JP2009052003A - 蛍光体粒子および波長変換器ならびに発光装置 - Google Patents
蛍光体粒子および波長変換器ならびに発光装置 Download PDFInfo
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- JP2009052003A JP2009052003A JP2007222978A JP2007222978A JP2009052003A JP 2009052003 A JP2009052003 A JP 2009052003A JP 2007222978 A JP2007222978 A JP 2007222978A JP 2007222978 A JP2007222978 A JP 2007222978A JP 2009052003 A JP2009052003 A JP 2009052003A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
【解決手段】 Euと、Mgと、Mnと、Siと、M1(M1は、Ba、SrおよびCaのうち少なくとも1種)とを含有する複合酸化物からなる蛍光体粒子31であって、EuおよびMnを含有するM1 3MgSi2O8からなるコア部33と、該コア部33の周囲にコア部33を取り囲むように形成され、EuおよびMnを含有するM1MgSiO4からなるシェル部35とを備えてなることを特徴とする。
【選択図】 図1
Description
13・・・電極
15・・・基板
17・・・発光素子
19・・・波長変換器
31・・・蛍光体粒子
33・・・コア部
35・・・シェル部
37a・・・直線上亀裂
37b・・・環状亀裂
Claims (4)
- Euと、Mgと、Mnと、Siと、M1(M1は、Ba、SrおよびCaのうち少なくとも1種)とを含有する複合酸化物からなる蛍光体粒子であって、EuおよびMnを含有するM1 3MgSi2O8からなるコア部と、該コア部の周囲に前記コア部を取り囲むように形成され、EuおよびMnを含有するM1MgSiO4からなるシェル部とを備えてなることを特徴とする蛍光体粒子。
- 前記コア部に亀裂が形成されていることを特徴とする請求項1記載の蛍光体粒子。
- 透明マトリクス中に蛍光体粒子が分散しており、該蛍光体粒子により光源から発せられる光の波長を変換して、波長が変換された光を含む出力光を出力する波長変換器であって、前記蛍光体粒子は、請求項1または2に記載の蛍光体粒子を含有することを特徴とする波長変換器。
- 励起光を発する化合物半導体からなる発光素子と、該発光素子と電気的に接続され、かつ外部と接続するための導体と、前記励起光の波長を変換する請求項3に記載の波長変換器とを基板に備えてなることを特徴とする発光装置。
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JP2007222978A JP5036454B2 (ja) | 2007-08-29 | 2007-08-29 | 蛍光体粒子および波長変換器ならびに発光装置 |
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JP2007222978A JP5036454B2 (ja) | 2007-08-29 | 2007-08-29 | 蛍光体粒子および波長変換器ならびに発光装置 |
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JP2009052003A true JP2009052003A (ja) | 2009-03-12 |
JP5036454B2 JP5036454B2 (ja) | 2012-09-26 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102585804A (zh) * | 2011-12-26 | 2012-07-18 | 天津理工大学 | 蓝紫光芯片激发的660纳米红光荧光材料及喷雾生产法 |
JP2013136697A (ja) * | 2011-12-28 | 2013-07-11 | Ube Material Industries Ltd | ケイ酸塩緑色発光蛍光体 |
JP2015140424A (ja) * | 2014-01-30 | 2015-08-03 | 信越化学工業株式会社 | 複フッ化物蛍光体の製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4938434B1 (ja) * | 1968-03-15 | 1974-10-17 | ||
JP2002509978A (ja) * | 1998-03-31 | 2002-04-02 | サーノフ コーポレイション | 長残光性赤蛍光体 |
JP2002314142A (ja) * | 2001-04-09 | 2002-10-25 | Toyoda Gosei Co Ltd | 発光装置 |
JP2003082342A (ja) * | 2001-09-12 | 2003-03-19 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
JP2006505659A (ja) * | 2002-11-05 | 2006-02-16 | ロディア エレクトロニクス アンド カタリシス | バリウムマグネシウムシリケートを添加剤として含む光変換材料 |
JP2006523245A (ja) * | 2003-03-28 | 2006-10-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 粒子または原材料上に被覆物を形成させる方法および属する製品 |
KR20070053984A (ko) * | 2005-11-22 | 2007-05-28 | 특허법인 맥 | 백색 발광 형광체와 그 제조방법 및 이를 이용한 백색발광소자 |
JP2007533149A (ja) * | 2004-04-16 | 2007-11-15 | ロディア・シミ | 白色発光ダイオード |
-
2007
- 2007-08-29 JP JP2007222978A patent/JP5036454B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4938434B1 (ja) * | 1968-03-15 | 1974-10-17 | ||
JP2002509978A (ja) * | 1998-03-31 | 2002-04-02 | サーノフ コーポレイション | 長残光性赤蛍光体 |
JP2002314142A (ja) * | 2001-04-09 | 2002-10-25 | Toyoda Gosei Co Ltd | 発光装置 |
JP2003082342A (ja) * | 2001-09-12 | 2003-03-19 | Matsushita Electric Ind Co Ltd | プラズマディスプレイ装置 |
JP2006505659A (ja) * | 2002-11-05 | 2006-02-16 | ロディア エレクトロニクス アンド カタリシス | バリウムマグネシウムシリケートを添加剤として含む光変換材料 |
JP2006523245A (ja) * | 2003-03-28 | 2006-10-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 粒子または原材料上に被覆物を形成させる方法および属する製品 |
JP2007533149A (ja) * | 2004-04-16 | 2007-11-15 | ロディア・シミ | 白色発光ダイオード |
KR20070053984A (ko) * | 2005-11-22 | 2007-05-28 | 특허법인 맥 | 백색 발광 형광체와 그 제조방법 및 이를 이용한 백색발광소자 |
Non-Patent Citations (3)
Title |
---|
APPLIED PHYSICS LETTERS, vol. 84, no. 15, JPN6012028322, 2004, pages 2931 - 2933, ISSN: 0002239546 * |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 115, no. 7, JPN6012028320, 1968, pages 733 - 738, ISSN: 0002239544 * |
第65回応用物理学会学術講演会 講演予稿集, JPN6012028321, 2004, pages 1284 - 2, ISSN: 0002239545 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102585804A (zh) * | 2011-12-26 | 2012-07-18 | 天津理工大学 | 蓝紫光芯片激发的660纳米红光荧光材料及喷雾生产法 |
JP2013136697A (ja) * | 2011-12-28 | 2013-07-11 | Ube Material Industries Ltd | ケイ酸塩緑色発光蛍光体 |
JP2015140424A (ja) * | 2014-01-30 | 2015-08-03 | 信越化学工業株式会社 | 複フッ化物蛍光体の製造方法 |
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