JP2009099550A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009099550A5 JP2009099550A5 JP2008240328A JP2008240328A JP2009099550A5 JP 2009099550 A5 JP2009099550 A5 JP 2009099550A5 JP 2008240328 A JP2008240328 A JP 2008240328A JP 2008240328 A JP2008240328 A JP 2008240328A JP 2009099550 A5 JP2009099550 A5 JP 2009099550A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- nickel
- underlayer
- composite material
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 107
- 229910052709 silver Inorganic materials 0.000 claims description 107
- 239000004332 silver Substances 0.000 claims description 107
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 98
- 239000002131 composite material Substances 0.000 claims description 74
- 238000004519 manufacturing process Methods 0.000 claims description 72
- 238000007747 plating Methods 0.000 claims description 54
- 229910052759 nickel Inorganic materials 0.000 claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 31
- 239000010935 stainless steel Substances 0.000 claims description 25
- 229910001220 stainless steel Inorganic materials 0.000 claims description 25
- 239000008151 electrolyte solution Substances 0.000 claims description 23
- 238000005868 electrolysis reaction Methods 0.000 claims description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 16
- 239000010941 cobalt Substances 0.000 claims description 16
- 229910052803 cobalt Inorganic materials 0.000 claims description 16
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000003929 acidic solution Substances 0.000 claims description 14
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 13
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims description 13
- 229910001453 nickel ion Inorganic materials 0.000 claims description 13
- 230000004913 activation Effects 0.000 claims description 12
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 11
- LFAGQMCIGQNPJG-UHFFFAOYSA-N Silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims description 10
- 229940098221 silver cyanide Drugs 0.000 claims description 10
- 229910000531 Co alloy Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- HKSGQTYSSZOJOA-UHFFFAOYSA-N Potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- NNFCIKHAZHQZJG-UHFFFAOYSA-N Potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 6
- 238000001994 activation Methods 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- WBTCZEPSIIFINA-UHFFFAOYSA-J Antimony potassium tartrate Chemical compound O.O.O.[K+].[K+].O1C(=O)C2O[Sb-]1(OC1=O)OC1C(C(=O)O1)O[Sb-]31OC(=O)C2O3 WBTCZEPSIIFINA-UHFFFAOYSA-J 0.000 claims description 4
- DOBRDRYODQBAMW-UHFFFAOYSA-N Copper(I) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims description 4
- GTLDTDOJJJZVBW-UHFFFAOYSA-N Zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 4
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 174
- VEXZGXHMUGYJMC-UHFFFAOYSA-N HCl Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 18
- 230000001629 suppression Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- -1 nickel-cobalt Chemical compound 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L Nickel(II) chloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 3
- 230000003213 activating Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L Copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 210000004940 Nucleus Anatomy 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L Cobalt(II) chloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 208000001285 Stress Fractures Diseases 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- GFHNAMRJFCEERV-UHFFFAOYSA-L cobalt chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Co+2] GFHNAMRJFCEERV-UHFFFAOYSA-L 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000001184 potassium carbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Chemical group 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008240328A JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
| US12/680,350 US20100233506A1 (en) | 2007-09-26 | 2008-09-25 | Silver-coated composite material for movable contact and method for manufacturing the same |
| KR1020107008883A KR101501309B1 (ko) | 2007-09-26 | 2008-09-25 | 가동 접점용 은 피복 복합 재료 및 그의 제조 방법 |
| EP08833392A EP2200056A1 (en) | 2007-09-26 | 2008-09-25 | Silver-clad composite material for movable contacts and process for production thereof |
| CN200880108602A CN101809695A (zh) | 2007-09-26 | 2008-09-25 | 可动触点用银包覆复合材料及其制造方法 |
| PCT/JP2008/067275 WO2009041481A1 (ja) | 2007-09-26 | 2008-09-25 | 可動接点用銀被覆複合材料およびその製造方法 |
| TW097137275A TWI428480B (zh) | 2007-09-26 | 2008-09-26 | 可動接點用銀覆蓋複合材料及其製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007250204 | 2007-09-26 | ||
| JP2008240328A JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009099550A JP2009099550A (ja) | 2009-05-07 |
| JP2009099550A5 true JP2009099550A5 (zh) | 2011-01-13 |
Family
ID=40702338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008240328A Pending JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009099550A (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102667989B (zh) | 2010-02-12 | 2016-05-04 | 古河电气工业株式会社 | 可动接点部件用银包覆复合材料、其制造方法以及可动接点部件 |
| DE102011078546A1 (de) * | 2011-07-01 | 2013-01-03 | Tyco Electronics Amp Gmbh | Elektrische Kontaktbeschichtung |
| JP5749113B2 (ja) * | 2011-08-05 | 2015-07-15 | 古河電気工業株式会社 | 可動接点部品用被覆複合材および可動接点部品、スイッチならびにその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6123789A (ja) * | 1984-07-09 | 1986-02-01 | Furukawa Electric Co Ltd:The | ステンレス鋼の貴金属メツキ方法 |
| JP4279285B2 (ja) * | 2005-11-17 | 2009-06-17 | 古河電気工業株式会社 | 可動接点用銀被覆ステンレス条およびその製造方法 |
| WO2007119522A1 (ja) * | 2006-03-28 | 2007-10-25 | The Furukawa Electric Co., Ltd. | 可動接点用銀被覆複合材料およびその製造方法 |
-
2008
- 2008-09-19 JP JP2008240328A patent/JP2009099550A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI428480B (zh) | 可動接點用銀覆蓋複合材料及其製造方法 | |
| JP4728571B2 (ja) | 可動接点用銀被覆ステンレス条の製造方法 | |
| JP5705738B2 (ja) | 可動接点部品用銀被覆複合材料とその製造方法および可動接点部品 | |
| JP4279285B2 (ja) | 可動接点用銀被覆ステンレス条およびその製造方法 | |
| US20100163276A1 (en) | Silver-coated material for movable contact component and method for manufacturing such silver-coated material | |
| KR20090127405A (ko) | 가동 접점 부품용 은피복재 및 그 제조 방법 | |
| JP6247926B2 (ja) | 可動接点部品用材料およびその製造方法 | |
| JP2010146926A (ja) | 可動接点部品用銀被覆材およびその製造方法 | |
| JP2009099548A (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP2007291510A (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| WO2007119522A1 (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP2009099550A5 (zh) | ||
| JP2009099550A (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP2012049041A (ja) | 可動接点部品用銀被覆材およびその製造方法 | |
| JP4558823B2 (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP2007291509A (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP6532323B2 (ja) | 銀めっき材およびその製造方法 | |
| JP5391214B2 (ja) | 可動接点用銀被覆ステンレス条及びこれを用いたスイッチ | |
| JP5598851B2 (ja) | 可動接点部品用銀被覆複合材料およびその製造方法および可動接点部品 | |
| WO2023234015A1 (ja) | 電気接点用表面被覆材料、ならびにそれを用いた電気接点、スイッチおよびコネクタ端子 | |
| JP2009099549A5 (zh) | ||
| WO2007116717A1 (ja) | 可動接点用銀被覆複合材料およびその製造方法 | |
| JP2009084590A (ja) | 金属めっきステンレス鋼板材の製造方法 |