JP2009070722A5 - - Google Patents

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Publication number
JP2009070722A5
JP2009070722A5 JP2007239149A JP2007239149A JP2009070722A5 JP 2009070722 A5 JP2009070722 A5 JP 2009070722A5 JP 2007239149 A JP2007239149 A JP 2007239149A JP 2007239149 A JP2007239149 A JP 2007239149A JP 2009070722 A5 JP2009070722 A5 JP 2009070722A5
Authority
JP
Japan
Prior art keywords
group
insulating film
mol
general formula
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2007239149A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009070722A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007239149A priority Critical patent/JP2009070722A/ja
Priority claimed from JP2007239149A external-priority patent/JP2009070722A/ja
Priority to US12/209,480 priority patent/US7820748B2/en
Publication of JP2009070722A publication Critical patent/JP2009070722A/ja
Publication of JP2009070722A5 publication Critical patent/JP2009070722A5/ja
Abandoned legal-status Critical Current

Links

JP2007239149A 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス Abandoned JP2009070722A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007239149A JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス
US12/209,480 US7820748B2 (en) 2007-09-14 2008-09-12 Insulating film forming composition and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007239149A JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス

Publications (2)

Publication Number Publication Date
JP2009070722A JP2009070722A (ja) 2009-04-02
JP2009070722A5 true JP2009070722A5 (enExample) 2010-04-08

Family

ID=40455279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007239149A Abandoned JP2009070722A (ja) 2007-09-14 2007-09-14 絶縁膜形成用組成物および電子デバイス

Country Status (2)

Country Link
US (1) US7820748B2 (enExample)
JP (1) JP2009070722A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6046038B2 (ja) * 2011-07-11 2016-12-14 株式会社トクヤマ フォトクロミック硬化性組成物
JP2014141626A (ja) * 2012-12-28 2014-08-07 Konica Minolta Inc 塗布液、反射膜、反射シート、太陽電池モジュール、led照明装置および実装用基板
CN109792003B (zh) * 2016-12-22 2020-10-16 广州华睿光电材料有限公司 基于狄尔斯-阿尔德反应的可交联聚合物及其在有机电子器件中的应用
KR102445179B1 (ko) 2017-10-26 2022-09-21 시예드 타이무르 아흐마드 소수성, 올레포빅 및 올레필릭 코팅용 비-뉴턴 유체를 포함하는 조성물, 및 그의 사용 방법
US11015082B2 (en) * 2017-12-19 2021-05-25 Honeywell International Inc. Crack-resistant polysiloxane dielectric planarizing compositions, methods and films

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JPH0810567B2 (ja) * 1987-01-28 1996-01-31 古河電気工業株式会社 自己潤滑性を有する絶縁電線
JP3151836B2 (ja) * 1991-01-30 2001-04-03 住友電気工業株式会社 自己融着性絶縁電線及びそれを用いたコイル
US5965679A (en) * 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
US6451437B1 (en) * 1999-10-13 2002-09-17 Chugoku Marine Paints, Ltd. Curable composition, coating composition, paint, antifouling paint, cured product thereof and method of rendering base material antifouling
US6465368B2 (en) * 2000-05-16 2002-10-15 Jsr Corporation Method of manufacturing insulating film-forming material, the insulating film-forming material, and insulating film
EP1355963B1 (en) * 2000-12-19 2006-04-12 Bausch & Lomb Incorporated Polymeric biomaterials containing silsesquioxane monomers
US6632748B2 (en) * 2001-03-27 2003-10-14 Samsung Electronics Co., Ltd. Composition for preparing substances having nano-pores
US6936537B2 (en) * 2001-06-19 2005-08-30 The Boc Group, Inc. Methods for forming low-k dielectric films
JP2003176352A (ja) 2001-12-11 2003-06-24 Sumitomo Bakelite Co Ltd 絶縁膜用材料、絶縁膜用コーティングワニス及びこれらを用いた絶縁膜並びに半導体装置
US7012746B2 (en) * 2002-05-20 2006-03-14 Eastman Kodak Company Polyvinyl butyral films prepared by coating methods
KR100532915B1 (ko) * 2002-10-29 2005-12-02 삼성전자주식회사 단당류계 또는 올리고당류계 포로젠을 포함하는 다공성층간 절연막을 형성하기 위한 조성물
TW200413417A (en) * 2002-10-31 2004-08-01 Arch Spec Chem Inc Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof
KR100533538B1 (ko) * 2002-12-03 2005-12-05 삼성전자주식회사 새로운 기공형성물질을 포함하는 다공성 층간 절연막을형성하기 위한 조성물
US20040120915A1 (en) * 2002-12-19 2004-06-24 Kaiyuan Yang Multifunctional compositions for surface applications
JP4479160B2 (ja) * 2003-03-11 2010-06-09 チッソ株式会社 シルセスキオキサン誘導体を用いて得られる重合体
TWI278473B (en) * 2003-03-12 2007-04-11 Chisso Corp Polymer with the silsesquioxane skeleton in its main chain, method of forming the same, and coating film and membrane of preventing metal ion elution
US7135433B2 (en) * 2003-09-17 2006-11-14 Eastman Kodak Company Thermal print assembly
JP4878779B2 (ja) 2004-06-10 2012-02-15 富士フイルム株式会社 膜形成用組成物、絶縁膜及び電子デバイス
JP4516857B2 (ja) 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
TW200714636A (en) * 2005-09-05 2007-04-16 Fuji Photo Film Co Ltd Composition, film and producing method therefor
JP2007119706A (ja) 2005-09-28 2007-05-17 Fujifilm Corp 重合体および膜形成用組成物
US20070135603A1 (en) * 2005-12-09 2007-06-14 Fujifilm Corporation Film, film forming composition and electronic device having the film
US20070135585A1 (en) * 2005-12-09 2007-06-14 Fujifilm Corporation Film forming composition, insulating film using the composition, and electronic device having the insulating film
JP2007211104A (ja) * 2006-02-08 2007-08-23 Fujifilm Corp 重合体の製造方法、重合体、膜形成用組成物、絶縁膜及び電子デバイス
US7612155B2 (en) * 2006-04-26 2009-11-03 Fujifilm Corporation Film forming composition, insulating film formed by use of the composition, and electronic device
JP5018065B2 (ja) * 2006-12-15 2012-09-05 Jnc株式会社 ポリシロキサン化合物とその製造方法

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