JP2009070722A - 絶縁膜形成用組成物および電子デバイス - Google Patents

絶縁膜形成用組成物および電子デバイス Download PDF

Info

Publication number
JP2009070722A
JP2009070722A JP2007239149A JP2007239149A JP2009070722A JP 2009070722 A JP2009070722 A JP 2009070722A JP 2007239149 A JP2007239149 A JP 2007239149A JP 2007239149 A JP2007239149 A JP 2007239149A JP 2009070722 A JP2009070722 A JP 2009070722A
Authority
JP
Japan
Prior art keywords
group
mol
insulating film
composition
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2007239149A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009070722A5 (enExample
Inventor
Haruki Inabe
陽樹 稲部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2007239149A priority Critical patent/JP2009070722A/ja
Priority to US12/209,480 priority patent/US7820748B2/en
Publication of JP2009070722A publication Critical patent/JP2009070722A/ja
Publication of JP2009070722A5 publication Critical patent/JP2009070722A5/ja
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
    • C08G2261/344—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing heteroatoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/40—Polymerisation processes
    • C08G2261/46—Diels-Alder reactions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/50—Physical properties
    • C08G2261/65—Electrical insulator
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/70—Post-treatment
    • C08G2261/80—Functional group cleavage, e.g. removal of side-chains or protective groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249958—Void-containing component is synthetic resin or natural rubbers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Organic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2007239149A 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス Abandoned JP2009070722A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007239149A JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス
US12/209,480 US7820748B2 (en) 2007-09-14 2008-09-12 Insulating film forming composition and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007239149A JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス

Publications (2)

Publication Number Publication Date
JP2009070722A true JP2009070722A (ja) 2009-04-02
JP2009070722A5 JP2009070722A5 (enExample) 2010-04-08

Family

ID=40455279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007239149A Abandoned JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス

Country Status (2)

Country Link
US (1) US7820748B2 (enExample)
JP (1) JP2009070722A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板
JP2021501250A (ja) * 2017-10-26 2021-01-14 サイド・タイムール・アフマド 疎水性、疎油性および親油性コーティングのための非ニュートン流体を含む組成物、およびその使用方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046038B2 (ja) * 2011-07-11 2016-12-14 株式会社トクヤマ フォトクロミック硬化性組成物
CN109792003B (zh) * 2016-12-22 2020-10-16 广州华睿光电材料有限公司 基于狄尔斯-阿尔德反应的可交联聚合物及其在有机电子器件中的应用
US11015082B2 (en) * 2017-12-19 2021-05-25 Honeywell International Inc. Crack-resistant polysiloxane dielectric planarizing compositions, methods and films

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187502A (ja) * 1987-01-28 1988-08-03 古河電気工業株式会社 自己潤滑性を有する絶縁電線
JPH04245110A (ja) * 1991-01-30 1992-09-01 Sumitomo Electric Ind Ltd 自己融着性絶縁電線及びそれを用いたコイル
JP2007211104A (ja) * 2006-02-08 2007-08-23 Fujifilm Corp 重合体の製造方法、重合体、膜形成用組成物、絶縁膜及び電子デバイス

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965679A (en) * 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
US6451437B1 (en) * 1999-10-13 2002-09-17 Chugoku Marine Paints, Ltd. Curable composition, coating composition, paint, antifouling paint, cured product thereof and method of rendering base material antifouling
US6465368B2 (en) * 2000-05-16 2002-10-15 Jsr Corporation Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film
EP1355963B1 (en) * 2000-12-19 2006-04-12 Bausch & Lomb Incorporated Polymeric biomaterials containing silsesquioxane monomers
US6632748B2 (en) * 2001-03-27 2003-10-14 Samsung Electronics Co., Ltd. Composition for preparing substances having nano-pores
US6936537B2 (en) * 2001-06-19 2005-08-30 The Boc Group, Inc. Methods for forming low-k dielectric films
JP2003176352A (ja) 2001-12-11 2003-06-24 Sumitomo Bakelite Co Ltd 絶縁膜用材料、絶縁膜用コーティングワニス及びこれらを用いた絶縁膜並びに半導体装置
US7012746B2 (en) * 2002-05-20 2006-03-14 Eastman Kodak Company Polyvinyl butyral films prepared by coating methods
KR100532915B1 (ko) * 2002-10-29 2005-12-02 삼성전자주식회사 단당류계 또는 올리고당류계 포로젠을 포함하는 다공성층간 절연막을 형성하기 위한 조성물
TW200413417A (en) * 2002-10-31 2004-08-01 Arch Spec Chem Inc Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof
KR100533538B1 (ko) * 2002-12-03 2005-12-05 삼성전자주식회사 새로운 기공형성물질을 포함하는 다공성 층간 절연막을형성하기 위한 조성물
US20040120915A1 (en) * 2002-12-19 2004-06-24 Kaiyuan Yang Multifunctional compositions for surface applications
JP4479160B2 (ja) * 2003-03-11 2010-06-09 チッソ株式会社 シルセスキオキサン誘導体を用いて得られる重合体
TWI278473B (en) * 2003-03-12 2007-04-11 Chisso Corp Polymer with the silsesquioxane skeleton in its main chain, method of forming the same, and coating film and membrane of preventing metal ion elution
US7135433B2 (en) * 2003-09-17 2006-11-14 Eastman Kodak Company Thermal print assembly
JP4878779B2 (ja) 2004-06-10 2012-02-15 富士フイルム株式会社 膜形成用組成物、絶縁膜及び電子デバイス
JP4516857B2 (ja) 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
TW200714636A (en) * 2005-09-05 2007-04-16 Fuji Photo Film Co Ltd Composition, film and producing method therefor
JP2007119706A (ja) 2005-09-28 2007-05-17 Fujifilm Corp 重合体および膜形成用組成物
US20070135603A1 (en) * 2005-12-09 2007-06-14 Fujifilm Corporation Film, film forming composition and electronic device having the film
US20070135585A1 (en) * 2005-12-09 2007-06-14 Fujifilm Corporation Film forming composition, insulating film using the composition, and electronic device having the insulating film
US7612155B2 (en) * 2006-04-26 2009-11-03 Fujifilm Corporation Film forming composition, insulating film formed by use of the composition, and electronic device
JP5018065B2 (ja) * 2006-12-15 2012-09-05 Ｊｎｃ株式会社 ポリシロキサン化合物とその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63187502A (ja) * 1987-01-28 1988-08-03 古河電気工業株式会社 自己潤滑性を有する絶縁電線
JPH04245110A (ja) * 1991-01-30 1992-09-01 Sumitomo Electric Ind Ltd 自己融着性絶縁電線及びそれを用いたコイル
JP2007211104A (ja) * 2006-02-08 2007-08-23 Fujifilm Corp 重合体の製造方法、重合体、膜形成用組成物、絶縁膜及び電子デバイス

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板
JP2021501250A (ja) * 2017-10-26 2021-01-14 サイド・タイムール・アフマド 疎水性、疎油性および親油性コーティングのための非ニュートン流体を含む組成物、およびその使用方法
US11149150B2 (en) 2017-10-26 2021-10-19 Actnano, Inc. Composition comprising non-newtonian fluids for hydrophobic, oleophobic, and oleophilic coatings, and methods of using the same
JP2022106729A (ja) * 2017-10-26 2022-07-20 サイド・タイムール・アフマド 疎水性、疎油性および親油性コーティングのための非ニュートン流体を含む組成物、およびその使用方法
JP7104161B2 (ja) 2017-10-26 2022-07-20 サイド・タイムール・アフマド 疎水性、疎油性および親油性コーティングのための非ニュートン流体を含む組成物、およびその使用方法
US11603473B2 (en) 2017-10-26 2023-03-14 Actnano, Inc. Electronic device comprising a conformal viscoelastic or non-Newtonian coating
US11603472B2 (en) 2017-10-26 2023-03-14 Actnano, Inc. Method of coating a printed circuit board with a viscoelastic or non-Newtonian coating

Also Published As

Publication number Publication date
US7820748B2 (en) 2010-10-26
US20090076204A1 (en) 2009-03-19

Similar Documents

Publication Publication Date Title
JP5401118B2 (ja) 組成物
JP2008231174A (ja) 膜形成用組成物、絶縁膜及び電子デバイス
US7820748B2 (en) Insulating film forming composition and electronic device
JP2008218632A (ja) 電子デバイス
US20070224436A1 (en) Film forming composition
US20080076889A1 (en) Film forming composition, film and insulating film formed from the composition, and electronic device having the insulating film
JP2009206447A (ja) 膜形成用組成物、絶縁膜、及び、電子デバイス
JP2007161784A (ja) 絶縁膜、化合物、膜形成用組成物及び電子デバイス
US7569649B2 (en) Film forming composition, insulating film, and electronic device
JP2009051971A (ja) 層間絶縁膜用組成物
JP5155541B2 (ja) 絶縁膜形成用組成物の製造方法、該製造方法により製造された絶縁膜形成用組成物、絶縁膜および電子デバイス
JP2009079195A (ja) 層間絶縁膜用組成物
JP2009227838A (ja) 膜形成用組成物、絶縁膜、及び、電子デバイス
JP2007161786A (ja) 重合体、膜形成用組成物、絶縁膜及び電子デバイス
JP2009046540A (ja) 膜形成用組成物、膜及び電子デバイス
JP2009046622A (ja) 膜形成用組成物、膜及び電子デバイス
JP2008192879A (ja) 半導体集積回路の絶縁膜
JP2010043176A (ja) 膜形成用組成物、絶縁膜、および電子デバイス
JP4792282B2 (ja) 重合体および膜形成用組成物
JP2008239690A (ja) 塗布型層間絶縁膜形成用組成物の製造方法、塗布型層間絶縁膜形成用組成物および電子デバイス
JP2007161778A (ja) 膜形成用組成物
JP2010083917A (ja) 膜形成用組成物、膜形成用組成物から得られた絶縁膜、および絶縁膜を有する電子デバイス
US20080161532A1 (en) Composition for forming low-dielectric-constant film, insulating film, and electronic device
JP2008085062A (ja) 膜形成用組成物、該組成物から形成された絶縁膜およびそれを有する電子デバイス
JP2008222742A (ja) 層間絶縁膜用組成物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100217

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100217

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20111216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120911

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20120914

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20121004

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20121029