JP2017187269A - Heat radiation device and light irradiation device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide heat radiation devices capable of being connected in a line while reliably cooling a supporting member as a whole by using a heat pipe.SOLUTION: Heat radiation devices radiating heat of a heat source into air, respectively include a supporting member disposed in a state in which a first main face side is closely kept into contact with the heat source, a heat pipe thermally connected to the supporting member and transporting heat from the heat source, and a plurality of heat radiation fins disposed in a space facing a second main face and radiating heat transported by the heat pipe. The heat pipe has a first straight portion thermally joined to the supporting member, a second straight portion thermally joined to the plurality of heat radiation fins, and a connecting portion connecting the first straight portion and the second straight portion. A length of the heat pipe in an extending direction of the first straight portion is the same as or slightly shorter than a length of the supporting member, the connecting portion has a curved portion thermally joined to the supporting member, near one end portion of the first straight portion, and the plurality of heat radiation devices are connectable in a manner that the first main faces are continued when they are arranged in the extending direction of the first straight portion.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat radiating device for cooling a light source or the like of a light irradiating device, and in particular, a heat pipe type heat radiating device including a heat pipe through which a plurality of heat radiating fins are inserted, and a light radiating device including the heat radiating device. About.

  Conventionally, as an ink for offset sheet-fed printing, an ultraviolet curable ink that is cured by irradiation with ultraviolet light has been used. Further, an ultraviolet curable resin is used as an adhesive around an FPD (Flat Panel Display) such as a liquid crystal panel or an organic EL (Electro Luminescence) panel. In general, an ultraviolet light irradiation device for irradiating ultraviolet light is used for curing such ultraviolet curable ink and ultraviolet curable resin.

  As an ultraviolet light irradiation device, a lamp type irradiation device using a high-pressure mercury lamp, a mercury xenon lamp, or the like as a light source has been conventionally known, but in recent years, there has been a demand for reduction in power consumption, longer life, and downsizing of the device size. Therefore, in place of the conventional discharge lamp, an ultraviolet light irradiation device using an LED (Light Emitting Diode) as a light source has been developed.

  An ultraviolet light irradiation apparatus using such an LED as a light source is described in Patent Document 1, for example. The ultraviolet light irradiation apparatus described in Patent Document 1 includes a plurality of light irradiation modules including a light irradiation device on which a plurality of light emitting elements (LEDs) are mounted. The plurality of light irradiation modules are arranged in a line, and the line-shaped ultraviolet light is irradiated to a predetermined region of the irradiation object arranged to face the plurality of light irradiation modules. .

  As described above, when an LED is used as a light source, most of the input electric power becomes heat, so that there is a problem that light emission efficiency and life are reduced by heat generated by the LED itself, and heat treatment becomes a problem. Therefore, the ultraviolet light irradiation apparatus described in Patent Document 1 employs a configuration in which a heat dissipation member is disposed on the back surface of each light irradiation device to forcibly dissipate heat generated by the LED.

  The heat radiating member described in Patent Document 1 is a so-called water-cooling type that cools by flowing a refrigerant. However, since a refrigerant pipe or the like is required, there is a problem that the apparatus itself becomes large, or water leakage occurs. There are problems such as the need to take countermeasures. Then, the structure using a heat pipe is also proposed as a system which has high heat dissipation efficiency although it is air cooling (for example, patent document 2).

  The light irradiation apparatus described in Patent Document 2 has a heat pipe and a plurality of heat radiation fins that are fitted and connected to the heat pipe on the back side of the light emitting module on which a plurality of light emitting elements (LEDs) are mounted. The heat generated by the LED is transported by a heat pipe, and the heat is dissipated from the radiation fins into the air.

Japanese Patent Laid-Open No. 2015-153771 JP 2014-0388866 A

  According to the heat radiating device of the light irradiation device disclosed in Patent Document 2, the heat generated by the LED is quickly transported by the heat pipe and radiated from a large number of heat radiating fins, so that the LED is efficiently cooled. For this reason, it is possible to prevent degradation and damage of the LED and to emit light with high brightness. Moreover, since the heat radiating device described in Patent Document 2 is configured to bend the heat pipe in a U shape and transport heat in a direction opposite to the LED emission direction, it is perpendicular to the LED emission direction. The size of the light irradiation device in the direction can be made compact.

  However, in the case of a configuration in which the heat pipe is bent in a U shape as in the heat dissipation device of Patent Document 2, if the curved portion of the heat pipe floats from the base plate (support member) of the light emitting module, the floating portion Since the cooling capacity will be significantly reduced, if the entire base plate is to be reliably cooled, the straight part of the heat pipe must be placed in close contact with the entire back surface of the base plate, and the curved part of the heat pipe Has a problem that it protrudes outside the base plate (that is, outside the outer shape of the light emitting module). If the curved portion of the heat pipe protrudes outside the base plate, it cannot be disposed close to the LED alignment direction (that is, the direction in which the straight portion of the heat pipe extends), and is described in Patent Document 1. As in the configuration, the light irradiation devices cannot be connected and arranged in a line.

  The present invention has been made in view of such circumstances, and an object of the present invention is to be able to connect and arrange in a line while reliably cooling the entire base plate (support member) using a heat pipe. A heat dissipating device is provided, and further a light irradiation device including the heat dissipating device is provided.

  In order to achieve the above object, the heat dissipating device of the present invention is a heat dissipating device that is disposed in close contact with the heat source and dissipates the heat of the heat source into the air, has a plate shape, and the first main surface side is the heat source. A support member disposed in close contact with the support member, a heat pipe supported by the support member, thermally bonded to the support member, and transporting heat from a heat source, and a second main surface facing the first main surface A plurality of heat dissipating fins that are disposed in a space facing the surface and thermally bonded to the heat pipe and dissipate heat transported by the heat pipe, and the heat pipe is thermally bonded to the support member The first straight line portion, the second straight line portion thermally bonded to the plurality of radiating fins, the one end portion of the first straight line portion and the second straight line so that the first straight line portion and the second straight line portion are continuous. A connecting portion that connects one end portion of the portion, and heat in a direction in which the first straight portion extends. The length of the ip is the same as or slightly shorter than the length of the support member in the direction in which the first straight portion extends, and the connecting portion is a curve that is thermally joined to the support member in the vicinity of one end of the first straight portion. And when the plurality of heat dissipating devices are arranged in the direction in which the first linear portion extends, the first main surface can be connected so as to be continuous.

  According to such a configuration, there is little variation in the cooling capacity in the direction in which the first linear portion extends, the substrate can be cooled uniformly (substantially uniformly), and the LED elements disposed on the substrate are also substantially omitted. Cools uniformly. Therefore, the temperature difference between the LED elements is small, and the variation in irradiation intensity due to the temperature characteristics is also small. Moreover, since the heat pipe and the heat radiating fin are configured so as not to deviate from the space facing the second main surface of the support member, a plurality of heat radiating devices can be connected even in the direction in which the first straight line portion extends. .

  In addition, it is desirable that a plurality of heat pipes be provided, and the first straight portions of the plurality of heat pipes be arranged at a first predetermined interval in a direction substantially orthogonal to the direction in which the first straight portions extend.

  The second straight portions of the plurality of heat pipes are disposed substantially parallel to the second main surface and at a first predetermined interval in a direction substantially perpendicular to the direction in which the first straight portion extends. Is desirable.

  The second straight portions of the plurality of heat pipes are substantially parallel to the second main surface and are longer than the first predetermined interval in a direction substantially perpendicular to the direction in which the first straight portions extend. It is desirable to arrange them at intervals.

  Moreover, it can also be set as the structure provided with the fan which is arrange | positioned in the space which faces a 2nd main surface, and produces an airflow in the direction substantially perpendicular | vertical with respect to a 2nd main surface.

  In addition, when viewed from the direction in which the first straight line portion extends, it is desirable that the position of the second straight line portion of each heat pipe be different in a direction substantially perpendicular to the second main surface and a direction substantially parallel to the second main surface. In this case, it is desirable to include a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially parallel to the second main surface.

  The plurality of radiating fins have a cutout portion in a space surrounded by the first straight portion and the second straight portion of the plurality of heat pipes, and are disposed in a space formed by the cutout portion. It can also be set as the structure provided with the fan which produces an airflow in the diagonal direction with respect to a main surface.

  Further, it is desirable that the second straight line portion is substantially parallel to the second main surface.

  Further, the support member has a groove portion having a shape corresponding to the first linear portion and the curved portion on the second main surface side, and the first linear portion and the curved portion are disposed so as to fit into the groove portion. It is desirable.

  From another point of view, the light irradiation device according to the present invention includes any one of the above heat dissipation devices, a substrate disposed so as to be in close contact with the first main surface, and a first heat pipe on the surface of the substrate. And a plurality of LED elements arranged substantially in parallel with one straight line portion.

  The plurality of LED elements are arranged at a predetermined pitch in the direction in which the first straight line portion extends, and in the direction in which the first straight line portion extends, the distance from the first straight line portion to one end of the support member, and the support from the connection portion The distance to the other end of the member is desirably 1/2 or less of the pitch.

  Moreover, it is desirable that the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to the direction in which the first straight line portion extends.

  In addition, it is desirable that the plurality of LED elements are arranged at positions facing the first straight portion with the substrate interposed therebetween.

  Moreover, a light irradiation apparatus can be comprised so that the said 1st main surface may be equipped with the said several thermal radiation apparatus connected so that it may continue. In this case, it is desirable that the plurality of heat dissipation devices are arranged and connected in the direction in which the first straight line portion extends.

  Further, it is desirable that the LED element emit light having a wavelength that acts on the ultraviolet curable resin.

  As described above, according to the present invention, a heat radiation device that can be connected and arranged in a line while reliably cooling the entire base plate (supporting member) using a heat pipe, and a light irradiation device including the heat radiation device Is realized.

FIG. 1 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to a first embodiment of the present invention. FIG. 2 is a diagram illustrating the configuration of the LED unit provided in the light irradiation device including the heat dissipation device according to the first embodiment of the present invention. FIG. 3 is a diagram illustrating the configuration of the heat dissipation device according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating a state in which the light irradiation device including the heat dissipation device according to the first embodiment of the present invention is connected in the X-axis direction. FIG. 5 is a diagram illustrating a state in which the light irradiation device including the heat dissipation device according to the first embodiment of the present invention is connected in the X-axis direction and the Y-axis direction. FIG. 6 is a diagram showing a configuration of a modification of the heat dissipation device according to the first embodiment of the present invention. FIG. 7 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to the second embodiment of the present invention. FIG. 8 is a diagram illustrating a state in which the heat dissipating device according to the second embodiment of the present invention is connected. FIG. 9 is a diagram showing a configuration of a modification of the heat dissipation device according to the second embodiment of the present invention. FIG. 10 is an external view illustrating a schematic configuration of a light irradiation apparatus including a heat dissipation device according to the third embodiment of the present invention. FIG. 11 is a diagram illustrating a state in which a heat dissipation device according to the third embodiment of the present invention is connected. FIG. 12 is a diagram showing a configuration of a modification of the heat dissipation device according to the third embodiment of the present invention. FIG. 13: is an external view explaining schematic structure of the light irradiation apparatus provided with the thermal radiation apparatus which concerns on the 4th Embodiment of this invention. FIG. 14 is a diagram illustrating a state in which the heat dissipation device according to the fourth embodiment of the present invention is connected. FIG. 15 is a diagram showing a configuration of a modification of the heat dissipation device according to the fourth embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in a figure, and the description is not repeated.

(First embodiment)
FIG. 1 is an external view illustrating a schematic configuration of a light irradiation device 10 including a heat dissipation device 200 according to the first embodiment of the present invention. The light irradiation device 10 of this embodiment is mounted on a light source device that cures an ultraviolet curable ink used as an ink for offset sheet-fed printing or an ultraviolet curable resin used as an adhesive in an FPD (Flat Panel Display) or the like. It is an apparatus that is arranged to face the irradiation object and emits ultraviolet light to a predetermined area of the irradiation object. In this specification, the direction in which the first straight portion 203a of the heat pipe 203 of the heat dissipation device 200 extends is the X-axis direction, and the direction in which the first straight portions 203a of the heat pipe 203 are aligned is the Y-axis direction, the X-axis, and the Y-axis. A description will be given by defining a direction orthogonal to the Z-axis direction. Since the required irradiation area varies depending on the application and specification of the light source device on which the light irradiation device 10 is mounted, the light irradiation device 10 of the present embodiment is configured to be connectable in the X-axis direction and the Y-axis direction. (Details will be described later).

(Configuration of the light irradiation device 10)
As shown in FIG. 1, the light irradiation device 10 of this embodiment includes an LED unit 100 and a heat dissipation device 200. FIG. 1A is a front view (viewed from the downstream side (positive direction side) in the Z-axis direction) of the light irradiation apparatus 10 of the present embodiment, and FIG. FIG. 1C is a right side view (viewed from the X-axis direction downstream side (positive direction side)). 1 (d) is a left side view (viewed from the upstream side in the X-axis direction (negative direction side)), and FIG. 1 (e) is a rear view (upstream side in the Z-axis direction (negative direction side)). Figure seen from).

(Configuration of LED unit 100)
FIG. 2 is a diagram for explaining the configuration of the LED unit 100 of the present embodiment, and is an enlarged view of a portion B in FIG. As shown in FIG. 1A and FIG. 2, the LED unit 100 includes a rectangular plate-like substrate 105 substantially parallel to the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 arranged on the substrate 105. It is equipped with.

  The substrate 105 is a rectangular wiring substrate formed of a material having high thermal conductivity (for example, copper, aluminum, aluminum nitride). As shown in FIG. In addition, 200 LED elements 110 are mounted on a COB (Chip On Board) in a form of 20 (X-axis direction) × 10 columns (Y-axis direction) with a predetermined interval in the Y-axis direction. An anode pattern (not shown) and a cathode pattern (not shown) for supplying power to each LED element 110 are formed on the substrate 105, and each LED element 110 is electrically connected to the anode pattern and the cathode pattern, respectively. Connected. The substrate 105 is electrically connected to an LED drive circuit (not shown) via a wiring cable (not shown), and each LED element 110 is driven from the LED drive circuit via an anode pattern and a cathode pattern. A current is supplied.

  The LED element 110 is a semiconductor element that emits ultraviolet light (for example, wavelengths 365 nm, 385 nm, 395 nm, and 405 nm) upon receiving a drive current from the LED drive circuit. In the present embodiment, 20 LED elements 110 are arranged at a predetermined row pitch PX in the X-axis direction, and 10 LED elements 110 are arranged at a predetermined column pitch PY in the Y-axis direction with this being one row. (Fig. 2). Therefore, when a drive current is supplied to each LED element 110, ten line-shaped ultraviolet lights substantially parallel to the X-axis direction are emitted from the LED unit 100. In addition, the drive current supplied to each LED element 110 is adjusted so that each LED element 110 of this embodiment emits ultraviolet light with a substantially uniform light amount, and the ultraviolet light emitted from the LED unit 100 is adjusted. Has a substantially uniform light amount distribution in the X-axis direction and the Y-axis direction. Moreover, the light irradiation apparatus 10 of this embodiment is comprised so that an irradiation area can be changed by being connectable in a X-axis direction and a Y-axis direction, and when the light irradiation apparatus 10 is connected. The LED elements 110 located at both ends in the X-axis direction are 1 / 2PX from the edge of the support member 201 of the heat dissipation device 200 so that the LED elements 110 are continuously arranged between the adjacent light irradiation devices 10. The LED elements 110 arranged at the positions and at both ends in the Y-axis direction are arranged at a position of 1/2 PY from the edge of the support member 201 of the heat dissipation device 200 (FIG. 2).

(Configuration of heat dissipation device 200)

  FIG. 3 is a diagram illustrating the configuration of the heat dissipation device 200 of the present embodiment. 3A is a cross-sectional view taken along the line AA in FIG. 1C, FIG. 3B is an enlarged view of a portion C in FIG. 3A, and FIG. It is the D section enlarged view of (a). The heat dissipation device 200 is a device that is disposed so as to be in close contact with the back surface of the substrate 105 of the LED unit 100 (the surface opposite to the surface on which the LED elements 110 are mounted) and dissipates heat generated in each LED element 110. The support member 201, a plurality of heat pipes 203, and a plurality of heat radiation fins 205 are included. When a drive current flows through each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature rises due to self-heating of the LED element 110, and the light emission efficiency is significantly reduced. For this reason, in this embodiment, the heat dissipation device 200 is provided so as to be in close contact with the back surface of the substrate 105, and the heat generated in the LED element 110 is conducted to the heat dissipation device 200 via the substrate 105 to forcibly dissipate heat. ing.

  The support member 201 is a rectangular plate-shaped member formed of a metal having a high thermal conductivity (for example, copper or aluminum). The support member 201 is attached such that the first main surface 201a is in close contact with the back surface of the substrate 105 via a heat conducting member such as grease, and receives heat generated by the LED unit 100 serving as a heat source. On the second main surface 201b (surface facing the first main surface 201a) of the support member 201 of the present embodiment, a groove portion 201c corresponding to the shapes of the first straight portion 203a and the curved portion 203ca of the heat pipe 203 described later is provided. The heat pipe 203 is supported by the support member 201 (FIGS. 1D and 3). As described above, the support member 201 of the present embodiment supports the heat pipe 203 and functions as a heat receiving unit that receives heat from the LED unit 100.

  The heat pipe 203 is a hollow metal (for example, a metal such as copper, aluminum, iron, magnesium, or an alloy containing these) in which a hydraulic fluid (for example, water, alcohol, ammonia, etc.) is sealed under reduced pressure. This is a sealed tube. As shown in FIG. 3, each heat pipe 203 of the present embodiment has a substantially inverted U-shape when viewed from the Y-axis direction, and the first straight portion 203a extending in the X-axis direction. One end (X-axis direction) of the first straight line portion 203a so that the first straight line portion 203a and the second straight line portion 203b are continuous with each other. It is comprised from the connection part 203c which connects the downstream (one end of the positive direction side) and the one end (one end of the X-axis direction downstream side (positive direction side)) of the 2nd linear part 203b. The heat pipes 203 of the present embodiment are arranged so as not to deviate from the space facing the second main surface 201b of the support member 201 so that they do not interfere with each other when the light irradiation device 10 is connected. Yes.

  The first straight portion 203a of each heat pipe 203 is a portion that receives heat from the support member 201, and is not shown in a state where the first straight portion 203a of each heat pipe 203 is fitted in the groove portion 201c of the support member 201. Are fixed by a fixing tool or an adhesive, and are thermally coupled to the support member 201 (FIG. 3). In the present embodiment, the first straight portions 203a of the five heat pipes 203 are evenly arranged at a predetermined interval in the Y-axis direction (FIGS. 1C and 1D).

  The second straight portion 203b of each heat pipe 203 is a portion that radiates heat received by the first straight portion 203a, and the second straight portion 203b of each heat pipe 203 is inserted into the through hole 205a of the heat radiating fin 205, The heat dissipating fins 205 are mechanically and thermally coupled (FIG. 3). In the present embodiment, the second straight portions 203b of the five heat pipes 203 are arranged side by side with a predetermined interval in the Y-axis direction (FIGS. 1C and 1D). In addition, the length of the 2nd linear part 203b of each heat pipe 203 of this embodiment is substantially equal to the length of the 1st linear part 203a.

  The connection portion 203c of each heat pipe 203 extends from one end of the first straight portion 203a to the upstream side in the Z-axis direction (negative direction side) so as to protrude from the second main surface 201b of the support member 201, and the second straight portion It is connected to one end of 203b. That is, the connecting portion 203c folds back the second straight portion 203b so that the second straight portion 203b is substantially parallel to the first straight portion 203a. Curved portions 203ca and 203cb are formed in the vicinity of the first straight portion 203a and the second straight portion 203b of the connection portion 203c of each heat pipe 203 so that the connection portion 203c does not buckle. In the present embodiment, the curved portion 203ca is also fixed in a state of being fitted into the groove portion 201c, and is thermally coupled to the support member 201.

  The heat radiation fin 205 is a member made of a rectangular plate-like metal (for example, a metal such as copper, aluminum, iron, magnesium, or an alloy containing these metals). As shown in FIG. 3, each radiating fin 205 of the present embodiment is formed with a through hole 205a into which the second straight portion 203b of each heat pipe 203 is inserted. In the present embodiment, 50 heat radiating fins 205 are sequentially inserted into the second straight portion 203b of each heat pipe 203, and are arranged side by side with a predetermined interval in the X-axis direction. Each radiating fin 205 is mechanically and thermally coupled to the second straight portion 203b of each heat pipe 203 by welding, soldering, or the like in each through hole 205a. The heat radiation fins 205 of the present embodiment are arranged so as not to deviate from the space facing the second main surface 201b of the support member 201 so that they do not interfere with each other when the light irradiation device 10 is connected. Yes.

  When a drive current flows through each LED element 110 and ultraviolet light is emitted from each LED element 110, the temperature rises due to self-heating of the LED element 110, but the heat generated in each LED element 110 is supported by the substrate 105. It quickly conducts (moves) to the first straight portion 203a of each heat pipe 203 via the member 201. When the heat moves to the first straight portion 203a of each heat pipe 203, the working fluid in each heat pipe 203 absorbs the heat and evaporates, and the vapor of the working fluid is in the connection portion 203c and the second straight portion 203b. Therefore, the heat of the first straight part 203a moves to the second straight part 203b. And the heat which moved to the 2nd linear part 203b moves to the several radiation fin 205 couple | bonded with the 2nd linear part 203b further, and is thermally radiated from the each radiation fin 205 in the air. When heat is radiated from the heat radiation fins 205, the temperature of the second straight line portion 203b also decreases, so that the vapor of the working fluid in the second straight line portion 203b is cooled to return to the liquid and moves to the first straight line portion 203a. Then, the hydraulic fluid that has moved to the first linear portion 203 a is used to newly absorb heat conducted through the substrate 105 and the support member 201.

  As described above, in the present embodiment, the heat generated in each LED element 110 is quickly generated by circulating the working fluid in each heat pipe 203 between the first straight portion 203a and the second straight portion 203b. It moves to the heat radiating fin 205 and efficiently radiates heat from the heat radiating fin 205 into the air. For this reason, the temperature of the LED element 110 does not rise excessively, and the problem that the light emission efficiency significantly decreases does not occur.

  The cooling capacity of the heat dissipation device 200 is determined by the heat transport amount of the heat pipe 203 and the heat dissipation amount of the heat dissipating fins 205. In addition, when a temperature difference occurs between the LED elements 110 arranged two-dimensionally on the substrate 105, variation in irradiation intensity due to temperature characteristics occurs. Therefore, from the viewpoint of irradiation intensity, the substrate 105 is arranged in the X-axis direction. In the light irradiation device 10 of this embodiment, it is configured to be connectable in the X-axis direction and the Y-axis direction, and the end of the support member 201 is required to be uniformly cooled along the Y-axis direction. Since the LED element 110 is disposed up to the periphery of the portion, there is a problem that the periphery of the end portion of the support member 201 must be uniformly cooled.

  Therefore, in the heat dissipation device 200 of the present embodiment, the length of each heat pipe 203 in the X-axis direction is configured to be the same as or slightly shorter than the length of the support member 201 in the X-axis direction. The first straight portion 203a and the curved portion 203ca of the heat pipe 203 are configured to be thermally bonded to the support member 201, thereby cooling uniformly along the X-axis direction. In other words, by using the first straight portion 203a and the curved portion 203ca of each heat pipe 203 to receive heat from the support member 201, each heat pipe 203 does not protrude in the X-axis direction, and the support member. The cooling is uniformly performed on both ends in the X-axis direction of 201. Moreover, about the Y-axis direction, the several heat pipe 203 is arrange | positioned equally in the Y-axis direction, and it is cooling uniformly also along the Y-axis direction. As shown in FIG. 3B, the distance d1 from the tip of the first straight portion 203a of each heat pipe 203 to the edge of the support member 201 is the size of the LED element 110 in the X-axis direction (shown in FIG. 2). It is preferable that it is 1/2 or less of Lx. Similarly, as shown in FIG. 3C, the distance d2 from the curved portion 203ca of each heat pipe 203 to the edge of the support member 201 is ½ or less of the size Lx of the LED element 110 in the X-axis direction. It is preferable.

  As described above, according to the configuration of the present embodiment, there is little variation in the cooling capacity in the Y-axis direction and the X-axis direction, and the substrate 105 can be cooled uniformly (substantially uniformly). The 200 LED elements 110 arranged are also cooled substantially uniformly. Therefore, there is little temperature difference between the LED elements 110, and there is little variation in irradiation intensity due to temperature characteristics. As shown in FIGS. 1 and 3, the heat pipe 203 and the heat radiation fin 205 of the present embodiment are configured so as not to deviate from the space facing the second main surface 201 b of the support member 201. Even if the irradiation apparatus 10 is connected, it does not interfere with each other.

  FIG. 4 is a diagram showing a state in which the light irradiation device 10 of the present embodiment is connected in the X-axis direction, and FIG. 4A is a plan view (viewed from the Y-axis direction downstream side (positive direction side)). FIG. 4B is a front view (viewed from the downstream side (positive direction side) in the Z-axis direction). As shown in FIG. 4A, the light irradiation device 10 of the present embodiment is configured such that the heat pipe 203 and the heat radiation fin 205 do not deviate from the space facing the second main surface 201 b of the support member 201. Therefore, the support member 201 is joined so that the first main surface 201a of the support member 201 is continuous (that is, the arrangement of the LED elements 110 is continuous with the adjacent light irradiation device 10). It is possible to arrange. Therefore, it is possible to form a line-shaped irradiation area of various sizes according to the specifications and applications.

  FIG. 5 is a view showing a state in which the light irradiation device 10 of the present embodiment is connected in the X-axis direction and the Y-axis direction, and FIG. 5A is a plan view (a Y-axis direction downstream side (positive direction side). ) And FIG. 5B is a front view (viewed from the Z-axis direction downstream side (positive direction side)). As shown in FIG. 5, the light irradiation device 10 of the present embodiment is configured so that the heat pipe 203 and the heat radiation fin 205 do not deviate from the space facing the second main surface 201b of the support member 201. The support member 201 is joined and arranged in a matrix so that the first main surface 201a of the support member 201 is continuous (that is, the LED elements 110 are continuously disposed between adjacent light irradiation devices 10). It is possible. Therefore, it is possible to form irradiation areas of various sizes according to specifications and applications.

  The above is the description of the present embodiment, but the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention.

  For example, the heat dissipating device 200 of the present embodiment is configured to include five heat pipes 203 arranged at a predetermined interval in the Y-axis direction and 50 heat dissipating fins 205 as shown in FIG. The numbers of the heat pipes 203 and the heat radiating fins 205 are not limited to this. The number of radiating fins 205 is determined by the relationship between the amount of heat generated by the LED elements 110 and the temperature of the air around the radiating fins 205, and the heat generated by the LED elements 110 can be radiated according to the so-called fin area. It is selected appropriately. The number of heat pipes 203 is determined by the relationship between the amount of heat generated by the LED elements 110 and the amount of heat transported by each heat pipe 203, and is appropriately selected so that the heat generated by the LED elements 110 can be sufficiently transported. Is done.

  Further, in the present embodiment, the LED elements 110 are arranged in a manner of 20 (X-axis direction) × 10 rows (Y-axis direction) on the substrate 105, and five heat pipes 203 are provided on the back side of the substrate 105. However, from the viewpoint of cooling efficiency, it is desirable that each LED element 110 on the substrate 105 is disposed at a position facing the first straight portion 203a of each heat pipe 203.

  In the present embodiment, the first straight portion 203a and the second straight portion 203b of the five heat pipes 203 are described as being equally arranged at a predetermined interval in the Y-axis direction ( 1C and FIG. 1D are not necessarily limited to such a configuration. You may comprise so that the space | interval of the 1st linear part 203a and the 2nd linear part 203b may be gradually expanded (or narrowed) according to arrangement | positioning of the LED element 110. FIG.

  Moreover, although the heat radiating device 200 of this embodiment was demonstrated as what is naturally air-cooled, the fan which supplies a cooling wind to the heat radiating device 200 can also be provided, and the heat radiating device 200 can also be forced air-cooled.

(Modification 1)
FIG. 6 is a diagram illustrating a light irradiation device 10M including a heat dissipation device 200M according to a modification of the heat dissipation device 200 of the present embodiment. 6A is a plan view of the light irradiation apparatus 10M according to the present modification (viewed from the Y axis direction downstream side (positive direction side)), and FIG. 6B is a right side view (X). It is the figure seen from the axial direction downstream side (positive direction side). As shown in FIG. 6, the light irradiation device 10 </ b> M of this modification is different from the light irradiation device 10 of the present embodiment in that the heat dissipation device 200 </ b> M includes a cooling fan 210.

  The cooling fan 210 is a device that is disposed on the upstream side (negative direction side) in the Z-axis direction of the heat dissipation device 200M and supplies cooling air to the heat dissipation device 200M. As shown in FIG. 6B, the cooling fan 210 generates an air flow W in a direction perpendicular to the second main surface 201b of the support member 201 (that is, a direction opposite to the Z-axis direction or the Z-axis direction). To do. The airflow W generated by the cooling fan 210 flows between the heat radiating fins 205 to cool the heat radiating fins 205, and to support and support the second straight portions 203 b of the heat pipes 203 inserted into the heat radiating fins 205. The second main surface 201b of the member 201 is cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200M can be significantly improved. The cooling fan 210 can also be applied to a configuration in which the light irradiation device 10M is connected as shown in FIGS. 4 and 5, and in this case, one cooling fan 210 is provided for each heat dissipation device 200M. Alternatively, one cooling fan 210 may be provided for the plurality of heat dissipation devices 200M.

(Second Embodiment)
FIG. 7 is an external view illustrating a schematic configuration of the light irradiation device 20 including the heat dissipation device 200A according to the second embodiment of the present invention. Fig.7 (a) is a top view (figure seen from the Y-axis direction downstream side (positive direction side)) of the light irradiation apparatus 20 of this embodiment, FIG.7 (b) is a rear view (Z-axis). FIG. 7C is a right side view (viewed from the X-axis direction downstream side (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). The light irradiation device 20 of the present embodiment is a heat dissipation device of the first embodiment in that the arrangement interval of the first straight portions 203Aa of the heat pipe 203A is narrow and the arrangement interval of the second straight portions 203Ab is wide. Different from 200. That is, in the heat dissipation device 200A of the present embodiment, the first straight portion 203Aa of each heat pipe 203A is close to the central portion of the support member 201A and substantially parallel to the Y-axis direction when viewed from the X-axis direction. The second straight portions 203Ab of the heat pipes 203A are arranged substantially parallel to the Y-axis direction at a wider interval than the first straight portion 203Aa when viewed from the X-axis direction. Yes. According to such a configuration, the cooling capacity of the central portion of the support member 201A can be increased. For example, the LED elements 110 of the LED unit 100 are concentrated on the substantially central portion of the substrate 105 in the Y-axis direction. It is effective when Note that, similarly to the light irradiation device 10 of the first embodiment, the light irradiation device 20 of the present embodiment also prevents the heat pipe 203A and the heat radiation fin 205A from deviating from the space facing the second main surface 201Ab of the support member 201A. Therefore, as shown in FIG. 8, it is possible to connect and arrange the support member 201A so that the first main surface 201Aa of the support member 201A is continuous.

(Modification 2)
FIG. 9 is a right side view (a view seen from the downstream side in the X-axis direction (positive direction side)) of the light irradiation device 20M including the heat dissipation device 200AM according to a modification of the heat dissipation device 200A of the present embodiment. As shown in FIG. 9, the light irradiation device 20M of the present modification is different from the light irradiation device 20 of the present embodiment in that the heat dissipation device 200AM includes a cooling fan 210A.

  The cooling fan 210A is a device that is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat radiating device 200AM and supplies cooling air to the heat radiating device 200AM, similarly to the cooling fan 210 of the first modification. As shown in FIGS. 7 and 9, in the present modification, the distance between the second linear portions 203Ab (not shown in FIG. 9) in the Y-axis direction is widened, so that it is more than that in Modification 1. Airflow W reaches the second main surface 201Ab of the support member 201A. Therefore, according to the configuration of the present modification, the cooling capacity of the heat dissipation device 200AM can be further improved. The cooling fan 210A can also be applied to a configuration in which the light irradiation device 20M is connected as shown in FIG. 8, and in this case, one cooling fan 210A may be provided for each heat dissipation device 200AM. One cooling fan 210A may be provided for a plurality of heat dissipation devices 200AM.

(Third embodiment)
FIG. 10 is an external view illustrating a schematic configuration of a light irradiation device 30 including a heat dissipation device 200B according to the third embodiment of the present invention. FIG. 10A is a plan view of the light irradiation device 30 of the present embodiment (viewed from the downstream side in the Y-axis direction (positive direction side)), and FIG. 10B is a rear view (Z-axis). FIG. 10C is a right side view (viewed from the downstream side in the X-axis direction (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). In the light irradiation device 30 of the present embodiment, when viewed from the X-axis direction, the position of the second straight portion 203Bb of each heat pipe 203B is different in the Y-axis direction and the Z-axis direction (FIG. 10 (d)). The lengths of the connecting portions 203Bc (FIGS. 10A and 10C) of the heat pipe 203B are different from each other, and the radiating fins 205B are upstream of the second main surface 201Bb of the support member 201B in the Y-axis direction. The space P (FIG. 10B, FIG. 10C) is formed on the Y axis direction downstream side (positive direction side) of the second main surface 201Bb of the support member 201B. FIG. 10D is different from the heat dissipation device 200 of the first embodiment in that FIG. Therefore, according to such a structure, other components (for example, a cooling fan, an LED drive circuit, etc.) can be arranged in the space P. In addition, the first straight portion 203Ba of each heat pipe 203B of this embodiment is close to the center portion of the support member 201B when viewed from the X-axis direction, similarly to the heat dissipation device 200A of the second embodiment. It is arranged substantially parallel to the axial direction. Therefore, since the cooling capacity of the central part of the support member 201B can be increased, it is effective when, for example, the LED elements 110 of the LED unit 100 are concentrated and arranged in the substantially central part of the substrate 105 in the Y-axis direction. . Further, similarly to the light irradiation apparatus 10 of the first embodiment, the light irradiation apparatus 30 of the present embodiment also prevents the heat pipe 203B and the heat radiation fin 205B from deviating from the space facing the second main surface 201Bb of the support member 201B. Therefore, as shown in FIG. 11, the support member 201B can be joined and connected and arranged so that the first main surface 201Ba of the support member 201B is continuous.

(Modification 3)
FIG. 12 is a right side view of the light irradiation device 30M including the heat dissipation device 200BM according to a modification of the heat dissipation device 200B of the present embodiment (a view seen from the downstream side in the X axis direction (positive direction side)). As shown in FIG. 12, the light irradiation device 30M of this modification is different from the light irradiation device 30 of the present embodiment in that the heat dissipation device 200BM includes a cooling fan 210B.

  The cooling fan 210B is a device that is disposed in the space P on the second main surface 201Bb of the support member 201B and supplies cooling air to the heat dissipation device 200BM. As shown in FIG. 12, the cooling fan 210B of the present modification has an airflow W in a direction substantially parallel to the second main surface 201Bb of the support member 201B (that is, the Y-axis direction or the direction opposite to the Y-axis direction). Is generated. The air flow W generated by the cooling fan 210B flows between the heat radiating fins 205B, cools the heat radiating fins 205B, and also includes the second straight portions 203Bb of the heat pipes 203B inserted into the heat radiating fins 205B (FIG. 10). ). In this modification, since the position of the second straight portion 203Bb (FIG. 10) of each heat pipe 203B is different in the Z-axis direction, the air flow W generated by the cooling fan 210B is changed to each second straight portion 203Bb (FIG. 10). ). Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200BM can be significantly improved. The cooling fan 210B can also be applied to a configuration in which the light irradiation device 30M is connected as shown in FIG. 11, and in this case, one cooling fan 210B may be provided for each heat dissipation device 200BM. Further, one cooling fan 210B may be provided for the plurality of heat dissipation devices 200BM.

(Fourth embodiment)
FIG. 13 is an external view illustrating a schematic configuration of a light irradiation device 40 including a heat dissipation device 200C according to the fourth embodiment of the present invention. Fig.13 (a) is a top view (figure seen from the Y-axis direction downstream side (positive direction side)) of the light irradiation apparatus 40 of this embodiment, FIG.13 (b) is a rear view (Z-axis). FIG. 13C is a right side view (viewed from the X-axis direction downstream side (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). In the light irradiation device 40 of the present embodiment, when viewed from the X-axis direction, the position of the second straight portion 203Cb of each heat pipe 203C is different in the Y-axis direction and the Z-axis direction (FIG. 13 (d)). . Specifically, the position in the Z-axis direction of the second linear portion 203Cb of the heat pipe 203C located on the downstream side (positive direction side) in the Y-axis direction (that is, the height from the second main surface 201Cb) is Y The second straight portion 203Cb of the heat pipe 203C located on the upstream side (negative direction side) in the axial direction is configured to be higher than the position in the Z-axis direction (that is, the height from the second main surface 201Cb). The connecting portions 203Cc (FIGS. 13 (a) and 13 (c)) of the heat pipes 203C are different in length, and the radiating fins 205C are lower than the second straight portions 203Cb. It has a cutout portion 205Ca cut out at a position, and a space Q (FIGS. 13C and 13D) surrounded by the cutout portion 205Ca, each heat pipe 203C, and the second main surface 201Cb is formed. Point, first fruit It differs from the heat dissipation device 200 forms. According to such a configuration, other components (for example, a cooling fan, an LED drive circuit, etc.) can be arranged in the space Q. Note that the first straight portion 203Ca of each heat pipe 203C of this embodiment is close to the center portion of the support member 201C when viewed from the X-axis direction, as in the heat dissipation device 200A of the second embodiment. It is arranged substantially parallel to the axial direction. Therefore, since the cooling capacity of the central part of the support member 201C can be increased, it is effective when, for example, the LED elements 110 of the LED unit 100 are concentrated and arranged at the substantially central part of the substrate 105 in the Y-axis direction. . Further, in the light irradiation device 40 of the present embodiment, similarly to the light irradiation device 10 of the first embodiment, the heat pipe 203C and the heat radiation fin 205C do not deviate from the space facing the second main surface 201Cb of the support member 201C. Therefore, as shown in FIG. 14, it is possible to connect and arrange the support member 201C so that the first main surface 201Ca of the support member 201C is continuous.

(Modification 4)
FIG. 15 is a left side view (a diagram viewed from the upstream side in the X-axis direction (negative direction side)) of the light irradiation device 40M including the heat dissipation device 200CM according to the modification of the heat dissipation device 200C of the present embodiment. As illustrated in FIG. 15, the light irradiation device 40 </ b> M of the present modification is different from the light irradiation device 40 of the present embodiment in that the heat dissipation device 200 </ b> CM includes a cooling fan 210 </ b> C.

  The cooling fan 210C is a device that is arranged in a space Q surrounded by the notch 205Ca, each heat pipe 203C, and the second main surface 201Cb, and supplies cooling air to the heat dissipation device 200CM. As shown in FIG. 15, the cooling fan 210 </ b> C of the present modification is disposed to face the notch 205 </ b> Ca, and generates an airflow W in a direction inclined with respect to the Y-axis direction and the Z-axis direction. The airflow W generated by the cooling fan 210C flows between the heat radiating fins 205C, cools the heat radiating fins 205C, and cools the second straight portions 203Cb of the heat pipes 203C inserted through the heat radiating fins 205C. . In this modification, the second straight portion 203Cb of each heat pipe 203C is arranged along the notch 205Ca (that is, so as to face the cooling fan 210C), and thus the airflow W generated by the cooling fan 210C. Will surely hit each second straight line portion 203Cb. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200CM can be significantly improved. Note that the cooling fan 210C can also be applied to a configuration in which the light irradiation device 40M is connected as shown in FIG. 14, and in this case, one cooling fan 210C may be provided for each heat dissipation device 200CM. Further, one cooling fan 210C may be provided for the plurality of heat dissipation devices 200CM.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

10, 10M, 20, 20M, 30, 30M, 40, 40M Light irradiation device 100 LED unit 105 Substrate 110 LED element 200, 200M, 200A, 200AM, 200B, 200BM, 200C, 200CM Heat dissipation device 201, 201A, 201B, 201C Support member 201a, 201Aa, 201Ba, 201Ca First main surface 201b, 201Ab, 201Bb, 201Cb Second main surface 201c Groove portion 203, 203A, 203B, 203C Heat pipe 203a, 203Aa, 203Ba, 203Ca First straight portion 203b, 203Ab, 203Bb, 203Cb Second straight part 203c, 203Bc, 203Cc Connection part 203ca, 203cb Bending part 205, 205A, 205B, 205C Radiation fin 205a Through hole 205Ca Cutting Part 210,210A, 210B, 210C cooling fan

Claims (17)

A heat dissipating device arranged in close contact with a heat source and dissipating heat of the heat source into the air,
A support member that has a plate-like shape and is arranged so that the first main surface side is in close contact with the heat source;
A heat pipe supported by the support member, thermally joined to the support member, and transporting heat from the heat source;
A plurality of radiating fins disposed in a space facing the second main surface facing the first main surface, thermally joined to the heat pipe, and radiating heat transported by the heat pipe;
With
The heat pipe is
A first straight portion thermally bonded to the support member;
A second straight portion thermally bonded to the plurality of heat dissipating fins;
A connecting portion connecting one end of the first straight portion and one end of the second straight portion so that the first straight portion and the second straight portion are continuous;
Have
The length of the heat pipe in the direction in which the first straight portion extends is the same as or slightly shorter than the length of the support member in the direction in which the first straight portion extends,
The connecting portion has a curved portion that is thermally joined to the support member in the vicinity of one end of the first straight portion,
When arranging a plurality of heat dissipation devices in a direction in which the first linear portion extends, the heat dissipation device can be connected so that the first main surface is continuous. A plurality of the heat pipes are provided,
2. The first straight portion of the plurality of heat pipes is arranged at a first predetermined interval in a direction substantially orthogonal to a direction in which the first straight portion extends. Heat dissipation device.   The second straight portions of the plurality of heat pipes are arranged at a first predetermined interval in a direction substantially parallel to the second main surface and substantially perpendicular to a direction in which the first straight portion extends. The heat dissipating device according to claim 2, wherein   The second straight portions of the plurality of heat pipes are second substantially longer than the first predetermined interval in a direction substantially parallel to the second main surface and substantially perpendicular to a direction in which the first straight portions extend. The heat dissipating device according to claim 2, wherein the heat dissipating device is disposed at a predetermined interval.   5. The fan according to claim 1, further comprising a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially perpendicular to the second main surface. The heat radiating device according to the item.   When viewed from the direction in which the first straight portion extends, the position of the second straight portion of each heat pipe is different in a direction substantially perpendicular to the second main surface and a direction substantially parallel to the second main surface. The heat radiating device according to claim 2.   The heat dissipating device according to claim 6, further comprising a fan that is disposed in a space facing the second main surface and generates an air flow in a direction substantially parallel to the second main surface. The plurality of heat radiating fins have a notch in a space surrounded by the first straight portion and the second straight portion of the plurality of heat pipes,
The heat radiating device according to claim 6, further comprising a fan that is disposed in a space formed by the cutout portion and generates an airflow in an oblique direction with respect to the second main surface.   The heat radiating device according to any one of claims 1 to 8, wherein the second straight portion is substantially parallel to the second main surface. The support member has a groove portion having a shape corresponding to the first straight portion and the curved portion on the second main surface side,
The heat radiating device according to any one of claims 1 to 9, wherein the first straight portion and the curved portion are disposed so as to be fitted into the groove portion. A heat dissipating device according to any one of claims 1 to 10,
A substrate disposed so as to be in close contact with the first main surface;
On the surface of the substrate, a plurality of LED elements arranged substantially parallel to the first straight portion of the heat pipe,
A light irradiation apparatus comprising: The plurality of LED elements are arranged at a predetermined pitch in a direction in which the first linear portion extends,
In a direction in which the first straight line portion extends, a distance from the first straight line portion to one end of the support member and a distance from the connection portion to the other end of the support member are equal to or less than ½ of the pitch. The light irradiation apparatus according to claim 11.   The light irradiation apparatus according to claim 11 or 12, wherein the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to a direction in which the first straight line portion extends.   14. The light irradiation apparatus according to claim 11, wherein the plurality of LED elements are arranged at positions facing the first linear portion with the substrate interposed therebetween.   The light irradiation device according to any one of claims 11 to 14, wherein the light irradiation device includes a plurality of the heat dissipation devices connected so that the first main surface is continuous.   The light irradiation device according to claim 15, wherein the plurality of heat dissipation devices are arranged and connected in a direction in which the first straight line portion extends.   The said LED element emits the light of the wavelength which acts on ultraviolet curable resin, The light irradiation apparatus as described in any one of Claims 11-16 characterized by the above-mentioned.

Images