JP2009055198A5 - - Google Patents
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- Publication number
- JP2009055198A5 JP2009055198A5 JP2007218505A JP2007218505A JP2009055198A5 JP 2009055198 A5 JP2009055198 A5 JP 2009055198A5 JP 2007218505 A JP2007218505 A JP 2007218505A JP 2007218505 A JP2007218505 A JP 2007218505A JP 2009055198 A5 JP2009055198 A5 JP 2009055198A5
- Authority
- JP
- Japan
- Prior art keywords
- microphone device
- lid
- resin
- base portion
- sound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 239000010410 layer Substances 0.000 claims 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 5
- 239000012790 adhesive layer Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000004593 Epoxy Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 239000011521 glass Substances 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000011148 porous material Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 239000011368 organic material Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000004080 punching Methods 0.000 claims 1
- 230000010255 response to auditory stimulus Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007218505A JP2009055198A (ja) | 2007-08-24 | 2007-08-24 | マイクロホン装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007218505A JP2009055198A (ja) | 2007-08-24 | 2007-08-24 | マイクロホン装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009055198A JP2009055198A (ja) | 2009-03-12 |
| JP2009055198A5 true JP2009055198A5 (enExample) | 2010-10-07 |
Family
ID=40505884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007218505A Pending JP2009055198A (ja) | 2007-08-24 | 2007-08-24 | マイクロホン装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009055198A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012039272A (ja) * | 2010-08-05 | 2012-02-23 | Funai Electric Co Ltd | マイクロホンユニット |
| DE112010006098T5 (de) * | 2010-12-28 | 2014-03-20 | Knowles Electronics, Llc | Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip |
| US20120161258A1 (en) | 2010-12-28 | 2012-06-28 | Loeppert Peter V | Package with a cmos die positioned underneath a mems die |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| JP2022158433A (ja) * | 2021-04-02 | 2022-10-17 | ホシデン株式会社 | マイクロホンアセンブリ、ヘッドライニングアセンブリ |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4436946B2 (ja) * | 1999-06-25 | 2010-03-24 | イビデン株式会社 | 片面回路基板の製造方法、および多層プリント配線板の製造方法 |
| US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| JP3920657B2 (ja) * | 2002-02-21 | 2007-05-30 | シチズン時計株式会社 | 樹脂封止型半導体装置の製造方法 |
| JP2004048536A (ja) * | 2002-07-15 | 2004-02-12 | Matsushita Electric Ind Co Ltd | マイクロホン |
| JP2004328232A (ja) * | 2003-04-23 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン |
| JP4188325B2 (ja) * | 2005-02-09 | 2008-11-26 | ホシデン株式会社 | 防塵板内蔵マイクロホン |
| JP2007104467A (ja) * | 2005-10-06 | 2007-04-19 | Micro Precision Kk | 音響センサおよびその製造方法 |
| JP2007124449A (ja) * | 2005-10-31 | 2007-05-17 | Sanyo Electric Co Ltd | マイクロフォンおよびマイクロフォンモジュール |
-
2007
- 2007-08-24 JP JP2007218505A patent/JP2009055198A/ja active Pending
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