JP2009099550A5 - - Google Patents
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- JP2009099550A5 JP2009099550A5 JP2008240328A JP2008240328A JP2009099550A5 JP 2009099550 A5 JP2009099550 A5 JP 2009099550A5 JP 2008240328 A JP2008240328 A JP 2008240328A JP 2008240328 A JP2008240328 A JP 2008240328A JP 2009099550 A5 JP2009099550 A5 JP 2009099550A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- nickel
- underlayer
- composite material
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 107
- 229910052709 silver Inorganic materials 0.000 claims description 107
- 239000004332 silver Substances 0.000 claims description 107
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 98
- 239000002131 composite material Substances 0.000 claims description 74
- 238000004519 manufacturing process Methods 0.000 claims description 72
- 238000007747 plating Methods 0.000 claims description 54
- 229910052759 nickel Inorganic materials 0.000 claims description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 31
- 239000010935 stainless steel Substances 0.000 claims description 25
- 229910001220 stainless steel Inorganic materials 0.000 claims description 25
- 239000008151 electrolyte solution Substances 0.000 claims description 23
- 238000005868 electrolysis reaction Methods 0.000 claims description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 16
- 239000010941 cobalt Substances 0.000 claims description 16
- 229910052803 cobalt Inorganic materials 0.000 claims description 16
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 14
- 239000003929 acidic solution Substances 0.000 claims description 14
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 13
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims description 13
- 229910001453 nickel ion Inorganic materials 0.000 claims description 13
- 230000004913 activation Effects 0.000 claims description 12
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 11
- LFAGQMCIGQNPJG-UHFFFAOYSA-N Silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 claims description 10
- 229940098221 silver cyanide Drugs 0.000 claims description 10
- 229910000531 Co alloy Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- HKSGQTYSSZOJOA-UHFFFAOYSA-N Potassium argentocyanide Chemical compound [K+].[Ag+].N#[C-].N#[C-] HKSGQTYSSZOJOA-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- NNFCIKHAZHQZJG-UHFFFAOYSA-N Potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 6
- 238000001994 activation Methods 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 5
- WBTCZEPSIIFINA-UHFFFAOYSA-J Antimony potassium tartrate Chemical compound O.O.O.[K+].[K+].O1C(=O)C2O[Sb-]1(OC1=O)OC1C(C(=O)O1)O[Sb-]31OC(=O)C2O3 WBTCZEPSIIFINA-UHFFFAOYSA-J 0.000 claims description 4
- DOBRDRYODQBAMW-UHFFFAOYSA-N Copper(I) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 claims description 4
- GTLDTDOJJJZVBW-UHFFFAOYSA-N Zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 4
- IOUCSUBTZWXKTA-UHFFFAOYSA-N dipotassium;dioxido(oxo)tin Chemical compound [K+].[K+].[O-][Sn]([O-])=O IOUCSUBTZWXKTA-UHFFFAOYSA-N 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 174
- VEXZGXHMUGYJMC-UHFFFAOYSA-N HCl Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 18
- 230000001629 suppression Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000009713 electroplating Methods 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- -1 nickel-cobalt Chemical compound 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L Nickel(II) chloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 3
- 230000003213 activating Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L Copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 210000004940 Nucleus Anatomy 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L Cobalt(II) chloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 208000001285 Stress Fractures Diseases 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- GFHNAMRJFCEERV-UHFFFAOYSA-L cobalt chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Co+2] GFHNAMRJFCEERV-UHFFFAOYSA-L 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000001184 potassium carbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Chemical group 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008240328A JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
| CN200880108602A CN101809695A (zh) | 2007-09-26 | 2008-09-25 | 可动触点用银包覆复合材料及其制造方法 |
| EP08833392A EP2200056A1 (en) | 2007-09-26 | 2008-09-25 | Silver-clad composite material for movable contacts and process for production thereof |
| US12/680,350 US20100233506A1 (en) | 2007-09-26 | 2008-09-25 | Silver-coated composite material for movable contact and method for manufacturing the same |
| PCT/JP2008/067275 WO2009041481A1 (ja) | 2007-09-26 | 2008-09-25 | 可動接点用銀被覆複合材料およびその製造方法 |
| KR1020107008883A KR101501309B1 (ko) | 2007-09-26 | 2008-09-25 | 가동 접점용 은 피복 복합 재료 및 그의 제조 방법 |
| TW097137275A TWI428480B (zh) | 2007-09-26 | 2008-09-26 | 可動接點用銀覆蓋複合材料及其製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007250204 | 2007-09-26 | ||
| JP2008240328A JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009099550A JP2009099550A (ja) | 2009-05-07 |
| JP2009099550A5 true JP2009099550A5 (zh) | 2011-01-13 |
Family
ID=40702338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008240328A Pending JP2009099550A (ja) | 2007-09-26 | 2008-09-19 | 可動接点用銀被覆複合材料およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009099550A (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102667989B (zh) | 2010-02-12 | 2016-05-04 | 古河电气工业株式会社 | 可动接点部件用银包覆复合材料、其制造方法以及可动接点部件 |
| DE102011078546A1 (de) * | 2011-07-01 | 2013-01-03 | Tyco Electronics Amp Gmbh | Elektrische Kontaktbeschichtung |
| JP5749113B2 (ja) * | 2011-08-05 | 2015-07-15 | 古河電気工業株式会社 | 可動接点部品用被覆複合材および可動接点部品、スイッチならびにその製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6123789A (ja) * | 1984-07-09 | 1986-02-01 | Furukawa Electric Co Ltd:The | ステンレス鋼の貴金属メツキ方法 |
| JP4279285B2 (ja) * | 2005-11-17 | 2009-06-17 | 古河電気工業株式会社 | 可動接点用銀被覆ステンレス条およびその製造方法 |
| WO2007119522A1 (ja) * | 2006-03-28 | 2007-10-25 | The Furukawa Electric Co., Ltd. | 可動接点用銀被覆複合材料およびその製造方法 |
-
2008
- 2008-09-19 JP JP2008240328A patent/JP2009099550A/ja active Pending
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