JP2009050944A - 基板の厚さ測定方法および基板の加工装置 - Google Patents

基板の厚さ測定方法および基板の加工装置 Download PDF

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Publication number
JP2009050944A
JP2009050944A JP2007218873A JP2007218873A JP2009050944A JP 2009050944 A JP2009050944 A JP 2009050944A JP 2007218873 A JP2007218873 A JP 2007218873A JP 2007218873 A JP2007218873 A JP 2007218873A JP 2009050944 A JP2009050944 A JP 2009050944A
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Prior art keywords
substrate
wafer
thickness
grinding
laser
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English (en)
Japanese (ja)
Inventor
Akinori Sasaki
彰法 佐々木
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2007218873A priority Critical patent/JP2009050944A/ja
Priority to CN 200810145611 priority patent/CN101372090B/zh
Publication of JP2009050944A publication Critical patent/JP2009050944A/ja
Pending legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2007218873A 2007-08-24 2007-08-24 基板の厚さ測定方法および基板の加工装置 Pending JP2009050944A (ja)

Priority Applications (2)

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JP2007218873A JP2009050944A (ja) 2007-08-24 2007-08-24 基板の厚さ測定方法および基板の加工装置
CN 200810145611 CN101372090B (zh) 2007-08-24 2008-08-05 基板的加工装置

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JP2007218873A JP2009050944A (ja) 2007-08-24 2007-08-24 基板の厚さ測定方法および基板の加工装置

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JP2009050944A true JP2009050944A (ja) 2009-03-12

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JP2007218873A Pending JP2009050944A (ja) 2007-08-24 2007-08-24 基板の厚さ測定方法および基板の加工装置

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JP (1) JP2009050944A (zh)
CN (1) CN101372090B (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012061578A (ja) * 2010-09-17 2012-03-29 Nagase Integrex Co Ltd 工作機械
CN102423870A (zh) * 2011-11-28 2012-04-25 浙江工业大学 微量研磨厚度测量装置
DE102015212289A1 (de) 2014-07-04 2016-01-07 Disco Corporation Schleifverfahren für plattenähnliches Werkstück
KR20160070704A (ko) * 2014-12-10 2016-06-20 가부시기가이샤 디스코 연삭 장치
US9561577B2 (en) 2011-10-26 2017-02-07 Ebara Corporation Polishing method and polishing apparatus
KR20170028833A (ko) * 2015-09-04 2017-03-14 가부시기가이샤 디스코 연삭 휠 및 피가공물의 연삭 방법
JP2017162868A (ja) * 2016-03-07 2017-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2018122368A (ja) * 2017-01-30 2018-08-09 株式会社東京精密 研削装置
KR101904062B1 (ko) * 2014-01-10 2018-10-04 가부시키가이샤 사무코 워크의 두께 측정 장치, 측정 방법, 및 워크의 연마 장치
JP2020032513A (ja) * 2018-08-31 2020-03-05 株式会社ディスコ 被加工物の研削装置及び研削方法
KR20230029819A (ko) 2020-06-30 2023-03-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템, 기판 처리 방법 및 기억 매체

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US7929129B2 (en) * 2009-05-22 2011-04-19 Corning Incorporated Inspection systems for glass sheets
CN102194727B (zh) * 2010-03-11 2013-09-04 中芯国际集成电路制造(上海)有限公司 一种改进的机器人伸缩臂
US9079283B2 (en) * 2010-05-18 2015-07-14 Marposs Societa′ per Azioni Method and apparatus for optically measuring by interferometry the thickness of an object
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
CN104549858B (zh) * 2013-10-29 2017-04-19 沈阳芯源微电子设备有限公司 一种用于化学液喷洒的摆臂装置及其喷洒方法
JP6374169B2 (ja) * 2014-01-23 2018-08-15 株式会社荏原製作所 研磨方法および研磨装置
CN104296902A (zh) * 2014-11-02 2015-01-21 苏州精创光学仪器有限公司 新型全自动玻璃表面应力仪
KR101889237B1 (ko) * 2015-09-15 2018-08-16 엔지케이 인슐레이터 엘티디 복합 기판 및 압전 기판의 두께 경향 추정 방법
JP6802012B2 (ja) * 2016-09-02 2020-12-16 株式会社ディスコ 計測装置
CN106839937B (zh) * 2017-01-23 2019-08-06 安徽三安光电有限公司 一种晶片厚度测量装置及其测量方法
JP6948868B2 (ja) 2017-07-24 2021-10-13 株式会社荏原製作所 研磨装置および研磨方法
JP6953242B2 (ja) * 2017-09-06 2021-10-27 株式会社ディスコ 高さ検出装置、及びレーザー加工装置
US11817337B2 (en) * 2018-08-23 2023-11-14 Tokyo Electron Limited Substrate processing system and substrate processing method
CN112212782B (zh) * 2019-06-25 2023-01-17 合肥欣奕华智能机器股份有限公司 一种玻璃基板检测方法、装置及系统
CN110757278B (zh) * 2019-10-23 2020-09-18 清华大学 一种晶圆厚度测量装置和磨削机台
CN115319563B (zh) * 2022-08-30 2024-01-19 上海积塔半导体有限公司 固定装置和芯片打磨方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH05157520A (ja) * 1991-12-09 1993-06-22 Fuji Photo Film Co Ltd 膨潤膜厚計
JPH07306018A (ja) * 1994-05-13 1995-11-21 Nippondenso Co Ltd 半導体厚非接触測定装置およびその測定方法
JP2002221406A (ja) * 2001-01-25 2002-08-09 Denso Corp ウエハ厚計測装置及びウエハ研磨方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157520A (ja) * 1991-12-09 1993-06-22 Fuji Photo Film Co Ltd 膨潤膜厚計
JPH07306018A (ja) * 1994-05-13 1995-11-21 Nippondenso Co Ltd 半導体厚非接触測定装置およびその測定方法
JP2002221406A (ja) * 2001-01-25 2002-08-09 Denso Corp ウエハ厚計測装置及びウエハ研磨方法

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012061578A (ja) * 2010-09-17 2012-03-29 Nagase Integrex Co Ltd 工作機械
US9842783B2 (en) 2011-10-26 2017-12-12 Ebara Corporation Polishing method and polishing apparatus
US9561577B2 (en) 2011-10-26 2017-02-07 Ebara Corporation Polishing method and polishing apparatus
CN102423870A (zh) * 2011-11-28 2012-04-25 浙江工业大学 微量研磨厚度测量装置
KR101904062B1 (ko) * 2014-01-10 2018-10-04 가부시키가이샤 사무코 워크의 두께 측정 장치, 측정 방법, 및 워크의 연마 장치
DE102015212289A1 (de) 2014-07-04 2016-01-07 Disco Corporation Schleifverfahren für plattenähnliches Werkstück
KR20160070704A (ko) * 2014-12-10 2016-06-20 가부시기가이샤 디스코 연삭 장치
JP2016107389A (ja) * 2014-12-10 2016-06-20 株式会社ディスコ 研削装置
CN105690199A (zh) * 2014-12-10 2016-06-22 株式会社迪思科 磨削装置
TWI674948B (zh) * 2014-12-10 2019-10-21 日商迪思科股份有限公司 磨削裝置
KR102319943B1 (ko) * 2014-12-10 2021-10-29 가부시기가이샤 디스코 연삭 장치
CN105690199B (zh) * 2014-12-10 2019-07-30 株式会社迪思科 磨削装置
KR20170028833A (ko) * 2015-09-04 2017-03-14 가부시기가이샤 디스코 연삭 휠 및 피가공물의 연삭 방법
KR102443360B1 (ko) * 2015-09-04 2022-09-14 가부시기가이샤 디스코 연삭 휠 및 피가공물의 연삭 방법
US9899275B2 (en) 2016-03-07 2018-02-20 Renesas Electronics Corporation Manufacturing method of semiconductor device
JP2017162868A (ja) * 2016-03-07 2017-09-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10507561B2 (en) 2017-01-30 2019-12-17 Tokyo Seimitsu Co., Ltd Grinding apparatus
JP2018122368A (ja) * 2017-01-30 2018-08-09 株式会社東京精密 研削装置
JP2020032513A (ja) * 2018-08-31 2020-03-05 株式会社ディスコ 被加工物の研削装置及び研削方法
JP7185446B2 (ja) 2018-08-31 2022-12-07 株式会社ディスコ 被加工物の研削装置及び研削方法
KR20230029819A (ko) 2020-06-30 2023-03-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템, 기판 처리 방법 및 기억 매체

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CN101372090A (zh) 2009-02-25
CN101372090B (zh) 2012-11-28

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