JP2009108389A5 - - Google Patents

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Publication number
JP2009108389A5
JP2009108389A5 JP2007284016A JP2007284016A JP2009108389A5 JP 2009108389 A5 JP2009108389 A5 JP 2009108389A5 JP 2007284016 A JP2007284016 A JP 2007284016A JP 2007284016 A JP2007284016 A JP 2007284016A JP 2009108389 A5 JP2009108389 A5 JP 2009108389A5
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JP
Japan
Prior art keywords
thickness
plating layer
alloy
seconds
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007284016A
Other languages
English (en)
Japanese (ja)
Other versions
JP5319101B2 (ja
JP2009108389A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007284016A external-priority patent/JP5319101B2/ja
Priority to JP2007284016A priority Critical patent/JP5319101B2/ja
Priority to EP08845628.0A priority patent/EP2216426B1/en
Priority to US12/740,784 priority patent/US20100266863A1/en
Priority to PCT/JP2008/069787 priority patent/WO2009057707A1/ja
Priority to KR1020107011814A priority patent/KR101203438B1/ko
Priority to CN2008801139419A priority patent/CN101842523B/zh
Priority to TW097141946A priority patent/TW200925319A/zh
Publication of JP2009108389A publication Critical patent/JP2009108389A/ja
Publication of JP2009108389A5 publication Critical patent/JP2009108389A5/ja
Publication of JP5319101B2 publication Critical patent/JP5319101B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007284016A 2007-10-31 2007-10-31 電子部品用Ｓｎめっき材 Active JP5319101B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007284016A JP5319101B2 (ja) 2007-10-31 2007-10-31 電子部品用Ｓｎめっき材
KR1020107011814A KR101203438B1 (ko) 2007-10-31 2008-10-30 전자 부품용 Ｓｎ 도금재
US12/740,784 US20100266863A1 (en) 2007-10-31 2008-10-30 Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS
PCT/JP2008/069787 WO2009057707A1 (ja) 2007-10-31 2008-10-30 電子部品用Ｓｎめっき材
EP08845628.0A EP2216426B1 (en) 2007-10-31 2008-10-30 Tin-plated material for electronic part
CN2008801139419A CN101842523B (zh) 2007-10-31 2008-10-30 电子部件用镀Sn材料
TW097141946A TW200925319A (en) 2007-10-31 2008-10-31 Tin-plated material for electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007284016A JP5319101B2 (ja) 2007-10-31 2007-10-31 電子部品用Ｓｎめっき材

Publications (3)

Publication Number Publication Date
JP2009108389A JP2009108389A (ja) 2009-05-21
JP2009108389A5 true JP2009108389A5 (https=) 2010-06-17
JP5319101B2 JP5319101B2 (ja) 2013-10-16

Family

ID=40591091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007284016A Active JP5319101B2 (ja) 2007-10-31 2007-10-31 電子部品用Ｓｎめっき材

Country Status (7)

Country Link
US (1) US20100266863A1 (https=)
EP (1) EP2216426B1 (https=)
JP (1) JP5319101B2 (https=)
KR (1) KR101203438B1 (https=)
CN (1) CN101842523B (https=)
TW (1) TW200925319A (https=)
WO (1) WO2009057707A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384382B2 (ja) * 2009-03-26 2014-01-08 株式会社神戸製鋼所 耐熱性に優れるＳｎめっき付き銅又は銅合金及びその製造方法
WO2010119489A1 (ja) * 2009-04-14 2010-10-21 三菱伸銅株式会社 導電部材及びその製造方法
JP5442385B2 (ja) * 2009-10-07 2014-03-12 三菱伸銅株式会社 導電部材及びその製造方法
JP5621570B2 (ja) * 2010-03-30 2014-11-12 三菱マテリアル株式会社 Ｓｎめっき付き導電材及びその製造方法
US20130004793A1 (en) * 2011-03-23 2013-01-03 Hiroshi Kuwagaki Copper alloy for electronic material and method of manufacture for same
EP2620275B1 (en) * 2012-01-26 2019-10-02 Mitsubishi Materials Corporation Tin-plated copper-alloy material for terminal and method for producing the same
JP5587935B2 (ja) * 2012-03-30 2014-09-10 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき材
JP5522300B1 (ja) * 2012-07-02 2014-06-18 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材及びその製造方法
TW201413068A (zh) * 2012-07-02 2014-04-01 Mitsubishi Materials Corp 插拔性優良之鍍錫銅合金端子材料及其製造方法
JP6221695B2 (ja) * 2013-03-25 2017-11-01 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
US9748683B2 (en) * 2013-03-29 2017-08-29 Kobe Steel, Ltd. Electroconductive material superior in resistance to fretting corrosion for connection component
US10351965B2 (en) * 2013-06-24 2019-07-16 Oriental Electro Plating Corporation Method for producing plated material, and plated material
EP4636138A3 (en) * 2014-05-30 2026-03-25 The Furukawa Electric Co., Ltd. Electrical contact material, method of producing an electrical contact material, and terminal
KR102052879B1 (ko) * 2014-08-25 2019-12-06 가부시키가이샤 고베 세이코쇼 내미세접동마모성이 우수한 접속 부품용 도전 재료
CN104862749A (zh) * 2015-05-13 2015-08-26 南京化工职业技术学院 耐高温电镀亮锡、电镀雾锡工艺方法
JP6601276B2 (ja) * 2016-03-08 2019-11-06 株式会社オートネットワーク技術研究所 電気接点およびコネクタ端子対
JP6423025B2 (ja) * 2017-01-17 2018-11-14 三菱伸銅株式会社 挿抜性に優れた錫めっき付銅端子材及びその製造方法
EP3660190A4 (en) * 2017-07-28 2021-04-28 Mitsubishi Materials Corporation TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND CONDUCTIVE WIRE END STRUCTURE
JP7187162B2 (ja) * 2018-03-30 2022-12-12 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
CN111009759B (zh) * 2019-12-23 2021-08-20 苏州威贝斯特电子科技有限公司 一种端子组合物及其插座连接器用制品
CN113106505A (zh) * 2020-01-13 2021-07-13 深圳市业展电子有限公司 一种提高电阻体高温防氧化性能的表面处理工艺及其电阻体
CN111261317B (zh) * 2020-04-09 2021-08-31 江东合金技术有限公司 一种特种电缆用高性能抗氧化铜导体材料的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196349A (ja) * 1992-12-24 1994-07-15 Kobe Steel Ltd タンタルコンデンサ用銅系リードフレーム材及びその製造方法
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
JP4514012B2 (ja) * 2001-01-19 2010-07-28 古河電気工業株式会社 めっき材料とその製造方法、それを用いた電気・電子部品
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
WO2002057511A1 (en) * 2001-01-19 2002-07-25 The Furukawa Electric Co., Ltd. Metal-plated material and method for preparation thereof, and electric and electronic parts using the same
EP1281789B1 (en) * 2001-07-31 2006-05-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) A plated copper alloy material and process for production thereof
JP3880877B2 (ja) * 2002-03-29 2007-02-14 Ｄｏｗａホールディングス株式会社 めっきを施した銅または銅合金およびその製造方法
JP2005344188A (ja) * 2004-06-04 2005-12-15 Furukawa Electric Co Ltd:The めっき材料の製造方法、そのめっき材料を用いた電気・電子部品
WO2007078655A2 (en) * 2005-12-30 2007-07-12 Arkema Inc. High speed tin plating process
JP4653133B2 (ja) * 2006-03-17 2011-03-16 古河電気工業株式会社 めっき材料および前記めっき材料が用いられた電気電子部品

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