CN107388213B

CN107388213B - Heat dissipation device and light irradiation device with same

Info

Publication number: CN107388213B
Application number: CN201710190474.0A
Authority: CN
Inventors: 渡边浩明
Original assignee: Hoya Corp
Current assignee: Hoya Corp
Priority date: 2016-03-31
Filing date: 2017-03-28
Publication date: 2021-01-15
Anticipated expiration: 2037-03-28
Also published as: JP6599379B2; CN107388213A; TWI658235B; KR20170113127A; JP2017187269A; TW201736775A

Abstract

The invention provides a heat sink, which uses a heat pipe to reliably cool the whole supporting component and can be arranged in a linear connection manner. A heat sink for dissipating heat from a heat source into air, comprising: a support member disposed in close contact with the heat source on the 1 st main surface side; a heat pipe thermally coupled to the support member to transfer heat from a heat source; and a plurality of heat radiating fins arranged in a space facing the 2 nd main surface and radiating heat transferred by the heat pipe, the heat pipe including: a 1 st linear portion thermally engaged with the support member; a 2 nd straight portion thermally engaged with the plurality of heat dissipating fins; and a connection portion that connects the 1 st linear portion and the 2 nd linear portion, wherein a length of the heat pipe in a direction in which the 1 st linear portion extends is the same as or slightly shorter than a length of the support member, the connection portion has a bent portion that is thermally joined to the support member in the vicinity of one end portion of the 1 st linear portion, and when the plurality of heat dissipation devices are arranged in the direction in which the 1 st linear portion extends, the connection portion can be connected so that the 1 st main surface is continuous.

Description

Heat dissipation device and light irradiation device with same

Technical Field

The present invention relates to a heat sink for cooling a light source of a light irradiation device, and more particularly, to a heat pipe type heat sink having a heat pipe into which a plurality of heat dissipation fins are inserted, and a light irradiation device having the heat sink.

Background

Currently, as an ink for sheet-fed offset printing, an ultraviolet-curable ink that is cured by irradiation of ultraviolet light is used. In addition, an ultraviolet curable resin is used as an adhesive around an FPD (Flat Panel Display) such as a liquid crystal Panel or an organic EL (Electro Luminescence) Panel. In curing such an ultraviolet-curable ink or an ultraviolet-curable resin, an ultraviolet irradiation device for irradiating ultraviolet light is generally used.

As an ultraviolet irradiation device, an electric lamp type irradiation device using a high-pressure mercury lamp, a mercury xenon lamp, or the like as a Light source is currently known, but in recent years, an ultraviolet irradiation device using an LED (Light Emitting Diode) as a Light source has been developed in place of a current discharge lamp in accordance with the requirements of reduction in power consumption, longer life, and downsizing of the device.

Such an ultraviolet irradiation device using an LED as a light source is described in patent document 1, for example. The ultraviolet light irradiation device described in patent document 1 includes a plurality of light irradiation modules each including a light irradiation device or the like on which a plurality of light emitting elements (LEDs) are mounted. The plurality of light irradiation modules are arranged in a line, and a predetermined region of an irradiation object arranged to face the plurality of light irradiation modules is irradiated with linear ultraviolet light.

Thus, if an LED is used as a light source, most of the supplied power becomes heat, and there is a problem that the light emission efficiency and the lifetime are reduced by the heat generated from the LED itself, and the heat treatment becomes a problem. Therefore, in the ultraviolet irradiation device described in patent document 1, a heat radiation member is disposed on the rear surface of each light irradiation device, and heat generated by the LED is forcibly radiated.

The heat radiating member described in patent document 1 is a heat radiating member of a so-called water cooling type that cools by flowing a refrigerant, and has a problem that the device itself becomes large and a countermeasure against water leakage is necessary because piping for the refrigerant is necessary. Therefore, as a method of achieving high heat dissipation efficiency even though air cooling is performed, a structure using a heat pipe has been proposed (for example, patent document 2).

The light irradiation device described in patent document 2 has a heat pipe and a plurality of heat radiation fins that are inserted and connected to the heat pipe on the back surface side of a light emitting module on which a plurality of light emitting elements (LEDs) are mounted, and is configured to transport heat generated by the LEDs through the heat pipe and radiate the heat from the heat radiation fins into the air.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2015-153771

Patent document 2: japanese patent laid-open No. 2014-038866

Disclosure of Invention

The invention aims to solve the problems that:

according to the heat sink of the light irradiation device disclosed in patent document 2, the heat generated by the LEDs is quickly transferred by the heat pipe and dissipated from the plurality of heat dissipating fins, so that the LEDs are efficiently cooled. Therefore, the performance of the LED can be prevented from being degraded or damaged, and light can be emitted with high luminance. In addition, the heat sink described in patent document 2 is configured such that the heat pipe is bent in the shape of "コ" to transfer heat in the direction opposite to the emission direction of the LED, and therefore the size of the light irradiation device in the direction perpendicular to the emission direction of the LED can be reduced.

However, in the case of the heat sink disclosed in patent document 2, in which the heat pipe is bent in the shape of "コ", if the bent portion of the heat pipe rises from the bottom plate (support member) of the light-emitting module, the cooling capacity of the rising portion is significantly reduced, and therefore, if the bottom plate is to be cooled reliably as a whole, the straight portion of the heat pipe must be disposed in close contact with the entire rear surface of the bottom plate, and the bent portion of the heat pipe may protrude outward of the bottom plate (i.e., outward of the outer shape of the light-emitting module). Further, if the bent portion of the heat pipe protrudes outward from the bottom plate, the heat pipe cannot be disposed close to the arrangement direction of the LEDs (i.e., the direction in which the straight portion of the heat pipe extends), and the light irradiation device cannot be disposed in a linear connection as in the configuration described in patent document 1.

The present invention has been made in view of such circumstances, and an object thereof is to provide a heat sink that can reliably cool the entire bottom plate (support member) using a heat pipe and can be arranged in a linear connection, and to realize a light irradiation device provided with the heat sink.

Means for solving the problems:

in order to achieve the above object, a heat sink according to the present invention is a heat sink which is disposed in close contact with a heat source and dissipates heat of the heat source into air, the heat sink including: a support member having a plate-like shape, the support member being disposed so that a 1 st main surface side thereof is in close contact with the heat source; a heat pipe supported by the support member, thermally engaged with the support member, and transporting heat from the heat source; and a plurality of heat radiation fins which are arranged in a space facing a 2 nd main surface opposite to the 1 st main surface, are in thermal contact with the heat pipe, and radiate heat transferred by the heat pipe, wherein the heat pipe comprises: a 1 st linear portion thermally engaged with the support member; a 2 nd straight portion thermally engaged with the plurality of heat dissipating fins; and a connection portion connected to one end of the 1 st straight portion and one end of the 2 nd straight portion, respectively, so that the 1 st straight portion and the 2 nd straight portion are connected, wherein a length of the heat pipe in an extending direction of the 1 st straight portion is the same as or slightly shorter than a length of the support member in the extending direction of the 1 st straight portion, the connection portion has a bent portion thermally bonded to the support member in the vicinity of the one end of the 1 st straight portion, and when the plurality of heat dissipation devices are arranged in the extending direction of the 1 st straight portion, the connection portion can be connected so that the 1 st main surface is continuous.

According to this configuration, variation in cooling capacity in the direction in which the 1 st straight portion extends is reduced, the substrate can be cooled similarly (substantially uniformly), and the LED elements arranged on the substrate are also cooled substantially uniformly. Therefore, the temperature difference between the LED elements is also reduced, and the fluctuation of the irradiation intensity due to the temperature characteristics is also reduced. Further, since the heat pipe and the heat dissipating fin are configured not to be displaced from the space facing the 2 nd main surface of the support member, the plurality of heat dissipating devices may be connected to each other in the direction in which the 1 st straight portion extends.

Preferably, the heat pipe includes a plurality of heat pipes, and the 1 st straight portion of the plurality of heat pipes is disposed at a 1 st predetermined interval in a direction substantially orthogonal to a direction in which the 1 st straight portion extends.

Preferably, the 2 nd linear portion of the plurality of heat pipes is disposed at a 1 st predetermined interval in a direction substantially parallel to the 2 nd main surface and substantially orthogonal to a direction in which the 1 st linear portion extends.

Preferably, the 2 nd linear portion of the plurality of heat pipes is disposed at a 2 nd predetermined interval longer than the 1 st predetermined interval in a direction substantially parallel to the 2 nd main surface and substantially orthogonal to a direction in which the 1 st linear portion extends.

Further, the fan may be disposed in a space facing the 2 nd main surface, and may generate an air flow in a direction substantially perpendicular to the 2 nd main surface.

Preferably, the position of the 2 nd straight portion of each heat pipe is different between a direction substantially perpendicular to the 2 nd main surface and a direction substantially parallel thereto when viewed from the 1 st straight portion extending direction. In this case, it is preferable to provide a fan which is disposed in the space facing the 2 nd main surface and generates an air flow in a direction substantially parallel to the 2 nd main surface.

Further, the following structure is also possible: the plurality of heat dissipation fins have cutout portions in a space surrounded by the 1 st and 2 nd straight portions of the plurality of heat pipes, and have fans arranged in the space formed by the cutout portions to generate an airflow in a direction inclined with respect to the 2 nd main surface.

Preferably, the 2 nd linear portion is substantially parallel to the 2 nd main surface.

Preferably, the support member has a groove portion on the 2 nd main surface side, the groove portion having a shape corresponding to the 1 st linear portion and the bent portion, and the 1 st linear portion and the bent portion are disposed so as to be fitted into the groove portion.

From another aspect, the light irradiation device of the present invention includes: any one of the above structures

The heat dissipating device of (1); a substrate disposed in close contact with the 1 st main surface; and a plurality of LED elements arranged on the surface of the substrate substantially parallel to the 1 st straight line portion of the heat pipe.

Preferably, the plurality of LED elements are arranged at a predetermined pitch in the direction in which the 1 st linear portion extends, and the distance from the 1 st linear portion to one end of the support member and the distance from the connecting portion to the other end of the support member in the direction in which the 1 st linear portion extends are 1/2 that is equal to or smaller than the pitch.

Preferably, the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to the direction in which the 1 st straight portion extends.

Preferably, the plurality of LED elements are disposed at positions facing the 1 st linear portion with the substrate interposed therebetween.

Preferably, the light irradiation device includes a plurality of heat dissipation devices connected so that the 1 st main surface is continuous. In this case, it is preferable that the plurality of heat sinks are aligned and connected in the direction in which the 1 st straight portion extends.

Preferably, the LED element emits light of a wavelength that acts on the ultraviolet curable resin.

The invention has the following effects:

as described above, the heat sink of the present invention can be arranged in a linear connection, and the entire bottom plate (support member) can be reliably cooled using the heat pipe in the heat sink, and the light irradiation device having the heat sink also has the above-described advantageous effects.

Drawings

Fig. 1 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to embodiment 1 of the present invention.

Fig. 2 is a diagram illustrating a configuration of an LED unit included in a light irradiation device including the heat dissipation device according to embodiment 1 of the present invention.

Fig. 3 is a diagram illustrating a structure of a heat sink according to embodiment 1 of the present invention.

Fig. 4 is a view showing a state in which light irradiation devices having the heat dissipation device according to embodiment 1 of the present invention are connected in the X-axis direction.

Fig. 5 is a diagram showing a state in which a light irradiation device including the heat dissipation device according to embodiment 1 of the present invention is connected in the X-axis direction and the Y-axis direction.

Fig. 6 is a diagram showing a configuration of a modification of the heat sink according to embodiment 1 of the present invention.

Fig. 7 is an external view illustrating a schematic configuration of a light irradiation device including the heat sink according to embodiment 2 of the present invention.

Fig. 8 is a diagram showing a state in which the heat dissipating devices according to embodiment 2 of the present invention are connected.

Fig. 9 is a diagram showing a configuration of a modification of the heat sink according to embodiment 2 of the present invention.

Fig. 10 is an external view illustrating a schematic configuration of a light irradiation device including the heat sink according to embodiment 3 of the present invention.

Fig. 11 is a diagram showing a state in which the heat sinks according to embodiment 3 of the present invention are connected.

Fig. 12 is a diagram showing a configuration of a modification of the heat sink according to embodiment 3 of the present invention.

Fig. 13 is an external view illustrating a schematic configuration of a light irradiation device including the heat sink according to embodiment 4 of the present invention.

Fig. 14 is a diagram showing a state in which the heat dissipating devices according to embodiment 4 of the present invention are connected.

Fig. 15 is a diagram showing a configuration of a modification of the heat sink according to embodiment 4 of the present invention.

Description of reference numerals:

10. 10M, 20M, 30M, 40M light irradiation device

100 LED unit

105 base plate

110 LED element

200. 200M, 200A, 200AM, 200B, 200BM, 200C, 200CM heat abstractor

201. 201A, 201B, 201C support member

201a, 201Aa, 201Ba, 201Ca, 1 st main surface

201b, 201Ab, 201Bb, 201Cb, 2 nd principal plane

201c groove part

203. 203A, 203B, 203C heat pipe

203a, 203Aa, 203Ba, 203Ca No. 1 straight line part

203b, 203Ab, 203Bb, 203Cb No. 2 straight line part

203c, 203Bc, 203Cc connection part

203ca, 203cb bending part

205. 205A, 205B, 205C heat sink fin

205a via hole

205Ca cut part

210. 210A, 210B, 210C cooling fan

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and redundant description thereof will be omitted.

(embodiment 1)

Fig. 1 is an external view illustrating a schematic configuration of a light irradiation device 10 including a heat dissipation device 200 according to embodiment 1 of the present invention. The light irradiation device 10 of the present embodiment is a device mounted on a light source device that cures ultraviolet curable ink used as ink for sheet-fed offset printing or ultraviolet curable resin used as an adhesive in an fpd (flat Panel display) or the like, and the light irradiation device 10 is disposed to face an irradiation object and emits ultraviolet light to a predetermined region of the irradiation object. In this specification, a direction in which the 1 st linear portion 203a of the heat pipe 203 of the heat sink 200 extends is defined as an X-axis direction, a direction in which the 1 st linear portions 203a of the heat pipe 203 are arranged is defined as a Y-axis direction, and a direction orthogonal to the X-axis and the Y-axis is defined as a Z-axis direction. Since the light irradiation device 10 has a different irradiation region depending on the application or specification of the light source device to be mounted, the light irradiation device 10 of the present embodiment can be connected in the X-axis direction and the Y-axis direction (described later in detail).

Structure of the light irradiation device 10:

as shown in fig. 1, the light irradiation device 10 of the present embodiment includes an LED unit 100 and a heat dissipation device 200. Fig. 1a is a front view (view from the downstream side (positive direction side) in the Z-axis direction), fig. 1b is a plan view (view from the downstream side (positive direction side) in the Y-axis direction), fig. 1c is a right side view (view from the downstream side (positive direction side) in the X-axis direction), fig. 1 d is a left side view (view from the upstream side (negative direction side) in the X-axis direction), and fig. 1 e is a rear view (view from the upstream side (negative direction side) in the Z-axis direction) of the light irradiation device 10 according to the present embodiment.

Structure of LED unit 100:

fig. 2 is a diagram illustrating the structure of the LED unit 100 according to the present embodiment, and is an enlarged view of a portion B of fig. 1. As shown in fig. 1(a) and 2, the LED unit 100 includes a rectangular plate-shaped substrate 105 substantially parallel to the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 arranged on the substrate 105.

The substrate 105 is a rectangular wiring substrate made of a material having high thermal conductivity (e.g., copper, aluminum, or aluminum nitride), and 200 LED elements 110 are mounted On the surface of the substrate at 20 (X-axis direction) × 10 rows (Y-axis direction) at predetermined intervals in the X-axis direction and the Y-axis direction, as shown in fig. 1 (a). On the substrate 105, an anode pattern (not shown) and a cathode pattern (not shown) for supplying power to each LED element 110 are formed, and each LED element 110 is electrically connected to the anode pattern and the cathode pattern, respectively. The substrate 105 is electrically connected to an LED driving circuit (not shown) by a wiring cable (not shown), and a driving current is supplied from the LED driving circuit to each LED element 110 via the anode pattern and the cathode pattern.

The LED element 110 is a semiconductor element that receives a drive current from an LED drive circuit and emits ultraviolet light (for example, wavelengths of 365nm, 385nm, 395nm, and 405 nm). In the present embodiment, 20 LED elements 110 are arranged at a predetermined row pitch PX in the X-axis direction, and 10 rows of LED elements 110 are arranged as one row at a predetermined column pitch PY in the Y-axis direction (fig. 2). Therefore, if a drive current is supplied to each

LED element

110, 10 substantially parallel linear ultraviolet light beams are emitted from the LED unit 100 in the X-axis direction. In addition, each of the LED elements 110 of the present embodiment adjusts the drive current supplied to each of the LED elements 110 so as to emit ultraviolet light of substantially the same light amount, and the ultraviolet light emitted from the LED unit 100 has substantially uniform light amount distribution in the X-axis direction and the Y-axis direction. The light irradiation devices 10 of the present embodiment are configured to change the irradiation region by being connected in the X-axis direction and the Y-axis direction, and when the light irradiation devices 10 are connected, the LED elements 110 located at both ends in the X-axis direction are arranged at a position of 1/2PX from the edge of the support member 201 of the heat sink 200, and the LED elements 110 located at both ends in the Y-axis direction are arranged at a position of 1/2PY from the edge of the support member 201 of the heat sink 200, so that the arrangement of the LED elements 110 is continuous between the adjacent light irradiation devices 10 (fig. 2).

Structure of the heat sink 200:

fig. 3 is a diagram illustrating the structure of the heat sink 200 according to the present embodiment. Fig. 3(a) is a sectional view taken along line a-a of fig. 1(C), fig. 3(b) is an enlarged view of portion C of fig. 3(a), and fig. 3(C) is an enlarged view of portion D of fig. 3 (a). The heat sink 200 is disposed in close contact with the back surface (the surface opposite to the surface on which the LED elements 110 are mounted) of the substrate 105 of the LED unit 100, and is a device for dissipating heat generated by the LED elements 110, and is composed of a support member 201, a plurality of heat pipes 203, and a plurality of heat dissipation fins 205. If a drive current flows through each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature rises due to self-heating of the LED element 110, which causes a problem that the light emission efficiency significantly decreases. Therefore, in the present embodiment, the heat sink 200 is provided in close contact with the back surface of the substrate 105, and the heat generated by the LED element 110 is conducted to the heat sink 200 through the substrate 105, thereby forcibly dissipating the heat.

The support member 201 is a plate-like member having a rectangular shape made of metal having high thermal conductivity (e.g., copper, aluminum). The support member 201 is attached to the back surface of the substrate 105 via a heat conductive member such as grease so that the 1 st main surface 201a is in close contact with the back surface, and receives heat generated by the LED unit 100 serving as a heat source. A groove 201c (fig. 1 d and 3) corresponding to the shape of a 1 st straight portion 203a and a bent portion 203ca of a heat pipe 203 described later is formed in a 2 nd main surface 201b (a surface facing the 1 st main surface 201 a) of the support member 201 of the present embodiment, and the heat pipe 203 is supported by the support member 201. Thus, the support member 201 of the present embodiment functions as a heat receiving portion that receives heat from the LED unit 100 while supporting the heat pipe 203.

Heat pipe 203 is a hollow sealed pipe having a substantially circular cross section and filled with a working fluid (e.g., water, ethanol, ammonia, etc.) under reduced pressure, and heat pipe 203 is made of a metal (e.g., a metal such as copper, aluminum, iron, magnesium, or an alloy containing these metals). As shown in fig. 3, each heat pipe 203 of the present embodiment has a substantially reverse コ -shaped shape when viewed from the Y-axis direction, and is composed of: a 1 st linear portion 203a extending in the X-axis direction; a 2 nd linear portion 203b extending in the X axis direction substantially in parallel with the 1 st linear portion 203 a; and a connection portion 203c that connects one end (one end on the downstream side in the X-axis direction (positive direction side)) of the 1 st linear portion 203a and one end (one end on the downstream side in the X-axis direction (positive direction side)) of the 2 nd linear portion 203b so that the 1 st linear portion 203a and the 2 nd linear portion 203b are continuous. The heat pipe 203 of the present embodiment is arranged so as not to be displaced from the space facing the 2 nd main surface 201b of the support member 201 so as not to interfere with each other when the light irradiation devices 10 are coupled.

The 1 st linear portion 203a of each heat pipe 203 is a portion that receives heat from the support member 201, and the 1 st linear portion 203a of each heat pipe 203 is fixed by a fixing member or an adhesive agent (not shown) in a state of being fitted into the groove portion 201c of the support member 201, and is thermally bonded to the support member 201 (fig. 3). In the present embodiment, the 1 st linear portions 203a of the 5 heat pipes 203 are arranged uniformly at predetermined intervals in the Y axis direction (fig. 1c and 1 d).

The 2 nd linear portion 203b of each heat pipe 203 is a portion that dissipates heat received by the 1 st linear portion 203a, and the 2 nd linear portion 203b of each heat pipe 203 is inserted into the through hole 205a of the heat dissipation fin 205 and is mechanically and thermally coupled to the heat dissipation fin 205 (fig. 3). In the present embodiment, the 2 nd linear portions 203b of the 5 heat pipes 203 are arranged in parallel with a predetermined interval in the Y-axis direction (fig. 1c and 1 d). In addition, the length of the 2 nd linear portion 203b of each heat pipe 203 of the present embodiment is substantially equal to the length of the 1 st linear portion 203 a.

The connection portion 203c of each heat pipe 203 extends from one end of the 1 st linear portion 203a toward the upstream side (negative direction side) in the Z axis direction so as to project from the 2 nd main surface 201b of the support member 201, and is connected to one end of the 2 nd linear portion 203 b. That is, the connection portion 203c turns the 2 nd linear portion 203b back so that the 2 nd linear portion 203b is substantially parallel to the 1 st linear portion 203 a. In the vicinity of the 1 st linear portion 203a and the vicinity of the 2 nd linear portion 203b of the connection portion 203c of each heat pipe 203, bent portions 203ca, 203cb are formed so that the connection portion 203c does not buckle. In the present embodiment, the bent portion 203ca is also fixed in a state of being fitted into the groove portion 201c, and is thermally bonded to the support member 201.

The heat radiation fins 205 are members having a rectangular plate shape made of metal (for example, metal such as copper, aluminum, iron, magnesium, or an alloy containing them). As shown in fig. 3, in each heat radiation fin 205 of the present embodiment, a through hole 205a into which the 2 nd linear portion 203b of each heat pipe 203 is inserted is formed. In the present embodiment, 50 fins 205 are inserted in order into the 2 nd linear portion 203b of each heat pipe 203, and are arranged in parallel with a predetermined interval in the X-axis direction. Each fin 205 is mechanically and thermally coupled to the 2 nd straight portion 203b of each heat pipe 203 by welding, soldering, or the like in each through hole 205 a. The heat radiation fins 205 of the present embodiment are arranged so as not to be displaced from the space facing the 2 nd main surface 201b of the support member 201 so as not to interfere with each other when the light irradiation device 10 is coupled.

When a drive current flows through each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature of the LED element 110 rises due to self-heating thereof, but the heat generated by each LED element 110 is rapidly conducted (moved) to the 1 st linear portion 203a of each heat pipe 203 via the substrate 105 and the support member 201. Then, if heat moves to the 1 st straight portion 203a of each heat pipe 203, the working fluid in each heat pipe 203 absorbs the heat and evaporates, and the vapor of the working fluid moves through the connecting portion 203c and the cavity in the 2 nd straight portion 203b, so that the heat of the 1 st straight portion 203a moves to the 2 nd straight portion 203 b. The heat that has moved to the 2 nd linear portion 203b further moves to the plurality of heat radiation fins 205 coupled to the 2 nd linear portion 203b, and is radiated from each heat radiation fin 205 to the air. If heat is radiated from each of the heat radiation fins 205, the temperature of the 2 nd linear portion 203b also decreases, and therefore the vapor of the working fluid in the 2 nd linear portion 203b is also cooled to be returned to liquid, and moves to the 1 st linear portion 203 a. The working fluid moved to the 1 st straight portion 203a is reused for absorbing heat conducted via the substrate 105 and the support member 201.

Thus, in the present embodiment, the working fluid in each heat pipe 203 circulates between the 1 st and 2 nd

linear portions

203a and 203b, so that the heat generated by each LED element 110 rapidly moves to the heat radiation fins 205, and the heat is efficiently radiated from the heat radiation fins 205 to the air. Therefore, the temperature of the LED element 110 does not excessively increase, and the problem of a significant decrease in light emission efficiency does not occur.

Further, the cooling capacity of the heat sink 200 is determined by the heat transport amount of the heat pipe 203 and the heat dissipation amount of the heat dissipation fin 205. Further, if a temperature difference occurs between the LED elements 110 two-dimensionally arranged on the substrate 105, the irradiation intensity fluctuates due to the temperature characteristics, and therefore, from the viewpoint of the irradiation intensity, it is required to uniformly cool the substrate 105 in the X-axis direction and the Y-axis direction, and particularly, in the light irradiation device 10 of the present embodiment, since the LED elements 110 are arranged to the periphery of the end portion of the support member 201 so as to be connectable in the X-axis direction and the Y-axis direction, there is a problem that it is necessary to uniformly cool the LED elements up to the periphery of the end portion of the support member 201.

Therefore, in the heat sink 200 of the present embodiment, the length of each heat pipe 203 in the X axis direction is made equal to or slightly shorter than the length of the support member 201 in the X axis direction, and the 1 st straight portion 203a and the bent portion 203ca of each heat pipe 203 are thermally joined to the support member 201, so that the heat pipes are uniformly cooled in the X axis direction. That is, by adopting a configuration in which the heat from the support member 201 is received by using the 1 st linear portion 203a and the bent portion 203ca of each heat pipe 203, each heat pipe 203 is uniformly cooled down to both ends of the support member 201 in the X axis direction without protruding in the X axis direction. In the Y-axis direction, the plurality of heat pipes 203 are arranged uniformly in the Y-axis direction, and thus the cooling is performed uniformly in the Y-axis direction. As shown in fig. 3(b), the distance d1 from the front end of the 1 st linear portion 203a of each heat pipe 203 to the edge of the support member 201 is preferably equal to or less than 1/2 of the X-axis dimension Lx of the LED element 110 (shown in fig. 2). Similarly, as shown in fig. 3(c), the distance d2 from the bent portion 203ca of each heat pipe 203 to the edge of the support member 201 is preferably equal to or less than 1/2 of the dimension Lx of the LED element 110 in the X-axis direction.

Thus, according to the configuration of the present embodiment, the fluctuation in the cooling capacity is reduced in the Y-axis direction and the X-axis direction, the substrate 105 can be cooled similarly (substantially uniformly), and the 200 LED elements 110 arranged on the substrate 105 can be cooled substantially uniformly. Therefore, the temperature difference between the LED elements 110 is also small, and the fluctuation of the irradiation intensity due to the temperature characteristics is also small. As shown in fig. 1 and 3, the heat pipe 203 and the heat radiating fins 205 of the present embodiment are configured not to be spatially displaced from the 2 nd main surface 201b facing the support member 201, and therefore do not interfere with each other even when the light irradiation device 10 is connected.

Fig. 4 is a diagram showing a state in which the light irradiation device 10 of the present embodiment is connected in the X-axis direction, fig. 4(a) is a plan view (viewed from the downstream side (positive direction side) in the Y-axis direction), and fig. 4(b) is a front view (viewed from the downstream side (positive direction side) in the Z-axis direction). As shown in fig. 4(a), the light irradiation device 10 of the present embodiment is configured such that the heat pipe 203 and the heat radiation fins 205 are not displaced from the space facing the 2 nd main surface 201b of the support member 201, and therefore the support member 201 can be joined and arranged so that the 1 st main surface 201a of the support member 201 is continuous (that is, so that the arrangement of the LED elements 110 is continuous between adjacent light irradiation devices 10). Therefore, the linear irradiation region can be formed in various sizes according to the specification or the application.

Fig. 5 is a diagram showing a state in which the light irradiation device 10 of the present embodiment is connected in the X-axis direction and the Y-axis direction, fig. 5(a) is a plan view (a view viewed from the downstream side (positive direction side) in the Y-axis direction), and fig. 5(b) is a front view (a view viewed from the downstream side (positive direction side) in the Z-axis direction). As shown in fig. 5, the light irradiation device 10 of the present embodiment is configured such that the heat pipe 203 and the heat radiation fins 205 are not displaced from the space facing the 2 nd main surface 201b of the support member 201, and the support member 201 can be joined so as to be arranged in a matrix in such a manner that the 1 st main surface 201a of the support member 201 is continuous (that is, in such a manner that the arrangement of the LED elements 110 is continuous between adjacent light irradiation devices 10). Therefore, the irradiation region can be formed in various sizes according to the specification or the use.

The above is the description of the present embodiment, but the present invention is not limited to the above configuration, and various modifications are possible within the scope of the technical idea of the present invention.

For example, in the heat sink 200 of the present embodiment, as shown in fig. 1, 5 heat pipes 203 and 50 fins 205 are arranged in parallel with a predetermined interval in the Y-axis direction, but the number of heat pipes 203 and fins 205 is not limited to this. The number of the heat radiation fins 205 is determined by the relationship between the amount of heat generated by the LED element 110, the temperature of the air around the heat radiation fins 205, and the like, and is appropriately selected in accordance with the so-called fin area where the heat generated by the LED element 110 can be radiated. The number of the heat pipes 203 is determined by the relationship between the amount of heat generated by the LED element 110, the amount of heat transported by each heat pipe 203, and the like, and is appropriately selected so that the amount of heat generated by the LED element 110 can be sufficiently transported.

In the present embodiment, the LED elements 110 are arranged on the substrate 105 in 20 (X-axis direction) × 10 rows (Y-axis direction) and 5 heat pipes 203 are arranged on the back surface side of the substrate 105, but from the viewpoint of cooling efficiency, it is preferable that each LED element 110 on the substrate 105 is arranged at a position facing the 1 st linear portion 203a of each heat pipe 203.

In the present embodiment, a case where the 1 st linear portion 203a and the 2 nd linear portion 203b of the 5 heat pipes 203 are arranged uniformly with a predetermined interval in the Y axis direction will be described as an example (fig. 1(c) and 1(d)), but the present invention is not limited to this configuration. The interval between the 1 st and 2 nd

linear portions

203a and 203b may be gradually increased (or decreased) in accordance with the arrangement of the LED elements 110.

Further, the heat sink 200 of the present embodiment is described by taking a case of natural air cooling as an example, but a fan for supplying cooling air to the heat sink 200 may be provided to forcibly air-cool the heat sink 200.

(modification 1)

Fig. 6 is a diagram illustrating a light irradiation device 10M including a heat dissipation device 200M according to a modification of the heat dissipation device 200 of the present embodiment. Fig. 6 a is a plan view (view viewed from the downstream side (positive direction side) in the Y-axis direction) of the light irradiation device 10M according to the present modification, and fig. 6 b is a right view (view viewed from the downstream side (positive direction side) in the X-axis direction). As shown in fig. 6, the light irradiation device 10M of the present modification is different from the light irradiation device 10 of the present embodiment in that the heat dissipation device 200M includes the cooling fan 210.

The cooling fan 210 is disposed on the upstream side (negative side) in the Z axis direction of the heat sink 200M, and supplies cooling air to the heat sink 200M. As shown in fig. 6(b), the cooling fan 210 generates an airflow W in a direction perpendicular to the 2 nd main surface 201b of the support member 201 (i.e., the Z-axis direction or a direction opposite to the Z-axis direction). The airflow W generated by the cooling fan 210 flows between the heat radiation fins 205, cools the heat radiation fins 205, and cools the 2 nd linear portion 203b of each heat pipe 203 inserted into each heat radiation fin 205 and the 2 nd main surface 201b of the support member 201. Therefore, according to the structure of the present modification, the cooling capacity of the heat sink 200M can be significantly improved. In addition, the cooling fan 210 may be applied to a structure in which the light irradiation devices 10M are connected as shown in fig. 4 and 5, and in this case, 1 cooling fan 210 may be provided for each

heat dissipation device

200M, or 1 cooling fan 210 may be provided for a plurality of heat dissipation devices 200M.

(embodiment 2)

Fig. 7 is an external view illustrating a schematic configuration of a light irradiation device 20 including a heat dissipation device 200A according to embodiment 2 of the present invention. Fig. 7(a) is a plan view of the light irradiation device 20 of the present embodiment (viewed from the downstream side (positive direction side) in the Y-axis direction), fig. 7(b) is a rear view (viewed from the upstream side (negative direction side) in the Z-axis direction), fig. 7(c) is a right view (viewed from the downstream side (positive direction side) in the X-axis direction), and fig. 7(d) is a left view (viewed from the upstream side (negative direction side) in the X-axis direction). The light irradiation device 20 of the present embodiment is different from the heat dissipation device 200 of embodiment 1 in that the arrangement interval of the 1 st linear portion 203Aa of the heat pipe 203A is narrow and the arrangement interval of the 2 nd linear portion 203Ab is wide. That is, in the heat sink 200A of the present embodiment, the 1 st linear portion 203Aa of each heat pipe 203A is disposed near the center portion of the support member 201A and substantially parallel to the Y axis direction when viewed from the X axis direction, and the 2 nd linear portion 203Ab of each heat pipe 203A is disposed substantially parallel to the Y axis direction with a larger interval than the interval of the 1 st linear portion 203Aa when viewed from the X axis direction. According to this configuration, since the cooling capacity of the central portion of the support member 201A can be improved, it is effective, for example, in the case where the LED elements 110 of the LED unit 100 are arranged so as to be concentrated on the substantially central portion of the substrate 105 in the Y axis direction. In the light irradiation device 20 of the present embodiment, as in the light irradiation device 10 of embodiment 1, since the heat pipe 203A and the heat radiation fins 205A are not displaced from the space facing the 2 nd main surface 201Ab of the support member 201A, the support member 201A may be joined and arranged so that the 1 st main surface 201Aa of the support member 201A is continuous, as shown in fig. 8.

(modification 2)

Fig. 9 is a right side view (view viewed from the downstream side (positive direction side) in the X-axis direction) of the light irradiation device 20M including the heat dissipation device 200AM according to the modification of the heat dissipation device 200A of the present embodiment. As shown in fig. 9, the light irradiation device 20M of the present modification is different from the light irradiation device 20 of the present embodiment in that the heat dissipation device 200AM includes the cooling fan 210A.

The cooling fan 210A is arranged on the upstream side (negative side) in the Z axis direction of the heat sink 200AM, similarly to the cooling fan 210 of modification 1, and supplies cooling air to the heat sink 200 AM. As shown in fig. 7 and 9, in the present modification, since the distance in the Y axis direction of the 2 nd linear portion 203Ab (not shown in fig. 9) is increased, more of the airflow W reaches the 2 nd main surface 201Ab of the support member 201A than in modification 1. Therefore, according to the structure of the present modification, the cooling capacity of the heat sink 200AM can be further improved. In addition, the cooling fan 210A may be applied to a structure in which the light irradiation devices 20M are connected as shown in fig. 8, and in this case, 1 cooling fan 210A may be provided for each heat dissipation device 200AM, or 1 cooling fan 210A may be provided for a plurality of heat dissipation devices 200 AM.

(embodiment 3)

Fig. 10 is an external view illustrating a schematic configuration of a light irradiation device 30 including a heat dissipation device 200B according to embodiment 3 of the present invention. Fig. 10(a) is a plan view of the light irradiation device 30 of the present embodiment (viewed from the downstream side (positive direction side) in the Y-axis direction), fig. 10(b) is a rear view (viewed from the upstream side (negative direction side) in the Z-axis direction), fig. 10(c) is a right view (viewed from the downstream side (positive direction side) in the X-axis direction), and fig. 10(d) is a left view (viewed from the upstream side (negative direction side) in the X-axis direction). The light irradiation device 30 of the present embodiment is different from the heat dissipation device 200 of embodiment 1 in that the position of the 2 nd straight portion 203Bb of each heat pipe 203B is different in the Y axis direction and the Z axis direction when viewed from the X axis direction (fig. 10 d), the length of the connection portion 203Bc of each heat pipe 203B (fig. 10a and 10 c) is different, the heat dissipation fin 205B is formed on the Y axis direction upstream side (negative direction side) of the 2 nd main surface 201Bb of the support member 201B, and the space P is formed on the Y axis direction downstream side (positive direction side) of the 2 nd main surface 201Bb of the support member 201B (fig. 10B, 10c, and 10 d). Therefore, according to this structure, other components (e.g., a cooling fan, an LED driving circuit, etc.) can be arranged in the space P. Further, the 1 st linear portion 203Ba of each heat pipe 203B of the present embodiment is disposed in proximity to the center portion of the support member 201B and substantially parallel to the Y-axis direction when viewed from the X-axis direction, similarly to the heat sink 200A of embodiment 2. Therefore, since the cooling capacity of the central portion of the support member 201B can be improved, it is effective, for example, in the case where the LED elements 110 of the LED unit 100 are arranged so as to be concentrated on the substantially central portion of the substrate 105 in the Y-axis direction. In the light irradiation device 30 of the present embodiment, as in the light irradiation device 10 of embodiment 1, since the heat pipe 203B and the heat radiation fins 205B are not displaced from the space facing the 2 nd main surface 201Bb of the support member 201B, the support member 201B may be joined and arranged so that the 1 st main surface 201Ba of the support member 201B is continuous, as shown in fig. 11.

(modification 3)

Fig. 12 is a right side view (a view seen from the downstream side (positive direction side) in the X axis direction) of a light irradiation device 30M including a heat dissipation device 200BM according to a modification of the heat dissipation device 200B of the present embodiment. As shown in fig. 12, the light irradiation device 30M of the present modification is different from the light irradiation device 30 of the present embodiment in that the heat dissipation device 200BM includes the cooling fan 210B.

The cooling fan 210B is disposed in the space P above the 2 nd main surface 201Bb of the support member 201B, and supplies cooling air to the heat sink 200 BM. As shown in fig. 12, the cooling fan 210B of the present modification generates an airflow W in a direction substantially parallel to the 2 nd main surface 201Bb of the support member 201B (i.e., the Y-axis direction or the direction opposite to the Y-axis direction). The airflow W generated by the cooling fan 210B flows between the heat radiation fins 205B, cools the heat radiation fins 205B, and cools the 2 nd linear portion 203Bb (fig. 10) of each heat pipe 203B inserted into each heat radiation fin 205B. In the present modification, since the positions of the 2 nd straight portions 203Bb (fig. 10) of the heat pipes 203B are different in the Z-axis direction, the airflow W generated by the cooling fan 210B flows accurately to the 2 nd straight portions 203Bb (fig. 10). Therefore, according to the structure of the present modification, the cooling capability of the heat sink 200BM can be significantly improved. In addition, the cooling fan 210B may be applied to the structure for connecting the light irradiation devices 30M as shown in fig. 11, and in this case, 1 cooling fan 210B may be provided for each heat dissipation device 200BM, or 1 cooling fan 210B may be provided for a plurality of heat dissipation devices 200 BM.

(embodiment 4)

Fig. 13 is an external view illustrating a schematic configuration of a light irradiation device 40 including a heat dissipation device 200C according to embodiment 4 of the present invention. Fig. 13(a) is a plan view (view from the Y-axis direction downstream side (positive direction side)) of the light irradiation device 40 of the present embodiment, fig. 13(b) is a rear view (view from the Z-axis direction upstream side (negative direction side)), fig. 13(c) is a right side view (view from the X-axis direction downstream side (positive direction side)), and fig. 13(d) is a left side view (view from the X-axis direction upstream side (negative direction side)). In the light irradiation device 40 of the present embodiment, the position of the 2 nd straight portion 203Cb of each heat pipe 203C is different in the Y-axis direction and the Z-axis direction when viewed from the X-axis direction (fig. 13 (d)). Specifically, the heat dissipation device 200 of embodiment 1 is different from the heat dissipation device 200 of embodiment 1 in that the position in the Z axis direction (i.e., the height from the 2 nd main surface 201 Cb) of the 2 nd straight portion 203Cb of the heat pipe 203C located on the Y axis direction downstream side (positive direction side) is higher than the position in the Z axis direction (i.e., the height from the 2 nd main surface 201 Cb) of the 2 nd straight portion 203Cb of the heat pipe 203C located on the Y axis direction upstream side (negative direction side), the length of the connection portion 203Cc (fig. 13(a) and 13(C)) of each heat pipe 203C is different from each other, and the heat dissipation fin 205C has a cut-out portion 205Ca cut out at a position below each 2 nd straight portion 203Cb, and forms a space Q (fig. 13(C) and 13(d)) surrounded by the cut-out portion 205Ca, each heat pipe 203C, and the 2 nd main surface 201. With this configuration, other components (e.g., a cooling fan, an LED driving circuit, etc.) can be disposed in the space Q. Further, similarly to the heat sink 200A of embodiment 2, the 1 st linear portion 203Ca of each heat pipe 203C of the present embodiment is disposed near the center portion of the support member 201C and substantially parallel to the Y-axis direction when viewed from the X-axis direction. Accordingly, since the cooling capability of the central portion of the support member 201C can be improved, it is effective when, for example, the LED elements 110 of the LED unit 100 are arranged so as to be concentrated in a substantially central portion of the substrate 105 in the Y-axis direction. In the light irradiation device 40 of the present embodiment, the heat pipe 203C and the heat radiation fins 205C are not displaced from the space facing the 2 nd main surface 201Cb of the support member 201C, similarly to the light irradiation device 10 of embodiment 1, and therefore, as shown in fig. 14, the support member 201C may be joined and arranged so that the 1 st main surface 201Ca of the support member 201C is continuous.

(modification 4)

Fig. 15 is a left side view (a view seen from the upstream side (negative direction side) in the X axis direction) of a light irradiation device 40M including a heat dissipation device 200CM according to a modification of the heat dissipation device 200C of the present embodiment. As shown in fig. 15, the light irradiation device 40M of the present modification is different from the light irradiation device 40 of the present embodiment in that the heat dissipation device 200CM includes the cooling fan 210C.

Cooling fan 210C is disposed in space Q surrounded by notch 205Ca, heat pipes 203C, and 2 nd main surface 201Cb, and supplies cooling air to heat sink 200 CM. As shown in fig. 15, the cooling fan 210C of the present modification is disposed so as to face the notch portion 205Ca, and generates an airflow W in a direction inclined with respect to the Y-axis direction and the Z-axis direction. The airflow W generated by the cooling fan 210C flows between the heat radiation fins 205C, cools the heat radiation fins 205C, and cools the 2 nd straight portions 203Cb of the heat pipes 203C inserted into the heat radiation fins 205C. In the present modification, since the 2 nd linear portion 203Cb of each heat pipe 203C is disposed so as to extend along the notch portion 205Ca (i.e., so as to face the cooling fan 210C), the airflow W generated by the cooling fan 210C reliably collides with each 2 nd linear portion 203 Cb. Therefore, according to the structure of the present modification, the cooling capacity of the heat sink 200CM can be significantly improved. In addition, the cooling fan 210C may be applied to a configuration in which the light irradiation devices 40M are connected as shown in fig. 14, and in this case, 1 cooling fan 210C may be provided for each heat sink 200CM, or 1 cooling fan 210C may be provided for a plurality of heat sinks 200 CM.

The embodiments disclosed herein are all illustrative and should not be considered restrictive. The scope of the present invention is defined by the claims, not by the above description, and includes meanings equivalent to the claims and all modifications within the scope.

Claims

1. A heat sink which is disposed in close contact with a heat source and dissipates heat of the heat source into air, the heat sink comprising:

a support member having a plate-like shape, the support member being disposed so that a 1 st main surface side thereof is in close contact with the heat source;

a heat pipe supported by the support member, thermally engaged with the support member, and transporting heat from the heat source; and

a plurality of heat radiating fins which are arranged in a space facing a 2 nd main surface opposite to the 1 st main surface, are thermally joined to the heat pipe, and radiate heat transferred by the heat pipe,

the heat pipe has:

a 1 st linear portion thermally engaged with the support member;

a 2 nd straight portion thermally engaged with the plurality of heat dissipating fins; and

a connection portion connected to one end portion of the 1 st linear portion and one end portion of the 2 nd linear portion, respectively, so that the 1 st linear portion and the 2 nd linear portion are connected, wherein,

the length of the heat pipe in the direction in which the 1 st linear portion extends is the same as or slightly shorter than the length of the support member in the direction in which the 1 st linear portion extends,

the connecting portion has a bent portion thermally engaged with the support member in the vicinity of one end portion of the 1 st linear portion,

the support member has a groove portion having a shape corresponding to the curved portion on the 2 nd main surface side;

when a plurality of heat sinks are arranged in the direction in which the 1 st linear portion extends, the 1 st main surfaces may be connected to each other so as to be continuous.

2. The heat dissipating device of claim 1,

a plurality of the heat pipes are arranged in the heat pipe,

the 1 st straight portion of the plurality of heat pipes is disposed at a 1 st predetermined interval in a direction substantially orthogonal to a direction in which the 1 st straight portion extends.

3. The heat dissipating device of claim 2,

the 2 nd straight portions of the plurality of heat pipes are arranged at the 1 st predetermined interval in a direction substantially parallel to the 2 nd main surface and substantially orthogonal to a direction in which the 1 st straight portion extends.

4. The heat dissipating device of claim 2,

the 2 nd linear portion of the plurality of heat pipes is disposed at a 2 nd predetermined interval longer than the 1 st predetermined interval in a direction substantially parallel to the 2 nd main surface and substantially orthogonal to a direction in which the 1 st linear portion extends.

5. The heat dissipating device of claim 1,

the fan is disposed in a space facing the 2 nd main surface, and generates an air flow in a direction substantially perpendicular to the 2 nd main surface.

6. The heat dissipating device of claim 2,

7. The heat dissipating device of claim 3,

8. The heat dissipating device of claim 4,

9. The heat dissipating device of claim 2,

the position of the 2 nd straight portion of each heat pipe is different in a direction perpendicular to the 2 nd main surface and a direction parallel thereto when viewed from the 1 st straight portion extending direction.

10. The heat dissipating device of claim 9,

the fan is disposed in a space facing the 2 nd main surface, and generates an air flow in a direction substantially parallel to the 2 nd main surface.

11. The heat dissipating device of claim 9,

the plurality of heat dissipation fins have cutout portions in a space surrounded by the 1 st linear portion and the 2 nd linear portion of the plurality of heat pipes,

the fan is disposed in a space formed by the cutout portion, and generates an air flow in a direction inclined with respect to the 2 nd main surface.

12. The heat dissipating device according to any one of claims 1 to 11,

the 2 nd linear portion is substantially parallel to the 2 nd main surface.

13. The heat dissipating device according to any one of claims 1 to 11,

the support member has a groove portion having a shape corresponding to the 1 st linear portion and the curved portion on the 2 nd main surface side,

the 1 st linear portion and the bent portion are disposed so as to be fitted into the groove portion.

14. A light irradiation device is characterized by comprising:

the heat dissipating device of any of claims 1 to 13;

a substrate disposed in close contact with the 1 st main surface; and

and a plurality of LED elements arranged on the surface of the substrate substantially parallel to the 1 st straight line portion of the heat pipe.

15. The light irradiation apparatus according to claim 14,

the plurality of LED elements are arranged at a predetermined pitch in the direction in which the 1 st straight line portion extends,

a distance from the 1 st linear portion to one end of the support member and a distance from the connecting portion to the other end of the support member in a direction in which the 1 st linear portion extends are less than or equal to 1/2 of the pitch.

16. A light irradiation apparatus as set forth in claim 14 or 15,

the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to a direction in which the 1 st straight portion extends.

17. A light irradiation apparatus as set forth in claim 14 or 15,

the plurality of LED elements are disposed at positions facing the 1 st linear portion with the substrate interposed therebetween.

18. A light irradiation apparatus as set forth in claim 14 or 15,

the light irradiation device includes a plurality of the heat dissipation devices connected so that the 1 st main surface is continuous.

19. The light irradiation apparatus according to claim 18,

the plurality of heat sinks are connected in a row in the direction in which the 1 st straight line portion extends.

20. A light irradiation apparatus as set forth in claim 14 or 15,

the LED element emits light of a wavelength that acts on the ultraviolet curable resin.