JP2009071186A - Ｌｅｄユニット - Google Patents

Ｌｅｄユニット Download PDF

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Publication number
JP2009071186A
JP2009071186A JP2007240000A JP2007240000A JP2009071186A JP 2009071186 A JP2009071186 A JP 2009071186A JP 2007240000 A JP2007240000 A JP 2007240000A JP 2007240000 A JP2007240000 A JP 2007240000A JP 2009071186 A JP2009071186 A JP 2009071186A
Authority
JP
Japan
Prior art keywords
led package
frame
led
lens
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007240000A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009071186A5 (enrdf_load_stackoverflow
Inventor
Takashi Sato
孝 佐藤
Masanori Ono
雅典 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2007240000A priority Critical patent/JP2009071186A/ja
Publication of JP2009071186A publication Critical patent/JP2009071186A/ja
Publication of JP2009071186A5 publication Critical patent/JP2009071186A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
JP2007240000A 2007-09-14 2007-09-14 Ｌｅｄユニット Pending JP2009071186A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007240000A JP2009071186A (ja) 2007-09-14 2007-09-14 Ｌｅｄユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007240000A JP2009071186A (ja) 2007-09-14 2007-09-14 Ｌｅｄユニット

Publications (2)

Publication Number Publication Date
JP2009071186A true JP2009071186A (ja) 2009-04-02
JP2009071186A5 JP2009071186A5 (enrdf_load_stackoverflow) 2010-10-07

Family

ID=40607102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007240000A Pending JP2009071186A (ja) 2007-09-14 2007-09-14 Ｌｅｄユニット

Country Status (1)

Country Link
JP (1) JP2009071186A (enrdf_load_stackoverflow)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011254008A (ja) * 2010-06-03 2011-12-15 Sharp Corp 表示装置および表示装置の製造方法
KR20120079105A (ko) * 2009-09-17 2012-07-11 필립스 루미리즈 라이팅 캄파니 엘엘씨 Ｌｅｄ 및 렌즈에 대한 2개의 개구를 가지는 하우징 본체를 구비한 ｌｅｄ 모듈
KR20130041571A (ko) * 2011-10-17 2013-04-25 서울반도체 주식회사 발광소자 및 이를 포함하는 발광모듈
CN103697440A (zh) * 2013-11-30 2014-04-02 南通环球光学仪器有限公司 一种led灯珠散热片
KR20140089804A (ko) * 2013-01-07 2014-07-16 엘지이노텍 주식회사 발광소자패키지
KR20150040591A (ko) * 2013-10-07 2015-04-15 엘지이노텍 주식회사 렌즈모듈 및 이를 포함하는 발광소자패키지
JP2015119163A (ja) * 2013-12-18 2015-06-25 コリア アトミック エナジー リサーチ インスティテュートＫｏｒｅａＡｔｏｍｉｃ Ｅｎｅｒｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ 半導体センサーを表面実装する実装基板およびその実装方法
KR20160093298A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 발광 모듈
JP2016534545A (ja) * 2013-10-07 2016-11-04 エルジー イノテック カンパニー リミテッド レンズモジュール及びそれを含む発光素子パッケージ
WO2017155282A1 (ko) * 2016-03-07 2017-09-14 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈
KR101855189B1 (ko) * 2016-03-07 2018-05-09 주식회사 세미콘라이트 반도체 발광소자
US10008648B2 (en) 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
US10209562B2 (en) 2012-05-23 2019-02-19 Funai Electric Co., Ltd. Display device
WO2024237082A1 (ja) * 2023-05-18 2024-11-21 スタンレー電気株式会社 防水型紫外線発光モジュール

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420004U (enrdf_load_stackoverflow) * 1990-06-11 1992-02-19
JPH07228002A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 光学記録ヘッド
JPH09274124A (ja) * 1996-04-08 1997-10-21 Alpine Electron Inc 光学素子の保持構造
JPH11163420A (ja) * 1997-11-28 1999-06-18 Optonix Kk Ｌｅｄランプ
JP2004111377A (ja) * 2002-07-16 2004-04-08 Ccs Inc 光照射装置
JP2005322680A (ja) * 2004-05-06 2005-11-17 Rohm Co Ltd 発光装置
JP2006331817A (ja) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd 発光装置及びそれを用いた照明器具
JP2007005378A (ja) * 2005-06-21 2007-01-11 Sharp Corp 発光装置、発光装置の製造方法および電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0420004U (enrdf_load_stackoverflow) * 1990-06-11 1992-02-19
JPH07228002A (ja) * 1994-02-18 1995-08-29 Rohm Co Ltd 光学記録ヘッド
JPH09274124A (ja) * 1996-04-08 1997-10-21 Alpine Electron Inc 光学素子の保持構造
JPH11163420A (ja) * 1997-11-28 1999-06-18 Optonix Kk Ｌｅｄランプ
JP2004111377A (ja) * 2002-07-16 2004-04-08 Ccs Inc 光照射装置
JP2005322680A (ja) * 2004-05-06 2005-11-17 Rohm Co Ltd 発光装置
JP2006331817A (ja) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd 発光装置及びそれを用いた照明器具
JP2007005378A (ja) * 2005-06-21 2007-01-11 Sharp Corp 発光装置、発光装置の製造方法および電子機器

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028328A (ja) * 2009-09-17 2017-02-02 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Ｌｅｄモジュールを製造する方法
KR20120079105A (ko) * 2009-09-17 2012-07-11 필립스 루미리즈 라이팅 캄파니 엘엘씨 Ｌｅｄ 및 렌즈에 대한 2개의 개구를 가지는 하우징 본체를 구비한 ｌｅｄ 모듈
KR101880767B1 (ko) * 2009-09-17 2018-07-20 루미리즈 홀딩 비.브이. Ｌｅｄ 및 렌즈에 대한 2개의 개구를 가지는 하우징 본체를 구비한 ｌｅｄ 모듈
US9755124B2 (en) 2009-09-17 2017-09-05 Koninklijke Philips N.V. LED module with high index lens
JP2011254008A (ja) * 2010-06-03 2011-12-15 Sharp Corp 表示装置および表示装置の製造方法
KR101786089B1 (ko) * 2011-04-29 2017-11-15 엘지이노텍 주식회사 자외선 발광 다이오드를 이용한 발광소자 패키지 및 발광 모듈
KR20130041571A (ko) * 2011-10-17 2013-04-25 서울반도체 주식회사 발광소자 및 이를 포함하는 발광모듈
KR101894041B1 (ko) * 2011-10-17 2018-09-04 서울반도체 주식회사 발광소자 및 이를 포함하는 발광모듈
US10209562B2 (en) 2012-05-23 2019-02-19 Funai Electric Co., Ltd. Display device
KR20140089804A (ko) * 2013-01-07 2014-07-16 엘지이노텍 주식회사 발광소자패키지
KR102075522B1 (ko) * 2013-01-07 2020-02-10 엘지이노텍 주식회사 발광소자패키지
JP2016534545A (ja) * 2013-10-07 2016-11-04 エルジー イノテック カンパニー リミテッド レンズモジュール及びそれを含む発光素子パッケージ
KR102024297B1 (ko) * 2013-10-07 2019-09-23 엘지이노텍 주식회사 렌즈모듈 및 이를 포함하는 발광소자패키지
KR20150040591A (ko) * 2013-10-07 2015-04-15 엘지이노텍 주식회사 렌즈모듈 및 이를 포함하는 발광소자패키지
US10107474B2 (en) 2013-10-07 2018-10-23 Lg Innotek Co., Ltd. Lens module and light emitting diode package including the same
CN103697440A (zh) * 2013-11-30 2014-04-02 南通环球光学仪器有限公司 一种led灯珠散热片
JP2015119163A (ja) * 2013-12-18 2015-06-25 コリア アトミック エナジー リサーチ インスティテュートＫｏｒｅａＡｔｏｍｉｃ Ｅｎｅｒｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ 半導体センサーを表面実装する実装基板およびその実装方法
KR20160093298A (ko) * 2015-01-29 2016-08-08 엘지이노텍 주식회사 발광 모듈
KR102220505B1 (ko) 2015-01-29 2021-02-25 엘지이노텍 주식회사 발광 모듈
US10008648B2 (en) 2015-10-08 2018-06-26 Semicon Light Co., Ltd. Semiconductor light emitting device
CN109196667A (zh) * 2016-03-07 2019-01-11 世迈克琉明有限公司 半导体发光元件及其制造方法
KR101855189B1 (ko) * 2016-03-07 2018-05-09 주식회사 세미콘라이트 반도체 발광소자
WO2017155282A1 (ko) * 2016-03-07 2017-09-14 주식회사 세미콘라이트 반도체 발광소자 및 이의 제조방법
US11038086B2 (en) 2016-03-07 2021-06-15 Semicon Light Co., Ltd. Semiconductor light-emitting element and manufacturing method therefor
WO2024237082A1 (ja) * 2023-05-18 2024-11-21 スタンレー電気株式会社 防水型紫外線発光モジュール

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