JP6423900B2 - Heat dissipation device and light irradiation device including the same - Google Patents

Description

  The present invention relates to a heat radiating device for cooling a light source or the like of a light irradiating device, and in particular, a heat pipe type heat radiating device including a heat pipe through which a plurality of radiating fins are inserted, and a light radiating device including the heat radiating device About.

  Conventionally, as an ink for offset sheet-fed printing, an ultraviolet curable ink that is cured by irradiation with ultraviolet light has been used. Further, an ultraviolet curable resin is used as an adhesive around an FPD (Flat Panel Display) such as a liquid crystal panel or an organic EL (Electro Luminescence) panel. In general, an ultraviolet light irradiation device for irradiating ultraviolet light is used for curing such ultraviolet curable ink and ultraviolet curable resin.

  As an ultraviolet light irradiation device, a lamp type irradiation device using a high-pressure mercury lamp, a mercury xenon lamp, or the like as a light source has been conventionally known, but in recent years, there has been a demand for reduction in power consumption, longer life, and downsizing of the device size. Therefore, in place of the conventional discharge lamp, an ultraviolet light irradiation device using an LED (Light Emitting Diode) as a light source has been developed.

  An ultraviolet light irradiation apparatus using such an LED as a light source is described in Patent Document 1, for example. The ultraviolet light irradiation apparatus described in Patent Document 1 includes a plurality of light irradiation modules including a light irradiation device on which a plurality of light emitting elements (LEDs) are mounted. The plurality of light irradiation modules are arranged in a line, and the line-shaped ultraviolet light is irradiated to a predetermined region of the irradiation object arranged to face the plurality of light irradiation modules. .

  As described above, when an LED is used as a light source, most of the input electric power becomes heat, so that there is a problem that light emission efficiency and life are reduced by heat generated by the LED itself, and heat treatment becomes a problem. Therefore, the ultraviolet light irradiation apparatus described in Patent Document 1 employs a configuration in which a heat dissipation member is disposed on the back surface of each light irradiation device to forcibly dissipate heat generated by the LED.

  The heat radiating member described in Patent Document 1 is a so-called water-cooling type that cools by flowing a refrigerant. However, since a refrigerant pipe or the like is required, there is a problem that the apparatus itself becomes large, or water leakage occurs. There are problems such as the need to take countermeasures. Then, the structure using a heat pipe is also proposed as a system which has high heat dissipation efficiency although it is air cooling (for example, patent document 2).

  The light irradiation apparatus described in Patent Document 2 has a heat pipe and a plurality of heat radiation fins that are fitted and connected to the heat pipe on the back side of the light emitting module on which a plurality of light emitting elements (LEDs) are mounted. The heat generated by the LED is transported by a heat pipe, and the heat is dissipated from the radiation fins into the air.

Japanese Patent Laid-Open No. 2015-153771 JP 2014-0388866 A

  According to the heat radiating device of the light irradiation device disclosed in Patent Document 2, the heat generated by the LED is quickly transported by the heat pipe and radiated from a large number of heat radiating fins, so that the LED is efficiently cooled. For this reason, it is possible to prevent degradation and damage of the LED and to emit light with high brightness. Moreover, since the heat radiating device described in Patent Document 2 is configured to bend the heat pipe in a U shape and transport heat in a direction opposite to the LED emission direction, it is perpendicular to the LED emission direction. The size of the light irradiation device in the direction can be made compact.

  However, in the case of a configuration in which the heat pipe is bent in a U shape as in the heat dissipation device of Patent Document 2, if the curved portion of the heat pipe floats from the base plate (support member) of the light emitting module, the floating portion Since the cooling capacity will be significantly reduced, if the entire base plate is to be reliably cooled, the straight part of the heat pipe must be placed in close contact with the entire back surface of the base plate, and the curved part of the heat pipe Has a problem that it protrudes outside the base plate (that is, outside the outer shape of the light emitting module). If the curved portion of the heat pipe protrudes outside the base plate, it cannot be disposed close to the LED alignment direction (that is, the direction in which the straight portion of the heat pipe extends), and is described in Patent Document 1. As in the configuration, the light irradiation devices cannot be connected and arranged in a line.

  The present invention has been made in view of such circumstances, and an object of the present invention is to be able to connect and arrange in a line while reliably cooling the entire base plate (support member) using a heat pipe. A heat dissipating device is provided, and further a light irradiation device including the heat dissipating device is provided.

  In order to achieve the above object, the heat dissipating device of the present invention is a heat dissipating device that is disposed in close contact with the heat source and dissipates the heat of the heat source into the air, has a plate shape, and the first main surface side is the heat source. A support member disposed in close contact with the support member, a heat pipe supported by the support member, thermally bonded to the support member, and transporting heat from a heat source, and a second main surface facing the first main surface A plurality of heat dissipating fins that are disposed in a space facing the surface and thermally bonded to the heat pipe and dissipate heat transported by the heat pipe, and the heat pipe is thermally bonded to the support member The first straight line portion, the second straight line portion thermally bonded to the plurality of radiating fins, the one end portion of the first straight line portion and the second straight line so that the first straight line portion and the second straight line portion are continuous. Connecting to one end of the part and projecting in a direction in which the first straight part extends from the support member And the plurality of heat dissipation devices can be connected such that the first main surface is continuous, and each of the plurality of heat dissipation devices is connected to the plurality of heat dissipation devices in the direction in which the first straight line portion extends. In addition, in the space facing the second main surface, a housing portion for housing the connecting portion of the adjacent heat radiating device is provided.

  According to such a configuration, there is little variation in the cooling capacity in the direction in which the first linear portion extends, the substrate can be cooled uniformly (substantially uniformly), and the LED elements disposed on the substrate are also substantially omitted. Cools uniformly. Therefore, the temperature difference between the LED elements is small, and the variation in irradiation intensity due to the temperature characteristics is also small. Moreover, since the accommodating part which accommodates the connection part which protrudes in the direction where a 1st linear part extends is provided, a several thermal radiation apparatus can be connected also in the direction where a 1st linear part is extended.

  In addition, it is desirable that a plurality of heat pipes be provided, and the first straight portions of the plurality of heat pipes be arranged at a first predetermined interval in a direction substantially orthogonal to the direction in which the first straight portions extend.

  The second straight portions of the plurality of heat pipes are disposed substantially parallel to the second main surface and at a first predetermined interval in a direction substantially perpendicular to the direction in which the first straight portion extends. Is desirable.

  Moreover, it is desirable that the accommodating portion is formed between the heat pipes on the side opposite to the side from which the connecting portion protrudes.

  Moreover, it is desirable that the accommodating portion is formed between the heat pipes on the same side as the side from which the connecting portion protrudes.

  In addition, it is desirable to include a fan that is arranged in a space facing the second main surface and generates an airflow in a direction substantially perpendicular to the second main surface.

  Further, when viewed from the direction in which the first straight line portion extends, the position of the second straight line portion of each heat pipe can be configured to be different in a direction substantially perpendicular to the second main surface and a direction substantially parallel to the second main surface. . In this case, it is desirable to include a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially parallel to the second main surface.

  The first straight portion is inclined with respect to the second main surface, the connecting portion protrudes in a direction away from the second main surface, and the accommodating portion is on a side opposite to the side from which the connecting portion protrudes. It is desirable that it be formed. Further, in this case, the second straight portions of the plurality of heat pipes are arranged at a second predetermined interval longer than the first predetermined interval in a direction substantially orthogonal to the direction in which the first straight portions extend. It is desirable.

  The support member may have at least one pair of substantially parallel opposite sides, and the first straight portion may be configured to extend along the opposite side of the support member.

  Further, the support member may have at least one pair of substantially parallel opposite sides, and the first straight part may be configured to extend at an angle with respect to the opposite side of the support member. In this case, it is desirable that the accommodating portion is formed on the side opposite to the side from which the connecting portion protrudes. In addition, it is desirable to include a fan that is arranged in a space facing the second main surface and generates an airflow in a direction substantially perpendicular to the second main surface.

  Further, it is desirable that the second straight line portion is substantially parallel to the second main surface.

  Moreover, it is desirable that the support member has a groove portion having a shape corresponding to the first straight portion on the second main surface side, and the first straight portion is disposed so as to fit into the groove portion.

  Moreover, it is desirable that the support member has a groove portion having a shape corresponding to the first linear portion on the first main surface side, and the first linear portion is disposed so as to fit into the groove portion.

  From another point of view, the light irradiation device according to the present invention includes any one of the above heat dissipation devices, a substrate disposed so as to be in close contact with the first main surface, and a first heat pipe on the surface of the substrate. It is characterized by comprising a plurality of LEDs arranged substantially in parallel with one straight line portion.

  The plurality of LED elements are arranged at a predetermined pitch in the direction in which the first straight line portion extends, and the distance from the other end of the first straight line portion to one end of the support member is the pitch in the direction in which the first straight line portion extends. It is desirable that it is 1/2 or less.

  Moreover, it is desirable that the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to the direction in which the first straight line portion extends.

  In addition, it is desirable that the plurality of LED elements are arranged at positions facing the first straight portion with the substrate interposed therebetween.

  Moreover, it is desirable that the light irradiation device includes a plurality of heat dissipation devices connected so that the first main surface is continuous. In this case, it is desirable that the plurality of heat dissipation devices are arranged and connected in the direction in which the first straight line portion extends.

  Further, it is desirable that the LED element emit light having a wavelength that acts on the ultraviolet curable resin.

  As described above, according to the present invention, a heat radiation device that can be connected and arranged in a line while reliably cooling the entire base plate (supporting member) using a heat pipe, and a light irradiation device including the heat radiation device Is realized.

FIG. 1 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to a first embodiment of the present invention. FIG. 2 is a perspective view illustrating a schematic configuration of the light irradiation device including the heat dissipation device according to the first embodiment of the present invention. FIG. 3 is a diagram illustrating the configuration of the LED unit provided in the light irradiation device including the heat dissipation device according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating the configuration of the heat dissipation device according to the first embodiment of the present invention. FIG. 5 is a diagram illustrating a state in which the light irradiation device including the heat dissipation device according to the first embodiment of the present invention is connected in the X-axis direction. FIG. 6 is a diagram showing a configuration of a modification of the heat dissipation device according to the first embodiment of the present invention. FIG. 7 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to the second embodiment of the present invention. FIG. 8 is a perspective view illustrating a schematic configuration of a light irradiation apparatus including a heat dissipation device according to the second embodiment of the present invention. FIG. 9 is a diagram illustrating a state in which the heat dissipation devices according to the second embodiment of the present invention are connected. FIG. 10 is a diagram showing a configuration of a modified example of the heat dissipation device according to the second embodiment of the present invention. FIG. 11 is an external view illustrating a schematic configuration of a light irradiation apparatus including a heat dissipation device according to the third embodiment of the present invention. FIG. 12 is a diagram illustrating a state where the heat dissipation device according to the third embodiment of the present invention is connected. FIG. 12 is a diagram showing a configuration of a modification of the heat dissipation device according to the third embodiment of the present invention. FIG. 14 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to the fourth embodiment of the present invention. FIG. 15 is a diagram illustrating a state in which a heat dissipation device according to the fourth embodiment of the present invention is connected. FIG. 16 is a diagram illustrating a configuration of a modified example of the heat dissipation device according to the fourth embodiment of the present invention. FIG. 17 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to the fifth embodiment of the present invention. FIG. 18: is sectional drawing explaining the structure of the thermal radiation apparatus which concerns on the 5th Embodiment of this invention. FIG. 19 is a diagram illustrating a state in which the heat dissipation device according to the fifth embodiment of the present invention is connected. FIG. 20 is a diagram illustrating a configuration of a modification of the heat dissipation device according to the fifth embodiment of the present invention. FIG. 21 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to a sixth embodiment of the present invention. FIG. 22 is a diagram illustrating a state in which the heat dissipation devices according to the sixth embodiment of the present invention are connected. FIG. 23 is a diagram illustrating a configuration of a modification of the heat dissipation device according to the sixth embodiment of the present invention. FIG. 24 is an external view illustrating a schematic configuration of a light irradiation device including a heat dissipation device according to a seventh embodiment of the present invention. FIG. 25 is a cross-sectional view illustrating a configuration of a heat dissipation device according to the seventh embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in a figure, and the description is not repeated.

(First embodiment)
FIG. 1 is an external view illustrating a schematic configuration of a light irradiation device 10 including a heat dissipation device 200 according to the first embodiment of the present invention. FIG. 2 is a perspective view of the light irradiation device 10. The light irradiation device 10 of this embodiment is mounted on a light source device that cures an ultraviolet curable ink used as an ink for offset sheet-fed printing or an ultraviolet curable resin used as an adhesive in an FPD (Flat Panel Display) or the like. It is an apparatus that is arranged to face the irradiation object and emits ultraviolet light to a predetermined area of the irradiation object. In this specification, the direction in which the first straight portion 203a of the heat pipe 203 of the heat dissipation device 200 extends is the X-axis direction, and the direction in which the first straight portions 203a of the heat pipe 203 are aligned is the Y-axis direction, the X-axis, and the Y-axis. A description will be given by defining a direction orthogonal to the Z-axis direction. Since the required irradiation area varies depending on the application and specification of the light source device on which the light irradiation device 10 is mounted, the light irradiation device 10 of the present embodiment is configured to be connectable in the X-axis direction and the Y-axis direction. (Details will be described later).

(Configuration of the light irradiation device 10)
As shown in FIG. 1, the light irradiation device 10 of this embodiment includes an LED unit 100 and a heat dissipation device 200. FIG. 1A is a front view (viewed from the downstream side (positive direction side) in the Z-axis direction) of the light irradiation apparatus 10 of the present embodiment, and FIG. FIG. 1C is a right side view (viewed from the X-axis direction downstream side (positive direction side)). 1 (d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction).

(Configuration of LED unit 100)
FIG. 3 is a diagram illustrating the configuration of the LED unit 100 according to the present embodiment, and is an enlarged view of a portion B in FIG. As shown in FIG. 1A and FIG. 3, the LED unit 100 includes a rectangular plate-like substrate 105 substantially parallel to the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 arranged on the substrate 105. It is equipped with.

  The substrate 105 is a rectangular wiring substrate formed of a material having high thermal conductivity (for example, copper, aluminum, aluminum nitride). As shown in FIG. In addition, 200 LED elements 110 are mounted on a COB (Chip On Board) in a form of 20 (X-axis direction) × 10 columns (Y-axis direction) with a predetermined interval in the Y-axis direction. An anode pattern (not shown) and a cathode pattern (not shown) for supplying power to each LED element 110 are formed on the substrate 105, and each LED element 110 is electrically connected to the anode pattern and the cathode pattern, respectively. Connected. The substrate 105 is electrically connected to an LED drive circuit (not shown) via a wiring cable (not shown), and each LED element 110 is driven from the LED drive circuit via an anode pattern and a cathode pattern. A current is supplied.

  The LED element 110 is a semiconductor element that emits ultraviolet light (for example, wavelengths 365 nm, 385 nm, 395 nm, and 405 nm) upon receiving a drive current from the LED drive circuit. In the present embodiment, 20 LED elements 110 are arranged at a predetermined row pitch PX in the X-axis direction, and 10 LED elements 110 are arranged at a predetermined column pitch PY in the Y-axis direction with this being one row. (Fig. 3). Therefore, when a drive current is supplied to each LED element 110, ten line-shaped ultraviolet lights substantially parallel to the X-axis direction are emitted from the LED unit 100. In addition, the drive current supplied to each LED element 110 is adjusted so that each LED element 110 of this embodiment emits ultraviolet light with a substantially uniform light amount, and the ultraviolet light emitted from the LED unit 100 is adjusted. Has a substantially uniform light amount distribution in the X-axis direction and the Y-axis direction. Moreover, the light irradiation apparatus 10 of this embodiment is comprised so that an irradiation area can be changed by being connectable in a X-axis direction and a Y-axis direction, and when the light irradiation apparatus 10 is connected. The LED elements 110 located at both ends in the X-axis direction are 1 / 2PX from the edge of the support member 201 of the heat dissipation device 200 so that the LED elements 110 are continuously arranged between the adjacent light irradiation devices 10. The LED elements 110 that are disposed at both ends in the Y-axis direction are disposed at a position of 1/2 PY from the edge of the support member 201 of the heat dissipation device 200 (FIG. 3).

(Configuration of heat dissipation device 200)

  FIG. 4 is a diagram illustrating the configuration of the heat dissipation device 200 of the present embodiment. 4A is a cross-sectional view taken along the line AA in FIG. 1C, and FIG. 4B is an enlarged view of a portion C in FIG. 4A. The heat dissipating device 200 is disposed so as to be in close contact with the back surface of the substrate 105 (the surface opposite to the surface on which the LED element 110 (FIG. 1A) is mounted), and dissipates heat generated in each LED element 110. It is a device, and includes a support member 201, a plurality of heat pipes 203, and a plurality of heat radiation fins 205. When a drive current flows through each LED element 110 (FIG. 3) and ultraviolet light is emitted from each LED element 110, the temperature rises due to the self-heating of the LED element 110, and the light emission efficiency is significantly reduced. . For this reason, in this embodiment, the heat dissipation device 200 is provided so as to be in close contact with the back surface of the substrate 105, and the heat generated in the LED element 110 is conducted to the heat dissipation device 200 via the substrate 105 to forcibly dissipate heat. ing.

The support member 201 is a rectangular plate-shaped member formed of a metal having a high thermal conductivity (for example, copper or aluminum). The support member 201 is attached such that the first main surface 201a is in close contact with the back surface of the substrate 105 via a heat conducting member such as grease, and receives heat generated by the LED unit 100 serving as a heat source. On the second main surface 201b (surface facing the first main surface 201a) of the support member 201 of the present embodiment, a groove portion 201c corresponding to the shape of the first straight portion 203a of the heat pipe 203 to be described later is formed in the X-axis direction. The heat pipe 203 is supported by the support member 201. FIG. As described above, the support member 201 of the present embodiment supports the heat pipe 203 and functions as a heat receiving unit that receives heat from the LED unit 100. Further, as shown in FIGS. 1D and 2, when the light irradiation device 10 is connected to the both sides in the Y axis direction of each groove portion 201 c in the X axis direction, the heat pipe 203 of the adjacent light irradiation device 10. A groove 201d for accommodating the curved portion 203ca (FIG. 4) is formed.

  The heat pipe 203 is a hollow metal (for example, a metal such as copper, aluminum, iron, magnesium, or an alloy containing these) in which a hydraulic fluid (for example, water, alcohol, ammonia, etc.) is sealed under reduced pressure. This is a sealed tube. As shown in FIG. 4, each heat pipe 203 of the present embodiment has a substantially inverted U-shape when viewed from the Y-axis direction, and the first straight portion 203a extending in the X-axis direction. One end (X-axis direction) of the first straight line portion 203a so that the first straight line portion 203a and the second straight line portion 203b are continuous with each other. It is comprised from the connection part 203c which connects the downstream (one end of the positive direction side) and the one end (one end of the X-axis direction downstream side (positive direction side)) of the 2nd linear part 203b.

  The first straight portion 203a of each heat pipe 203 is a portion that receives heat from the support member 201, and is not shown in a state where the first straight portion 203a of each heat pipe 203 is fitted in the groove portion 201c of the support member 201. Are fixed by a fixing tool or an adhesive, and are thermally coupled to the support member 201 (FIG. 4). In the present embodiment, the first straight portions 203a of the five heat pipes 203 are equally arranged at a predetermined interval in the Y-axis direction (FIGS. 1D and 2). As shown in FIG. 4, the length of the first straight portion 203a of each heat pipe 203 of the present embodiment is substantially equal to the length of the support member 201 in the X-axis direction.

  The second straight portion 203b of each heat pipe 203 is a portion that radiates heat received by the first straight portion 203a, and the second straight portion 203b of each heat pipe 203 is inserted into the through hole 205a of the heat radiating fin 205, The heat dissipating fins 205 are mechanically and thermally coupled (FIG. 4). In the present embodiment, the second straight portions 203b of the five heat pipes 203 are arranged side by side at a predetermined interval in the Y-axis direction (FIGS. 1D and 2). In addition, the length of the 2nd linear part 203b of each heat pipe 203 of this embodiment is substantially equal to the length of the 1st linear part 203a.

  As shown in FIG. 4, the connection portion 203c of each heat pipe 203 protrudes from the support member 201 in the X-axis direction, extends from one end of the first straight portion 203a to the upstream side in the Z-axis direction (negative direction side), It is connected to one end of the two straight line portions 203b. That is, the connecting portion 203c folds back the second straight portion 203b so that the second straight portion 203b is substantially parallel to the first straight portion 203a. Curved portions 203ca and 203cb are formed in the vicinity of the first straight portion 203a and the second straight portion 203b of the connection portion 203c of each heat pipe 203 so that the connection portion 203c does not buckle.

The heat radiation fin 205 is a member made of a rectangular plate-like metal (for example, a metal such as copper, aluminum, iron, magnesium, or an alloy containing these metals). As shown in FIG. 4, each radiating fin 205 of the present embodiment is formed with a through hole 205a into which the second straight portion 203b of each heat pipe 203 is inserted. In the present embodiment, 50 heat radiating fins 205 are sequentially inserted into the second straight portion 203b of each heat pipe 203, and are arranged side by side with a predetermined interval in the X-axis direction. Each radiating fin 205 is mechanically and thermally coupled to the second straight portion 203b of each heat pipe 203 by welding, soldering, or the like in each through hole 205a. The heat radiation fins 205 of the present embodiment are arranged so as not to deviate from the space facing the second main surface 201b of the support member 201 so that they do not interfere with each other when the light irradiation device 10 is connected. Yes. Further, as shown in FIGS. 1D and 2, the light irradiation device 10 is connected in the X- axis direction to the 10 radiation fins 205 located on the upstream side (negative direction side) in the X- axis direction. Sometimes, a notch 205c extending in the Z-axis direction is formed in order to form the accommodating portion S for accommodating the connecting portion 203c of the heat pipe 203 of the adjacent light irradiation device 10. The notches 205c are arranged between the heat pipes 203 and both ends of the heat dissipating fins 205 in the Y-axis direction corresponding to the grooves 201d of the support member 201, and are accommodated in a space surrounded by the grooves 201d and the notches 205c. S is formed.

  When a drive current flows through each LED element 110 (FIG. 3) and ultraviolet light is emitted from each LED element 110, the temperature rises due to self-heating of the LED element 110, but the heat generated in each LED element 110 is It quickly conducts (moves) to the first straight portion 203a of each heat pipe 203 via the substrate 105 and the support member 201. Then, as shown in FIG. 4, when the heat moves to the first linear portion 203a of each heat pipe 203, the working fluid in each heat pipe 203 absorbs the heat and evaporates, and the vapor of the working fluid is connected to the connecting portion 203c. In order to move through the cavity in the 2nd straight part 203b, the heat of the 1st straight part 203a moves to the 2nd straight part 203b. And the heat which moved to the 2nd linear part 203b moves to the several radiation fin 205 couple | bonded with the 2nd linear part 203b further, and is thermally radiated from the each radiation fin 205 in the air. When heat is radiated from the heat radiation fins 205, the temperature of the second straight line portion 203b also decreases, so that the vapor of the working fluid in the second straight line portion 203b is cooled to return to the liquid and moves to the first straight line portion 203a. Then, the hydraulic fluid that has moved to the first linear portion 203 a is used to newly absorb heat conducted through the substrate 105 and the support member 201.

  As described above, in the present embodiment, the heat generated in each LED element 110 is quickly generated by circulating the working fluid in each heat pipe 203 between the first straight portion 203a and the second straight portion 203b. It moves to the heat radiating fin 205 and efficiently radiates heat from the heat radiating fin 205 into the air. For this reason, the temperature of the LED element 110 does not rise excessively, and the problem that the light emission efficiency significantly decreases does not occur.

  The cooling capacity of the heat dissipation device 200 is determined by the heat transport amount of the heat pipe 203 and the heat dissipation amount of the heat dissipating fins 205. In addition, when a temperature difference occurs between the LED elements 110 arranged two-dimensionally on the substrate 105, variation in irradiation intensity due to temperature characteristics occurs. Therefore, from the viewpoint of irradiation intensity, the substrate 105 is arranged in the X-axis direction. In the light irradiation device 10 of this embodiment, it is configured to be connectable in the X-axis direction and the Y-axis direction, and the end of the support member 201 is required to be uniformly cooled along the Y-axis direction. Since the LED element 110 is disposed up to the periphery of the portion, there is a problem that the periphery of the end portion of the support member 201 must be uniformly cooled.

  Therefore, in the heat dissipation device 200 of the present embodiment, the length of the first straight portion 203a of each heat pipe 203 is configured to be the same as or slightly shorter than the length of the support member 201 in the X-axis direction. Thus, cooling is performed uniformly along the X-axis direction. That is, the first linear portion 203a of each heat pipe 203 is configured to reliably receive heat from the support member 201 across both ends in the X-axis direction, so that it extends over both ends in the X-axis direction of the support member 201. To cool evenly. Moreover, about the Y-axis direction, the several heat pipe 203 is arrange | positioned equally in the Y-axis direction, and it is cooling uniformly also along the Y-axis direction. In addition, as shown in FIG.4 (b), the distance d1 from the front-end | tip of the 1st linear part 203a of each heat pipe 203 to the edge of the supporting member 201 is the size of the X-axis direction of LED element 110 (shown in FIG. 3). It is preferable that it is 1/2 or less of Lx.

  Thus, according to the configuration of the present embodiment, there is little variation in cooling capacity in the Y-axis direction and the X-axis direction, and the substrate 105 (shown in FIG. 3) can be cooled uniformly (substantially uniformly). The 200 LED elements 110 disposed on the substrate 105 are also cooled substantially uniformly. Therefore, there is little temperature difference between the LED elements 110, and there is little variation in irradiation intensity due to temperature characteristics. As shown in FIG. 4, the connection portion 203 c of the heat pipe 203 of the present embodiment is configured to protrude in the X-axis direction, but is accommodated on the side opposite to the side from which the connection portion 203 c protrudes. Since the part S is formed (FIG. 2), even if the light irradiation apparatus 10 is connected, it does not interfere with each other.

  FIG. 5 is a view showing a state in which the light irradiation device 10 of the present embodiment is connected in the X-axis direction, and FIG. 5A is a rear view (viewed from the upstream side in the Z-axis direction (negative direction side)). 5 (b) is a plan view (viewed from the Y axis direction downstream side (positive direction side)), and FIG. 5 (c) is a front view (Z axis direction downstream side ( It is a view as seen from the positive direction side). As shown in FIG. 5, in the light irradiation device 10 of the present embodiment, the connection portion 203 c of the heat pipe 203 protruding in the X-axis direction from each light irradiation device 10 is accommodated in the accommodation portion S of the adjacent light irradiation device 10. By arranging in such a manner, the first main surface 201a of the support member 201 can be connected and arranged so as to be continuous. Therefore, it is possible to form a line-shaped irradiation area of various sizes according to the specifications and applications. As shown in FIG. 2, in the present embodiment, since each accommodating portion S is formed between each heat pipe 203 and at both ends in the Y-axis direction, the adjacent light irradiation devices 10 are arranged in the Y-axis direction. (FIG. 5 (a)), but as shown in FIG. 5 (c), except for the LED elements 110 located at both ends in the Y-axis direction, between adjacent light irradiation devices 10. The LED elements 110 can be arranged so as to be continuous.

  The above is the description of the present embodiment, but the present invention is not limited to the above configuration, and various modifications can be made within the scope of the technical idea of the present invention.

  For example, the heat dissipating device 200 of the present embodiment is configured to include five heat pipes 203 arranged at a predetermined interval in the Y-axis direction and 50 heat dissipating fins 205 as shown in FIG. The numbers of the heat pipes 203 and the heat radiating fins 205 are not limited to this. The number of radiating fins 205 is determined by the relationship between the amount of heat generated by the LED elements 110 and the temperature of the air around the radiating fins 205, and the heat generated by the LED elements 110 can be radiated according to the so-called fin area. It is selected appropriately. The number of heat pipes 203 is determined by the relationship between the amount of heat generated by the LED elements 110 and the amount of heat transported by each heat pipe 203, and is appropriately selected so that the heat generated by the LED elements 110 can be sufficiently transported. Is done.

  Further, in the present embodiment, the LED elements 110 are arranged in a manner of 20 (X-axis direction) × 10 rows (Y-axis direction) on the substrate 105, and five heat pipes 203 are provided on the back side of the substrate 105. However, from the viewpoint of cooling efficiency, it is desirable that each LED element 110 on the substrate 105 is disposed at a position facing the first straight portion 203a of each heat pipe 203.

  In the present embodiment, the first straight portion 203a and the second straight portion 203b of the five heat pipes 203 are described as being equally arranged at a predetermined interval in the Y-axis direction ( FIG. 1D and FIG. 2) are not necessarily limited to such a configuration. The distance between the first straight line portion 203a and the second straight line portion 203b is limited to the extent that the accommodating portion S can be formed (that is, the distance between the first straight line portion 203a and the second straight line portion 203b is larger than the outer diameter of the connecting portion 203c) If the connecting portion 203c can be accommodated in the accommodating portion S, it may be configured to gradually expand (or narrow).

  Moreover, although the heat radiating device 200 of this embodiment was demonstrated as what is naturally air-cooled, the fan which supplies a cooling wind to the heat radiating device 200 can also be provided, and the heat radiating device 200 can also be forced air-cooled.

(Modification 1)
FIG. 6 is a view showing a light irradiation device 10M including a heat dissipation device 200M according to a modification of the heat dissipation device 200 of the present embodiment, and is a right side view of the light irradiation device 10M of the present modification (downstream side in the X-axis direction). (Viewed from the positive direction side). As shown in FIG. 6, the light irradiation device 10 </ b> M of this modification is different from the light irradiation device 10 of the present embodiment in that the heat dissipation device 200 </ b> M includes a cooling fan 210.

  The cooling fan 210 is a device that is disposed on the upstream side (negative direction side) in the Z-axis direction of the heat dissipation device 200M and supplies cooling air to the heat dissipation device 200M. As illustrated in FIG. 6, the cooling fan 210 generates an air flow W in a direction perpendicular to the second main surface 201 b of the support member 201 (that is, a direction opposite to the Z-axis direction or the Z-axis direction). The airflow W generated by the cooling fan 210 flows between the heat radiating fins 205 to cool the heat radiating fins 205, and the second straight portions 203 b of the heat pipes 203 inserted into the heat radiating fins 205 (FIG. 1). (B)) and the second main surface 201b of the support member 201 are cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200M can be significantly improved. The cooling fan 210 can also be applied to a configuration in which the light irradiation device 10 is connected as shown in FIG. 5. In this case, one cooling fan 210 may be provided for each heat dissipation device 200. One cooling fan 210 may be provided for a plurality of heat dissipation devices 200.

(Second Embodiment)
FIG. 7 is an external view illustrating a schematic configuration of the light irradiation device 20 including the heat dissipation device 200A according to the second embodiment of the present invention. Fig.7 (a) is a top view (figure seen from the Y-axis direction downstream side (positive direction side)) of the light irradiation apparatus 20 of this embodiment, FIG.7 (b) is a rear view (Z-axis). FIG. 7C is a right side view (viewed from the X-axis direction downstream side (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). FIG. 8 is a perspective view of the light irradiation device 20 of the present embodiment. In the light irradiation device 20 according to the present embodiment, notches 205Ac are formed in 10 radiation fins 205A located on the downstream side (positive direction side) in the X-axis direction (FIGS. 7C and 8), A groove 201Ad is formed at the end of the support member 201A on the downstream side in the X-axis direction (positive direction side), and an accommodating portion S for accommodating the connecting portion 203Ac of the heat pipe 203A of the adjacent light irradiation device 10 is provided. This is different from the heat dissipating device 200 of the first embodiment in that the connecting portion 203Ac is formed on the protruding side (that is, between the connecting portions 203Ac). Further, as shown in FIG. 7D, in this embodiment, when the arrangement interval of the heat pipes 203A in the Y-axis direction is P, the positions of the heat pipes 203A are the support members 201A and the radiation fins. It differs from the heat dissipation device 200 of the first embodiment in that it is offset to the downstream side (positive direction side) in the Y-axis direction by a distance corresponding to P / 4 with respect to the center line CX of 205A.

  FIG. 9 is a diagram showing a state in which the light irradiation device 20 of the present embodiment is connected in the X-axis direction, and FIG. 9A is a rear view (viewed from the upstream side in the Z-axis direction (negative direction side)). FIG. 9B is a plan view (viewed from the downstream side in the Y-axis direction (positive direction side)), and FIG. 9C is a front view (downstream side in the Z-axis direction ( It is a view as seen from the positive direction side). As shown in FIG.8 and FIG.9, in the light irradiation apparatus 20 of this embodiment, since the accommodating part S is formed in the side (namely, between connection part 203Ac) where the connection part 203Ac protrudes, it is connected. The light irradiation device 20 (second and fourth light irradiation devices 20 from the right side in FIG. 9) and the connection portion 203Ac on the upstream side in the X-axis direction (in FIG. 9, the portion 203Ac is directed downstream in the X-axis direction (positive direction side)). The light irradiation device 20 (the first and third light irradiation devices 20 from the right side in FIG. 9) directed toward the negative direction side can be connected as a set. That is, the light irradiation device 20 with the connecting portion 203Ac directed downstream in the X axis direction (positive direction side) and the light irradiation device 20 with the connection portion 203Ac directed downstream in the X axis direction (positive direction side) Since the directions of 180 ° are different, the positions of the heat pipes 203A of both are separated by a distance corresponding to P / 2, and each of the light irradiation devices 20 of the other light irradiation device 20 is separated from the housing portion S of the one light irradiation device 20. The heat pipe 203A is fitted, and each heat pipe 203A of the one light irradiation device 20 is fitted in the housing portion S of the other light irradiation device 20, and both are joined without shifting in the Y-axis direction. Accordingly, when the support members 201A of the pair of light irradiation devices 20 are joined, the first main surface 201Aa of the support member 201A is connected and disposed so that the LED elements 110 are disposed between the pair of light irradiation devices 20. Are arranged to be continuous. And as shown in FIG. 9, the light irradiation apparatus 20 and the connection part 203Ac which orient | assigned the connection part 203Ac to the X-axis direction downstream (positive direction side) were faced to the X-axis direction upstream (negative direction side). In a state where the light irradiation devices 20 are connected as a set, each heat pipe 203A does not protrude in the X-axis direction, and therefore, a plurality of sets of light irradiation devices 20 can be further connected in the X-axis direction.

(Modification 2)
FIG. 10 is a left side view of the light irradiation device 20M including the heat dissipation device 200AM according to the modification of the heat dissipation device 200A of the present embodiment (viewed from the upstream side in the X axis direction (negative direction side)). As shown in FIG. 10, the light irradiation device 20M of the present modification is different from the light irradiation device 20 of the present embodiment in that the heat dissipation device 200AM includes a cooling fan 210A.

  The cooling fan 210A is a device that is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat radiating device 200AM and supplies cooling air to the heat radiating device 200AM, similarly to the cooling fan 210 of the first modification. The airflow W generated by the cooling fan 210A flows between the heat radiating fins 205A, cools the heat radiating fins 205A, and supports the second straight portions 203Ab of the heat pipes 203A inserted into the heat radiating fins 205A and the support. The second main surface 201Ab of the member 201A is cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200AM can be significantly improved. The cooling fan 210A can also be applied to a configuration in which the light irradiation device 20 is connected as shown in FIG. 9, and in this case, one cooling fan 210A may be provided for each heat dissipation device 200A. One cooling fan 210A may be provided for a plurality of heat dissipation devices 200A.

(Third embodiment)
FIG. 11 is an external view illustrating a schematic configuration of a light irradiation device 30 including a heat dissipation device 200B according to the third embodiment of the present invention. Fig.11 (a) is a top view (figure seen from the Y-axis direction downstream side (positive direction side)) of the light irradiation apparatus 30 of this embodiment, FIG.11 (b) is a rear view (Z-axis). FIG. 11C is a right side view (viewed from the downstream side in the X-axis direction (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). In the light irradiation device 30 of the present embodiment, when viewed from the X-axis direction, the position of the second linear portion 203Bb of each heat pipe 203B is different in the Y-axis direction and the Z-axis direction (FIG. 11 (d)). The lengths of the connecting portions 203Bc (FIGS. 11A and 11C) of the heat pipe 203B are different from each other, and the radiating fins 205B are upstream of the second main surface 201Bb of the support member 201B in the Y-axis direction. Space Q (FIG. 11 (b), FIG. 11 (c), on the Y axis direction downstream side (positive direction side) of the second main surface 201Bb of the support member 201B. 11 (d)) is different from the heat dissipation device 200 of the first embodiment in that it is formed. In the present embodiment, the length of the second straight portion 203Bb of each heat pipe 203B is shorter than the first straight portion 203Ba, and is upstream in the X-axis direction from the tip of the second straight portion 203Bb ( A housing part S for housing the connection part 203Bc of the heat pipe 203B of the adjacent light irradiation device 30 is formed on the negative direction side. Further, when the light irradiation device 30 is connected in the X-axis direction to the end of the second main surface 201Bb of the support member 201B on the upstream side in the X-axis direction (negative direction side), the adjacent light irradiation device 30 is connected. A groove 201Bd for accommodating the curved portion 203Bca of the heat pipe 203B is formed adjacent to the tip of the first straight portion 203Ba of each heat pipe 203B. According to such a configuration, other components (for example, a cooling fan, an LED drive circuit, etc.) can be arranged in the space Q. Further, the light irradiation device 30 of the present embodiment is also provided with a housing portion S for housing the connection portion 203Bc of the heat pipe 203B of the adjacent light irradiation device 30 as in the light irradiation device 10 of the first embodiment. Therefore, as shown in FIG. 12, it is possible to join and arrange the support member 201B so that the first main surface 201Ba of the support member 201B is continuous. In addition, in this embodiment, since groove part 201Bd is formed between each heat pipe 203B, the adjacent light irradiation apparatus 30 becomes the arrangement | positioning shifted to the Y-axis direction (FIG. 12 (a), FIG. 12). (C)).

(Modification 3)
FIG. 13 is a right side view (a diagram seen from the downstream side in the X-axis direction (positive direction side)) of the light irradiation device 30M including the heat dissipation device 200BM according to a modification of the heat dissipation device 200B of the present embodiment. As shown in the drawing, the light irradiation device 30M of the present modification is different from the light irradiation device 30 of the present embodiment in that the heat dissipation device 200BM includes a cooling fan 210B.

  The cooling fan 210B is a device that is disposed in the space Q on the second main surface 201Bb of the support member 201B and supplies cooling air to the heat dissipation device 200BM. As shown in FIG. 13, the cooling fan 210B of the present modification has an air flow W in a direction substantially parallel to the second main surface 201Bb of the support member 201B (that is, the Y-axis direction or the direction opposite to the Y-axis direction). Is generated. The air flow W generated by the cooling fan 210B flows between the heat radiating fins 205B, cools the heat radiating fins 205B, and also includes second linear portions 203Bb (see FIG. 11) of the heat pipes 203B inserted through the heat radiating fins 205B. (A)) is cooled. In this modification, since the position of the second straight portion 203Bb of each heat pipe 203B is different in the Z-axis direction, the air flow W generated by the cooling fan 210B surely hits each second straight portion 203Bb. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200BM can be significantly improved. The cooling fan 210B can also be applied to a configuration in which the light irradiation device 30 is connected as shown in FIG. 12, and in this case, one cooling fan 210B may be provided for each heat dissipation device 200B. Further, one cooling fan 210B may be provided for the plurality of heat dissipation devices 200B.

(Fourth embodiment)
FIG. 14 is an external view illustrating a schematic configuration of a light irradiation device 40 including a heat dissipation device 200C according to the fourth embodiment of the present invention. FIG. 14A is a plan view (a view seen from the downstream side (positive direction side) in the Y-axis direction) of the light irradiation device 40 of the present embodiment, and FIG. 14B is a rear view (Z-axis). FIG. 14C is a right side view (viewed from the downstream side in the X-axis direction (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). As shown in FIG. 14B, in the light irradiation device 40 of the present embodiment, the first straight portion 203Ca of each heat pipe 203C is inclined with respect to the X-axis direction, and the first straight portion 203Ca and the second straight portion 203Ca. It differs from the heat dissipation device 200 of the first embodiment in that the straight line portion 203Cb is in a twisted position. In the present embodiment, the position of the groove 201Cd that houses the curved portion 203Cca of the heat pipe 203C of the adjacent light irradiation device 40 is inclined by inclining the first straight portion 203Ca of each heat pipe 203C with respect to the X-axis direction. Shifted in the Y-axis direction. That is, the groove 201Cd is formed adjacent to the tip of the first straight portion 203Ca of each heat pipe 203C, but by inclining the first straight portion 203Ca of each heat pipe 203C with respect to the X-axis direction, The position of the groove part 201Cd in the Y-axis direction is configured to substantially coincide with the position of the curved part 203Cca of each heat pipe 203C. Specifically, as shown in FIG. 14B, at the end of the support member 201C on the upstream side in the X-axis direction (negative direction side), the tip of the first straight portion 203Ca of each heat pipe 203C is connected to each heat. The pipe 203C is configured to be inclined by a distance corresponding to ½ of the arrangement pitch P of the pipe 203C, and the inclination angle θ of the first straight portion 203Ca with respect to the X-axis direction is the length of the support member 201C in the X-axis direction. When L is L and the arrangement pitch of the heat pipes 203C is P, it can be expressed by the following equation (1).
θ = tan ⁻¹ {(P / 2) ÷ (L)} (1)

  Also in the present embodiment, the length of the second straight portion 203Cb of each heat pipe 203C is shorter than the first straight portion 203Ca, and is upstream in the X-axis direction from the tip of the second straight portion 203Cb ( A housing portion S for housing the connecting portion 203Cc of the heat pipe 203C of the adjacent light irradiation device 40 is formed on the negative direction side. Accordingly, as in the light irradiation device 10 of the first embodiment, the light irradiation device 40 of the present embodiment is joined to the support member 201C and the first main surface 201Ca of the support member 201C is continuous as shown in FIG. It is possible to connect and arrange so as to. In the present embodiment, the position of the groove 201Cd in the Y-axis direction is configured to substantially coincide with the position of the curved portion 203Cca of each heat pipe 203C, so that the adjacent light irradiation device 40 is shifted in the Y-axis direction. It is joined without doing.

(Modification 4)
FIG. 16 is a left side view (a diagram viewed from the upstream side in the X-axis direction (negative direction side)) of the light irradiation device 40M including the heat dissipation device 200CM according to the modification of the heat dissipation device 200C of the present embodiment. As illustrated in FIG. 16, the light irradiation device 40 </ b> M of the present modification is different from the light irradiation device 40 of the present embodiment in that the heat dissipation device 200 </ b> CM includes a cooling fan 210 </ b> C.

  Like the cooling fan 210 of the first modification, the cooling fan 210C is a device that is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat dissipation device 200CM and supplies cooling air to the heat dissipation device 200CM. The airflow W generated by the cooling fan 210C flows between the heat radiating fins 205C to cool the heat radiating fins 205C, and at the same time, the second straight portions 203Cb (see FIG. 14) of the heat pipes 203C inserted through the heat radiating fins 205C. (A)) and the second main surface 201Cb of the support member 201C are cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200CM can be significantly improved. Note that the cooling fan 210C can be applied to a configuration in which the light irradiation device 40 is connected as shown in FIG. 15, and in this case, one cooling fan 210C may be provided for each heat dissipation device 200C. Further, one cooling fan 210C may be provided for the plurality of heat dissipation devices 200C.

(Fifth embodiment)
FIG. 17 is an external view illustrating a schematic configuration of a light irradiation device 50 including a heat dissipation device 200D according to the fifth embodiment of the present invention. 17A is a plan view of the light irradiation device 50 of the present embodiment (viewed from the downstream side in the Y axis direction (positive direction side)), and FIG. 17B is a rear view (Z axis). FIG. 17C is a right side view (viewed from the X-axis direction downstream side (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). FIG. 18 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 18, in the light irradiation device 50 of the present embodiment, when viewed from the Y-axis direction, the first straight portion 203Da of each heat pipe 203D is in the second main surface 201Db (that is, the X-axis direction). It is inclined with respect to the heat radiation device 200 of the first embodiment in that the connection portion 203Dc of each heat pipe 203D protrudes in a direction away from the second main surface 201Db. In addition, as shown in FIG. 17, in the present embodiment, the length of the second straight line portion 203Db of each heat pipe 203D is shorter than the first straight line portion 203Da, and from the tip of the second straight line portion 203Db. Also, an accommodation portion S for accommodating the connection portion 203Dc of the heat pipe 203D of the adjacent light irradiation device 50 is formed on the upstream side (negative direction side) in the X-axis direction (FIGS. 17A and 17). (B)). That is, in the present embodiment, the first straight portion 203Da of each heat pipe 203D is inclined with respect to the second main surface 201Db, whereby the connection portion 203Dc of each heat pipe 203D is Z-axis more than the second main surface 201Db. The first straight line of each heat pipe 203D is configured to be positioned on the upstream side in the direction (negative direction side), specifically, at the end on the downstream side in the X-axis direction (positive direction side) of the support member 201D. The base end of the portion 203Da is configured to be inclined by a distance corresponding to the outer diameter of each heat pipe 203D, and the inclination angle θ of the first straight portion 203Da with respect to the X-axis direction is the X-axis direction of the support member 201D. If the length is L and the outer diameter of each heat pipe 203D is D, it can be expressed by the following equation (2).
θ = tan ⁻¹ {(D / 2) ÷ (L)} (2)

  Since the light irradiation device 50 of the present embodiment is also formed with an accommodating portion S for accommodating the connecting portion 203Dc of the heat pipe 203D of the adjacent light irradiation device 50, similarly to the light irradiation device 10 of the first embodiment. As shown in FIG. 19, it is possible to connect and arrange the support member 201D so that the first main surface 201Da of the support member 201D is continuous. In addition, in this embodiment, since connection part 203Dc is located in Z-axis direction upstream (negative direction side) rather than 2nd main surface 201Db, it interferes with support member 201D of the adjacent light irradiation apparatus 50. The two are joined without shifting in the Y-axis direction.

(Modification 5)
FIG. 20 is a right side view (a view seen from the downstream side in the X-axis direction (positive direction side)) of the light irradiation device 50M including the heat dissipation device 200DM according to a modification of the heat dissipation device 200D of the present embodiment. As shown in FIG. 20, the light irradiation device 50M of the present modification is different from the light irradiation device 50 of the present embodiment in that the heat dissipation device 200DM includes a cooling fan 210D.

  The cooling fan 210D is a device that is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat dissipation device 200DM and supplies cooling air to the heat dissipation device 200DM, like the cooling fan 210 of the first modification. The airflow W generated by the cooling fan 210D flows between the heat radiating fins 205D to cool the heat radiating fins 205D, and at the same time, the second straight portions 203Db (see FIG. 17) of the heat pipes 203D inserted through the heat radiating fins 205D. (A)) and the second main surface 201Db of the support member 201D are cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200DM can be significantly improved. Note that the cooling fan 210D can also be applied to a configuration in which the light irradiation device 50 is connected as shown in FIG. 19, and in this case, one cooling fan 210D may be provided for each heat dissipation device 200D. Further, one cooling fan 210D may be provided for the plurality of heat dissipation devices 200D.

(Sixth embodiment)
FIG. 21 is an external view illustrating a schematic configuration of a light irradiation device 60 including a heat dissipation device 200E according to the sixth embodiment of the present invention. FIG. 21A is a plan view of the light irradiation device 60 of the present embodiment (viewed from the Y axis direction downstream side (positive direction side)), and FIG. 21B is a rear view (Z axis). FIG. 21C is a right side view (viewed from the downstream side in the X-axis direction (positive direction side)), and FIG. d) is a left side view (a view seen from the upstream side (negative direction side) in the X-axis direction). As shown in FIG. 21, the light irradiation device 60 of the present embodiment is the fifth in that the arrangement interval of the first straight portions 203Ea of the heat pipe 203E is narrower than the arrangement interval of the second straight portions 203Eb. Different from the heat dissipation device 200D of the embodiment. That is, in the heat dissipation device 200E of the present embodiment, the first straight portion 203Ea of each heat pipe 203E is close to the center portion of the support member 201E and substantially parallel to the Y-axis direction when viewed from the X-axis direction. The second straight portions 203Eb of the heat pipes 203E are arranged substantially parallel to the Y-axis direction with an interval wider than that of the first straight portions 203Ea when viewed from the X-axis direction. Yes. According to such a configuration, since the cooling capacity of the central portion of the support member 201E can be increased, for example, the LED elements 110 shown in FIG. 1A are concentrated in the substantially central portion of the substrate 105 in the Y-axis direction. It is effective when it is arranged. In addition, the light irradiation apparatus 60 of this embodiment is also provided with a housing portion S for housing the connection portion 203Ec of the heat pipe 203E of the adjacent light irradiation apparatus 60, similarly to the light irradiation apparatus 50 of the fifth embodiment. Therefore, as shown in FIG. 22, it is possible to connect and arrange the support member 201E so that the first main surface 201Ea of the support member 201E is continuous.

(Modification 6)
FIG. 23 is a right side view (a diagram seen from the downstream side in the X-axis direction (positive direction side)) of the light irradiation device 60M including the heat dissipation device 200EM according to a modification of the heat dissipation device 200E of the present embodiment. As shown in FIG. 23, the light irradiation device 60M of the present modification is different from the light irradiation device 60 of the present embodiment in that the heat dissipation device 200EM includes a cooling fan 210E.

  The cooling fan 210E is a device that is arranged on the upstream side (negative direction side) in the Z-axis direction of the heat radiating device 200EM and supplies cooling air to the heat radiating device 200EM, similarly to the cooling fan 210D of Modification 5. The airflow W generated by the cooling fan 210E flows between the heat radiating fins 205E, cools the heat radiating fins 205E, and at the same time the second straight portions 203Eb of the heat pipes 203E inserted into the heat radiating fins 205E (FIG. 21). (A)) and the second main surface 201Eb of the support member 201E are cooled. Therefore, according to the configuration of this modification, the cooling capacity of the heat dissipation device 200EM can be significantly improved. Note that the cooling fan 210E can also be applied to a configuration in which the light irradiation device 60 is connected as shown in FIG. 22, and in this case, one cooling fan 210E may be provided for each heat dissipation device 200E. Further, one cooling fan 210E may be provided for the plurality of heat dissipation devices 200E.

(Seventh embodiment)
FIG. 24 is an external view illustrating a schematic configuration of a light irradiation device 70 including a heat dissipation device 200F according to the seventh embodiment of the present invention. FIG. 24A is a plan view of the light irradiation device 70 of the present embodiment (viewed from the Y axis direction downstream side (positive direction side)), and FIG. 24B is a right side view (X). FIG. 24C is a left side view (viewed from the upstream side in the X-axis direction (negative direction side)). FIG. 25 is a cross-sectional view taken along the line AA in FIG. As shown in FIGS. 24C and 25, in the light irradiation device 70 of the present embodiment, the groove portion 201F in which the first linear portion 203Fa of the heat pipe 203F fits is formed on the first main surface 201Fa side of the support member 201F. This is different from the heat dissipation device 200 of the first embodiment in that the first straight portion 203Fa of the heat pipe 203F has a substantially semicircular cross section. That is, in the present embodiment, not only the first main surface 201Fa of the support member 201F but also the first straight portion 203Fa of each heat pipe 203F is configured to be in close contact with the substrate 105 of the LED unit 100. Therefore, in this embodiment, the thermal resistance between the LED unit 100 and each heat pipe 203F becomes very small compared to the case of the first embodiment, and the cooling capacity is remarkably improved. Therefore, this is particularly effective when there are many LED elements 110 (FIG. 1) arranged on the substrate 105. In the light irradiation device 70 of the present embodiment, similarly to the light irradiation device 10 of the first embodiment, the support member 201F is joined and the first main surface 201Fa of the support member 201F is connected and arranged. In order to accommodate the connecting portions 203Fc of the heat pipes 203F of the adjacent light irradiation device 70, the ten heat dissipating fins 205F located on the upstream side (negative direction side) in the X-axis direction can be accommodated. In order to form the storage portion S, a notch 205Fc extending in the Z-axis direction is formed. The configuration of the present embodiment can also be applied to the second to sixth embodiments and the first to sixth modifications.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

10, 10M, 20, 20M, 30, 30M, 40, 40M, 50, 50M, 60, 60M, 70 Light irradiation device 100 LED unit 105 Substrate 110 LED element 200, 200M, 200A, 200AM, 200B, 200BM, 200C, 200CM, 200D, 200DM, 200E, 200EM, 200F Heat dissipation device 201, 201A, 201B, 201C, 201D, 201E, 201F Support member 201a, 201Aa, 201Ba, 201Ca, 201Da, 201Ea, 201Fa First main surface 201b, 201Ab, 201Bb , 201Cb, 201Db, 201Eb second main surface 201c, 201Fc groove portions 201d, 201Ad, 201Bd, 201Cd, 201Dd, 201Ed groove portions 203, 203A, 203B, 203C, 203D, 203E, 203F Heat pipes 203a, 203Aa, 203Ba, 203Ca, 203Da, 203Ea, 203Fa First straight part 203b, 203Ab, 203Bb, 203Cb, 203Db, 203Eb Second straight part 203c, 203Ac, 203Bc, 203Cc, 203Dc, 203Ec , 203Fc Connection portion 203ca, 203cb, 203Bca, 203Cca Bending portion 205, 205A, 205B, 205C, 205D, 205E, 205F Radiation fin 205a Through hole 205c, 205Ac, 205Fc Notch 210, 210A, 210B, 210C, 210D, 210E, 210F cooling fan

Claims (24)

A heat dissipating device arranged in close contact with a heat source and dissipating heat of the heat source into the air,
A support member that has a plate-like shape and is arranged so that the first main surface side is in close contact with the heat source;
A heat pipe supported by the support member, thermally joined to the support member, and transporting heat from the heat source;
A plurality of radiating fins disposed in a space facing the second main surface facing the first main surface, thermally joined to the heat pipe, and radiating heat transported by the heat pipe;
With
The heat pipe is
A first straight portion thermally bonded to the support member;
A second straight portion thermally bonded to the plurality of heat dissipating fins;
One end portion of the first straight portion and one end portion of the second straight portion are connected so that the first straight portion and the second straight portion are continuous, and the first straight portion extends from the support member. A connecting part protruding in the direction,
Have
A plurality of heat dissipation devices can be connected so that the first main surface is continuous,
Each of the plurality of heat dissipating devices includes the connecting portion of the adjacent heat dissipating device in a space facing the second main surface when the plurality of heat dissipating devices are coupled in a direction in which the first linear portion extends. A heat dissipating device comprising a housing portion for housing the heat sink. A plurality of the heat pipes;
2. The first straight portion of the plurality of heat pipes is arranged at a first predetermined interval in a direction substantially orthogonal to a direction in which the first straight portion extends. Heat dissipation device.   The second straight portions of the plurality of heat pipes are arranged at a first predetermined interval in a direction substantially parallel to the second main surface and substantially perpendicular to a direction in which the first straight portion extends. The heat dissipating device according to claim 2, wherein   The said accommodating part is formed between each said heat pipe in the opposite side to the side from which the said connection part protrudes, The Claim 1 characterized by the above-mentioned. Heat dissipation device.   The said accommodating part is formed between each said heat pipes in the same side as the side from which the said connection part protrudes, The thermal radiation apparatus as described in any one of Claims 1-3 characterized by the above-mentioned. .   6. The fan according to claim 1, further comprising a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially perpendicular to the second main surface. The heat radiating device according to the item.   When viewed from the direction in which the first straight portion extends, the position of the second straight portion of each heat pipe is different in a direction substantially perpendicular to the second main surface and a direction substantially parallel to the second main surface. The heat radiating device according to claim 2.   The heat radiating device according to claim 7, further comprising a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially parallel to the second main surface. The first linear portion is inclined with respect to the second main surface;
The connecting portion protrudes in a direction away from the second main surface;
The heat radiating device according to claim 2, wherein the housing portion is formed on a side opposite to a side from which the connection portion protrudes.   The second straight portions of the plurality of heat pipes are arranged at a second predetermined interval longer than the first predetermined interval in a direction substantially orthogonal to a direction in which the first straight portion extends. The heat dissipating device according to claim 9. The support member has at least one set of substantially parallel opposite sides,
11. The heat dissipation device according to claim 1, wherein the first straight portion extends along the opposite side of the support member. The support member has at least one set of substantially parallel opposite sides,
The heat radiating device according to claim 1, wherein the first straight portion extends at an angle with respect to the opposite side of the support member.   The heat radiating device according to claim 12, wherein the housing portion is formed on a side opposite to a side from which the connection portion protrudes.   14. The heat dissipation according to claim 12, further comprising a fan that is disposed in a space facing the second main surface and generates an airflow in a direction substantially perpendicular to the second main surface. apparatus.   The heat radiating device according to any one of claims 1 to 14, wherein the second straight portion is substantially parallel to the second main surface. The support member has a groove portion having a shape corresponding to the first straight portion on the second main surface side,
The heat radiating device according to any one of claims 1 to 15, wherein the first straight portion is disposed so as to be fitted into the groove portion. The support member has a groove portion having a shape corresponding to the first linear portion on the first main surface side,
The heat radiating device according to any one of claims 1 to 15, wherein the first straight portion is disposed so as to be fitted into the groove portion. A heat dissipation device according to any one of claims 1 to 17,
A substrate disposed so as to be in close contact with the first main surface;
On the surface of the substrate, a plurality of LED elements arranged substantially parallel to the first straight portion of the heat pipe,
A light irradiation apparatus comprising: The plurality of LED elements are arranged at a predetermined pitch in a direction in which the first linear portion extends,
19. The light irradiation according to claim 18, wherein a distance from the other end of the first linear portion to one end of the support member is equal to or less than ½ of the pitch in a direction in which the first linear portion extends. apparatus.   The light irradiation apparatus according to claim 18 or 19, wherein the plurality of LED elements are arranged in a plurality of rows in a direction substantially orthogonal to a direction in which the first straight line portion extends.   21. The light irradiation apparatus according to claim 18, wherein the plurality of LED elements are arranged at positions facing the first linear portion with the substrate interposed therebetween.   The light irradiation device according to any one of claims 18 to 21, wherein the light irradiation device includes a plurality of the heat dissipation devices connected so that the first main surface is continuous.   The light irradiation device according to claim 22, wherein the plurality of heat dissipation devices are arranged and connected in a direction in which the first straight line portion extends.   The said LED element emits the light of the wavelength which acts on ultraviolet curable resin, The light irradiation apparatus as described in any one of Claims 18-23 characterized by the above-mentioned.

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