JP2009117496A5 - - Google Patents
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- Publication number
- JP2009117496A5 JP2009117496A5 JP2007286840A JP2007286840A JP2009117496A5 JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5 JP 2007286840 A JP2007286840 A JP 2007286840A JP 2007286840 A JP2007286840 A JP 2007286840A JP 2009117496 A5 JP2009117496 A5 JP 2009117496A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor wiring
- mounting structure
- manufacturing
- protruding electrode
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 25
- 239000000463 material Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 5
- 239000002923 metal particle Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007286840A JP4979542B2 (ja) | 2007-11-05 | 2007-11-05 | 実装構造体およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007286840A JP4979542B2 (ja) | 2007-11-05 | 2007-11-05 | 実装構造体およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009117496A JP2009117496A (ja) | 2009-05-28 |
| JP2009117496A5 true JP2009117496A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2010-09-24 |
| JP4979542B2 JP4979542B2 (ja) | 2012-07-18 |
Family
ID=40784316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007286840A Expired - Fee Related JP4979542B2 (ja) | 2007-11-05 | 2007-11-05 | 実装構造体およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4979542B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6076114B2 (ja) * | 2013-02-08 | 2017-02-08 | オリンパス株式会社 | 半導体装置、固体撮像装置、および半導体装置の製造方法 |
| JP2018197830A (ja) | 2017-05-25 | 2018-12-13 | スタンレー電気株式会社 | 発光機能を備えた透明パネル |
| JP7223946B2 (ja) * | 2019-03-15 | 2023-02-17 | パナソニックＩｐマネジメント株式会社 | 電子機器およびその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5234049U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1975-09-01 | 1977-03-10 | ||
| JPS5714470U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1980-06-30 | 1982-01-25 | ||
| JPH06209151A (ja) * | 1993-01-12 | 1994-07-26 | Sumitomo Bakelite Co Ltd | 印刷配線板の製造方法 |
| JP2001203229A (ja) * | 2000-01-18 | 2001-07-27 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| US6909180B2 (en) * | 2000-05-12 | 2005-06-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same |
| JP2005051204A (ja) * | 2003-07-16 | 2005-02-24 | Matsushita Electric Ind Co Ltd | 電気部品実装モジュールおよびその製造方法 |
| KR101120991B1 (ko) * | 2004-09-24 | 2012-03-13 | 니혼 유니버서티 | 세라믹 전자부품의 제조방법 |
| JP4510649B2 (ja) * | 2005-01-20 | 2010-07-28 | パナソニック株式会社 | 配線基板、多層基板および電子部品実装体の製造方法 |
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2007
- 2007-11-05 JP JP2007286840A patent/JP4979542B2/ja not_active Expired - Fee Related