interval larger than the interval of the first linear portion 203Aa. According to this configuration, since the cooling ability of the central portion of the supporting member 201A can be improved, it is effective, for example, when the LED elements 110 of the LED unit 100 are arranged in a substantially central portion in the Y-axis direction of the substrate 105. In addition, the light irradiation device 20 of this embodiment is also configured in the same manner as the light irradiation device 10 of the first embodiment, so that the heat pipe 203A and the heat radiation fins 205A do not deviate from the space facing the second main surface 201Ab of the support member 201A. Therefore, as shown in FIG. 8, the supporting members 201A can be joined and arranged in such a manner that the first main surface 201Aa of the supporting member 201A is continuous.

(Modification 2) FIG. 9 is a right side view (view from a downstream side (positive direction side) in the X-axis direction) of a light irradiation device 20M having a heat radiation device 200AM according to a modification of the heat radiation device 200A of the present embodiment. As shown in FIG. 9, the light irradiation device 20M of this modification is different from the light irradiation device 20 of the present embodiment in that the heat sink 200AM includes a cooling fan 210A.

The cooling fan 210A is the same as the cooling fan 210 of the first modification, and is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat sink 200AM, and supplies cooling air to the heat sink 200AM. As shown in FIGS. 7 and 9, in the present modification, since the interval in the Y-axis direction of the second linear portion 203Ab (not shown in FIG. 9) is enlarged, more air flows W than in the first modification. The second main surface 201Ab of the support member 201 is reached. Therefore, according to the structure of this modification, the cooling capacity of the heat sink 200AM can be further improved. In addition, the cooling fan 210A may be applied to a structure in which the light irradiation device 20M is connected as shown in FIG. 8. In this case, one cooling fan 210A may be provided for each heat sink 200AM, or may be relatively One cooling fan 210A is installed in a plurality of heat sinks 200AM.

Third Embodiment FIG. 10 is an external view illustrating a schematic configuration of a light irradiation device 30 including a heat radiation device 200B according to a third embodiment of the present invention. FIG. 10 (a) is a plan view of the light irradiation device 30 according to the present embodiment (a view viewed from the Y-axis downstream side (positive direction side)), and FIG. 10 (b) is a rear view (from the Z-axis upstream side (negative side) (View side)), Figure 10 (c) is a right side view (view from the X-axis direction downstream side (positive direction side)), and Figure 10 (d) is a left side view (from the X-axis direction upstream side (negative) Orientation side) Observed figure). The light irradiation device 30 according to this embodiment is different from the heat radiation device 200 according to the first embodiment in that the position of the second linear portion 203Bb of each heat pipe 203B is different in the Y-axis direction and the Z-axis direction when viewed from the X-axis direction. (FIG. 10 (d)), the length of the connection portion 203Bc (FIGS. 10 (a), 10 (c)) of each heat pipe 203B is different, and the heat radiation fins 205B are formed on the second main surface 201Bb of the support member 201B. On the upstream side (negative direction side) in the Y axis direction, a space P is formed on the downstream side (positive direction side) in the Y axis direction of the second main surface 201Bb of the support member 201B (FIG. 10 (b), FIG. 10 (c), and FIG. 10 (D)). Therefore, according to this structure, other components (for example, a cooling fan, an LED driving circuit, etc.) can be arranged in the space P. The first linear portion 203Ba of each heat pipe 203B according to the present embodiment is similar to the heat sink 200A according to the second embodiment, and is arranged close to the central portion of the support member 201B and substantially parallel to the Y-axis direction when viewed from the X-axis direction. . Therefore, since the cooling capacity of the central portion of the supporting member 201B can be improved, it is effective, for example, when the LED elements 110 of the LED unit 100 are arranged in a substantially central portion in the Y-axis direction of the substrate 105. In addition, the light irradiation device 30 according to the present embodiment is configured similarly to the light irradiation device 10 according to the first embodiment, so that the heat pipe 203B and the heat radiation fins 205B do not deviate from the space facing the second main surface 201Bb of the support member 201B. Therefore, as shown in FIG. 11, the supporting members 201B can be joined, and the first main surface 201Ba of the supporting member 201B can be continuously connected and arranged.

(Modification 3) FIG. 12 is a right side view (view from a downstream side (positive direction side) of the X-axis direction) of a light irradiation device 30M having a heat dissipation device 200BM according to a modification of the present embodiment. As shown in FIG. 12, the light irradiation device 30M of the present modification is different from the light irradiation device 30 of the present embodiment in that the heat sink 200BM includes a cooling fan 210B.

The cooling fan 210B is arranged in a space P on the second main surface 201Bb of the support member 201B, and is a device that supplies cooling air to the heat sink 200BM. As shown in FIG. 12, the cooling fan 210B of the present modification generates an air flow W in a direction substantially parallel to the second main surface 201Bb of the support member 201B (that is, in a Y-axis direction or a direction opposite to the Y-axis direction). The airflow W generated by the cooling fan 210B flows between the heat radiating fins 205B, cools the heat radiating fins 205B, and cools the second straight portion 203Bb of each heat pipe 203B inserted in each heat radiating fin 205B (FIG. 10 ) For cooling. In this modification, since the position of the second straight portion 203Bb (FIG. 10) of each heat pipe 203B varies along the Z-axis direction, the air flow W generated by the cooling fan 210B flows accurately to each second straight portion 203Bb (FIG. 10). . Therefore, according to the structure of this modification, the cooling capacity of the heat sink 200BM can be significantly improved. In addition, the cooling fan 210B may be applied to the structure for connecting the light irradiation device 30M shown in FIG. 11. In this case, one cooling fan 210B may be provided for each heat radiating device 200BM, or a plurality of cooling fans 210B may be provided. Cooling device 200BM is equipped with one cooling fan 210B

Fourth Embodiment FIG. 13 is an external view illustrating a schematic configuration of a light irradiation device 40 including a heat radiation device 200C according to a fourth embodiment of the present invention. FIG. 13 (a) is a plan view of the light irradiation device 40 according to this embodiment (a view viewed from the Y-axis downstream side (positive direction side)), and FIG. 13 (b) is a rear view (from the Z-axis upstream side (negative side) (View side)), Figure 13 (c) is a right side view (view from the X-axis downstream side (positive side)), and Figure 13 (d) is a left side view (from the X-axis upstream side (negative) Orientation side) Observed figure). When the light irradiation device 40 according to this embodiment is viewed from the X-axis direction, the positions of the second linear portions 203Cb of the heat pipes 203C are different in the Y-axis direction and the Z-axis direction (FIG. 13 (d)). Specifically, it is different from the heat sink 200 of the first embodiment in that the position of the second linear portion 203Cb of the heat pipe 203C located on the downstream side (positive direction side) of the Y-axis direction in the Z-axis direction (that is, from the The height from the second main surface 201Cb), and the position in the Z axis direction (ie, the height from the second main surface 201Cb) in the Z-axis direction of the second straight portion 203Cb of the heat pipe 203C on the upstream side (negative direction side) of the Y-axis direction. The lengths of the connecting portions 203Cc (FIGS. 13 (a) and 13 (c)) of the heat pipes 203C are different from each other, and the heat dissipation fins 205C have positions lower than those of the second straight portions 203Cb. The cutout section 205Ca forms a space Q surrounded by the cutout section 205Ca, each heat pipe 203C, and the second main surface 201Cb (FIG. 13 (c), FIG. 13 (d)). According to this structure, other components (for example, a cooling fan, an LED driving circuit, etc.) can be arranged in the space Q. The first linear portion 203Ca of each heat pipe 203C of this embodiment is similar to the heat sink 200A of the second embodiment, and when viewed from the X-axis direction, approaches the center portion of the support member 201C and is disposed substantially parallel to the Y-axis direction. . Therefore, the cooling capacity of the central portion of the supporting member 201C can be improved. For example, the LED element 110 of the LED unit 100 is effective when the LED elements 110 are arranged in a substantially central portion in the Y-axis direction of the substrate 105. In addition, the light irradiation device 40 of the present embodiment is configured similarly to the light irradiation device 10 of the first embodiment so that the heat pipe 203C and the heat radiation fins 205C do not deviate from the space facing the second main surface 201Cb of the support member 201C. As shown in FIG. 14, the support members 201C may be joined, and the first main surface 201Ca of the support member 201C may be continuously connected and arranged.

(Modification 4) FIG. 15 is a left side view (view from the X-axis upstream side (negative direction side)) of a light irradiation device 40M having a heat dissipation device 200CM according to a modification of the present embodiment. As shown in FIG. 15, the light irradiation device 40M of this modification is different from the light irradiation device 40 of the present embodiment in that the heat sink 200CM includes a cooling fan 210C.

The cooling fan 210C is arranged in a space Q surrounded by the cutout portion 205Ca, each heat pipe 203C, and the second main surface 201Cb, and is a device that supplies cooling air to the heat sink 200CM. As shown in FIG. 15, the cooling fan 210C of the present modification is disposed to face the cutout portion 205Ca, and generates the airflow W in a direction inclined with respect to the Y-axis direction and the Z-axis direction. The air flow W generated by the cooling fan 210C flows between the heat radiating fins 205C, cools each of the heat radiating fins 205C, and cools the second straight portion 203Cb of each heat pipe 203C inserted in each of the heat radiating fins 205C. In this modification, since the second straight portion 203Cb of each heat pipe 203C is arranged along the cutout portion 205Ca (that is, opposite to the cooling fan 210C), the air flow W generated by the cooling fan 210C reliably hits each The second straight portion 203Cb. Therefore, according to the structure of this modification, the cooling capacity of the heat sink 200CM can be significantly improved. In addition, the cooling fan 210C may be applied to a structure in which the light irradiation device 40M is connected as shown in FIG. 14. In this case, one cooling fan 210C may be provided for each heat sink 200CM, or it may be used for A plurality of cooling devices 200CM are provided with one cooling fan 210C.

In addition, all the content of the embodiment disclosed this time is an illustration, It should be thought that it is not restrictive. The scope of the present invention is not shown by the above description, but is shown by the scope of patent application, which includes the meaning equivalent to the scope of the patent application and all changes within the scope.

10, 10M, 20, 20M, 30, 30M, 40, 40M ‧‧‧ light irradiation device

100‧‧‧LED unit

105‧‧‧ substrate

110‧‧‧LED components

200, 200M, 200A, 200AM, 200B, 200BM, 200C, 200CM‧‧‧

201, 201A, 201B, 201C‧‧‧ Supporting parts

201a, 201Aa, 201Ba, 201Ca

201b, 201Ab, 201Bb, 201Cb

201c‧‧‧Slot

203, 203A, 203B, 203C‧‧‧ heat pipes

203a, 203Aa, 203Ba, 203Ca‧‧‧ the first straight section

203b, 203Ab, 203Bb, 203Cb‧‧‧Second straight section

203c, 203Bc, 203Cc

203ca, 203cb‧‧‧Bend

205, 205A, 205B, 205C‧‧‧ heat dissipation fins

205a‧‧‧through hole

205Ca‧‧‧ incision

210, 210A, 210B, 210C‧‧‧ cooling fan

d1, d2‧‧‧ distance

Lx‧‧‧ size

P, Q‧‧‧ space

PX‧‧‧line spacing

PY‧‧‧Column spacing

W‧‧‧Airflow

1 is an external view illustrating a schematic configuration of a light irradiation device including a heat radiation device according to a first embodiment of the present invention. [Fig. 2] Fig. 2 is a diagram illustrating a configuration of an LED unit provided in a light irradiation device including the heat radiation device according to the first embodiment of the present invention. [Fig. 3] Fig. 3 is a diagram illustrating a configuration of a heat radiation device according to a first embodiment of the present invention. [Fig. 4] Fig. 4 is a diagram showing a state in which a light irradiation device including a heat radiation device according to a first embodiment of the present invention is connected in the X-axis direction. [Fig. 5] Fig. 5 is a diagram showing a state in which a light irradiation device including a heat radiation device according to a first embodiment of the present invention is connected in the X-axis direction and the Y-axis direction. [Fig. 6] Fig. 6 is a diagram illustrating a configuration of a modified example of the heat radiation device according to the first embodiment of the present invention. 7 is an external view illustrating a schematic configuration of a light irradiation device including a heat radiation device according to a second embodiment of the present invention. [Fig. 8] Fig. 8 is a diagram showing a state in which a heat radiating device according to a second embodiment of the present invention is connected. [Fig. 9] Fig. 9 is a diagram illustrating a configuration of a modified example of a heat radiation device according to a second embodiment of the present invention. 10 is an external view illustrating a schematic configuration of a light irradiation device including a heat radiation device according to a third embodiment of the present invention. [Fig. 11] Fig. 11 is a diagram showing a state in which a heat radiating device according to a third embodiment of the present invention is connected. [Fig. 12] Fig. 12 is a diagram illustrating a configuration of a modified example of a heat radiation device according to a third embodiment of the present invention. 13 is an external view illustrating a schematic configuration of a light irradiation device including a heat radiation device according to a fourth embodiment of the present invention. [Fig. 14] Fig. 14 is a diagram showing a state in which a heat radiating device according to a fourth embodiment of the present invention is connected. 15 is a diagram showing a configuration of a modified example of a heat radiation device according to a fourth embodiment of the present invention.

Claims (20)

A heat dissipating device, which is arranged in close contact with a heat source and dissipates the heat of the heat source into the air. The heat dissipating device includes a support member in a plate shape, and a first main surface side is arranged in close contact with the heat source. Is supported by the support member and is thermally engaged with the support member to transfer heat from the heat source; and a plurality of heat dissipation fins are disposed on the second main surface facing the first main surface. In the space, it is thermally connected with the heat pipe to dissipate the heat transferred by the heat pipe. The heat pipe has: a first straight portion thermally joined to the support member; and a second straight portion thermally connected to the plurality of heat sinks. Fins are thermally bonded; and a connecting portion is connected to one end portion of the first straight portion and one end portion of the second straight portion, so that the first straight portion and the second straight portion are connected, wherein The length of the heat pipe in the direction in which the first linear portion extends is the same as or slightly shorter than the length of the support member in the direction in which the first linear portion extends, and the connection portion is near one end portion of the first linear portion. The bent portion has the support member is thermally bonded, the plurality of heat radiation when a direction along said first straight portion extending means are arranged to be coupled to said first main surface in a continuous manner. The heat dissipation device according to claim 1, wherein the heat pipe includes a plurality of the heat pipes, and the first linear portions of the plurality of heat pipes are spaced apart from each other in a direction substantially orthogonal to a direction in which the first linear portions extend. Configured at specific intervals. The heat dissipating device according to claim 2, wherein the second linear portion of the plurality of heat pipes is in a direction substantially parallel to the second main surface and substantially orthogonal to a direction in which the first linear portion extends. It is arranged above the first specific interval. The heat dissipating device according to claim 2, wherein the second linear portion of the plurality of heat pipes is in a direction substantially parallel to the second main surface and substantially orthogonal to a direction in which the first linear portion extends. The second specific interval is longer than the first specific interval. The heat dissipation device according to claim 1, further comprising a fan, which is arranged in a space facing the second main surface and generates airflow in a direction substantially perpendicular to the second main surface. The heat dissipation device according to claim 2, further comprising a fan, which is arranged in a space facing the second main surface and generates airflow in a direction substantially perpendicular to the second main surface. The heat dissipating device according to claim 3, further comprising a fan, which is arranged in a space facing the second main surface and generates airflow in a direction substantially perpendicular to the second main surface. The heat dissipation device according to claim 4, further comprising a fan, which is arranged in a space facing the second main surface and generates airflow in a direction substantially perpendicular to the second main surface. The heat dissipating device according to claim 2, wherein when viewed from a direction in which the first straight portion extends, the position of the second straight portion of each heat pipe is substantially perpendicular to the second main surface. The directions are different from those that are substantially parallel. The heat dissipation device according to claim 9, further comprising a fan, which is arranged in a space facing the second main surface and generates airflow in a direction substantially parallel to the second main surface. The heat dissipating device according to claim 9, wherein the plurality of heat dissipating fins have a cutout portion in a space surrounded by the first straight portion and the second straight portion of the plurality of heat pipes, and the heat dissipating device is more A fan is included, and is arranged in a space formed by the cutout portion to generate an airflow in a direction inclined with respect to the second main surface. The heat sink according to any one of claims 1 to 11, wherein the second straight portion is substantially parallel to the second main surface. The heat sink according to any one of claims 1 to 11, wherein the support member has a groove portion having a shape corresponding to the first straight portion and the bent portion on the second main surface side, and the first A straight portion and the bent portion are arranged so as to fit into the groove portion. A light irradiation device includes: the heat dissipation device according to any one of claims 1 to 13; a substrate arranged to be in close contact with the first main surface; and a plurality of LED elements on the substrate. On the surface, it is arranged substantially parallel to the first linear portion of the heat pipe. The light irradiation device according to claim 14, wherein the plurality of LED elements are arranged at a specific pitch in a direction in which the first straight portion extends, and from the first straight line in a direction in which the first straight portion extends. The distance from the portion to one end of the support member and the distance from the connection portion to the other end of the support member are less than or equal to 1/2 of the pitch. The light irradiation device according to claim 14 or 15, wherein the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to a direction in which the first linear portion extends. The light irradiation device according to claim 14 or 15, wherein the plurality of LED elements are arranged at positions corresponding to the first linear portion via the substrate. The light irradiating device according to claim 14 or 15, wherein the light irradiating device includes a plurality of the heat radiating devices connected in a continuous manner to the first main surface. The light irradiation device according to claim 18, wherein the plurality of heat dissipation devices are aligned and connected in a direction in which the first linear portion extends. The light irradiation device according to claim 14 or 15, wherein the LED element emits light having a wavelength that acts on an ultraviolet curable resin.