JP2009055198A5 - - Google Patents

Claims (31)

A base,
A housing part provided on the base part and forming a space part together with the base part,
A sound collection element that is disposed in the space and collects sound from outside and converts it into an electrical signal;
The housing includes a frame and a lid that covers an opening on the upper side of the frame,
The microphone device according to claim 1, wherein the lid is made of a porous member having a predetermined thickness.   The microphone device according to claim 1, wherein the porous member is made of a resin material.   The microphone device according to claim 1, wherein the porous member is formed of a film-like member. The sound collection element has a diaphragm that vibrates in response to sound pressure,
The microphone device according to claim 1, wherein the diaphragm is made of silicon. The lid and the base are arranged to face each other,
The microphone device according to claim 4, wherein the sound pickup element is fixed on the base portion so that the diaphragm and the lid are opposed to each other.   The microphone device according to claim 1, wherein the sound pickup element includes a spacer member made of an electrically insulating film.   The microphone device according to claim 6, wherein the electrical insulating film is a silicon oxide film.   The microphone device according to claim 1, wherein the base portion has a structure in which a plurality of glass epoxy substrates are stacked.   9. The microphone device according to claim 8, wherein each of the glass epoxy substrates is bonded to each other by an organic material-based adhesive layer.   The microphone device according to claim 1, wherein the base portion has a terminal portion electrically connected to the wiring layer on a lowermost surface thereof.   The microphone device according to claim 10, wherein the terminal portion is subjected to a surface treatment.   The microphone device according to claim 11, wherein the surface treatment is a nickel metal film formation treatment.   The sound collecting element and an amplifier that amplifies an electric signal converted by the sound collecting element are respectively fixed on the upper surface of the base portion with a die bond paste. The microphone device according to any one of 12.   The microphone device according to claim 13, wherein the die bond paste contains a crushed silica filler.   The microphone device according to claim 1, wherein the sound pickup element is fixed so that a semiconductor substrate thereof is on the base portion side.   The microphone device according to claim 13, wherein the amplifier is electrically connected to a wiring layer formed on an uppermost surface of the base portion via a bonding wire.   The microphone device according to claim 13 or 16, wherein the amplifier is sealed with a resin layer.   The microphone device according to claim 17, wherein the resin layer contains a spherical silica filler.   The terminal part of the said base part and the wiring layer formed in the uppermost surface of the said base part are electrically connected, The any one of Claims 1-18 characterized by the above-mentioned. Microphone device.   The frame is installed on the base so as to surround the sound collection element, and the lid is installed so as to close the entire opening on the upper side of the frame. The microphone device according to any one of claims 1 to 3.   The microphone device according to claim 1, wherein the frame body is made of a glass epoxy substrate.   The glass epoxy substrate has a structure in which a conductor layer is formed on a surface of an insulating base portion, and a metal film is formed on the surface of the conductor layer. Microphone device.   The microphone device according to claim 22, wherein the metal coating is made of nickel.   The microphone device according to any one of claims 1 to 23, wherein the frame body is fixed to the base portion by an adhesive layer.   The microphone device according to claim 24, wherein the adhesive layer is made of an organic material resin such as a semi-cured epoxy resin.   26. The microphone device according to claim 25, wherein the lid is bonded and fixed to the upper side of the frame by the same adhesive layer as the adhesive layer.   The microphone device according to any one of claims 1 to 26, wherein the lid is formed of a film-like porous member having a thickness of 30 µm to 100 µm.   The lid includes at least one of a resin sintered body, a resin punching sheet, a resin film provided with pores by a laser, and a resin film provided with pores by a foaming agent. The microphone device according to any one of claims 1 to 27, wherein the microphone device is characterized.   29. The microphone device according to any one of claims 1 to 28, wherein the lid body has a pore diameter of 5 [mu] m or less.   The microphone device according to claim 1, wherein the lid is constituted by a plate-like porous member having a thickness of 100 μm or more.   The microphone device according to claim 1, wherein the lid is made of a porous member made of metal.